System and method for reducing contact resistance and improving barrier properties is provided. An embodiment includes a dielectric layer and contacts extending through the dielectric layer to connect to conductive regions. A contact barrier layer is formed between the conductive regions and the con
System and method for reducing contact resistance and improving barrier properties is provided. An embodiment includes a dielectric layer and contacts extending through the dielectric layer to connect to conductive regions. A contact barrier layer is formed between the conductive regions and the contacts by electroless plating the conductive regions after openings have been formed through the dielectric layer for the contact. The contact barrier layer is then treated to fill the grain boundary of the contact barrier layer, thereby improving the contact resistance. In another embodiment, the contact barrier layer is formed on the conductive regions by electroless plating prior to the formation of the dielectric layer.
대표청구항▼
1. A semiconductor device comprising: a first conductive layer;a dielectric layer over the first conductive layer;an opening through the dielectric layer to the first conductive layer, the opening comprising sidewalls and a bottom;a treated conductive material within the opening, the treated conduct
1. A semiconductor device comprising: a first conductive layer;a dielectric layer over the first conductive layer;an opening through the dielectric layer to the first conductive layer, the opening comprising sidewalls and a bottom;a treated conductive material within the opening, the treated conductive material located along the bottom of the opening and in physical contact with the first conductive layer; anda conductive material along the sidewalls of the opening and over the treated conductive material. 2. The semiconductor device of claim 1, wherein the treated conductive material comprises a material selected from the group consisting essentially of CoWGe, CoWSi, CoWGeN, or CoWSiN. 3. The semiconductor device of claim 1, wherein the treated conductive material comprises a material selected from the group consisting essentially of CoWPGe, CoWPSi, CoWGePN, CoWPSiN, or CoWPGeSiN. 4. The semiconductor device of claim 1, wherein the treated conductive material comprises a material selected from the group consisting essentially of CoWBGe, CoWBSi, CoWGeBN, CoWBSiN, or CoWBGeSiN. 5. The semiconductor device of claim 1, wherein the treated conductive material comprises silicon. 6. The semiconductor device of claim 1, wherein the treated conductive material comprises germanium. 7. The semiconductor device of claim 1, wherein the treated conductive material comprises nitrogen. 8. The semiconductor device of claim 1, wherein the first conductive layer further comprises a silicide region adjacent to the treated conductive material. 9. The semiconductor device of claim 1, wherein the first conductive layer is part of a substrate with source/drain regions located therein. 10. A semiconductor device comprising: a conductive region with a top surface;a first grain-filled conductive barrier layer over substantially an entire top surface of the conductive region;a dielectric layer over the first grain-filled conductive barrier layer; anda conductive material extending through the dielectric layer and in contact with the first grain-filled conductive barrier layer. 11. The semiconductor device of claim 10, wherein the first grain-filled conductive barrier layer comprises a material selected from the group consisting essentially of CoWGe, CoWSi, CoWGeN, or CoWSiN. 12. The semiconductor device of claim 10, wherein the first grain-filled conductive barrier layer comprises a material selected from the group consisting essentially of CoWPGe, CoWPSi, CoWGePN, CoWPSiN, or CoWPGeSiN. 13. The semiconductor device of claim 10, wherein the first grain-filled conductive barrier layer comprises a material selected from the group consisting essentially of CoWBGe, CoWBSi, CoWGeBN, CoWBSiN, or CoWBGeSiN. 14. The semiconductor device of claim 10 further comprising a transistor, wherein the transistor comprises: the conductive region;a gate dielectric adjacent to the conductive region;a gate electrode over the gate dielectric;a silicide region over the gate electrode; anda second grain-filled conductive barrier layer over the silicide region. 15. A semiconductor device comprising: a transistor having a conductive region;a first silicide region over the conductive region;a dielectric layer over the silicide region;a first conductive material extending through the dielectric layer and in electrical contact with the first silicide region, the first conductive material in contact with at least a portion of the dielectric layer; anda first treated barrier between the first silicide region and the first conductive material. 16. The semiconductor device of claim 15, wherein the first treated barrier is substantially aligned with the first silicide region. 17. The semiconductor device of claim 15, wherein the first treated barrier is substantially aligned with the first conductive material. 18. The semiconductor device of claim 15, wherein the transistor further comprises: a gate dielectric and gate electrode;a second silicide region on the gate electrode; anda second treated barrier on the gate electrode. 19. The semiconductor device of claim 15, wherein the first treated barrier comprises silicon. 20. The semiconductor device of claim 15, wherein the first treated barrier comprises germanium.
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