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Provided is a chemical vapor deposition apparatus. The apparatus includes a reaction chamber, a gas introduction unit, and a gas exhaust unit. The reaction chamber includes a susceptor on which a wafer is loaded and a reaction furnace in which the wafer is processed by chemical vapor deposition. The

Provided is a chemical vapor deposition apparatus. The apparatus includes a reaction chamber, a gas introduction unit, and a gas exhaust unit. The reaction chamber includes a susceptor on which a wafer is loaded and a reaction furnace in which the wafer is processed by chemical vapor deposition. The gas introduction unit is disposed at an outer wall of the reaction chamber to supply reaction gas from an outside of the reaction furnace to a center portion of the reaction furnace. The gas exhaust unit is disposed at a center portion of the reaction chamber to discharge the reaction gas to an upper or lower outside of the reaction chamber after the reaction gas is used for a reaction in the reaction furnace. Therefore, the gas density inside the chamber can be kept at a substantially uniform state even when process pressure is increased for growing a high-temperature deposition layer.

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1. A chemical vapor deposition apparatus comprising: a reaction chamber comprising a susceptor on which a wafer is loaded and a reaction furnace in which the wafer is processed by chemical vapor deposition; a gas introduction unit disposed at an outer wall of the reaction chamber to supply a reactio

1. A chemical vapor deposition apparatus comprising: a reaction chamber comprising a susceptor on which a wafer is loaded and a reaction furnace in which the wafer is processed by chemical vapor deposition; a gas introduction unit disposed at an outer wall of the reaction chamber to supply a reaction gas from an outside of the reaction furnace to a center portion of the reaction furnace; a gas exhaust unit disposed at a center portion of the reaction chamber to discharge the reaction gas to an upper or lower outside of the reaction chamber after the reaction gas is used for a reaction in the reaction furnace; a flow control unit disposed between the gas introduction unit and the gas exhaust unit so as to make a uniform gas flow from the gas introduction unit to the gas exhaust unit, wherein the flow control unit comprises: a barrier wall disposed at the outside of the reaction furnace to define the reaction furnace in the reaction chamber and introduce the reaction gas supplied from the gas introduction unit into the reaction furnace while adjusting a pressure of the reaction gas; a plurality of gas chambers disposed between the outer wall of the reaction chamber and the barrier wall for storing the reaction gas supplied from the gas introduction unit and supplying the reaction gas through the barrier wall; and at least one dividing member separating the gas chambers, a vortex preventing unit disposed in the reaction chamber on an upper surface thereof, having a surface disposed above the susceptor and facing the susceptor, in a manner such that a distance between the susceptor and the upper surface of the reaction chamber gradually decreases toward the gas introduction unit so as to prevent a vortex from being generated in the reaction chamber. 2. The chemical vapor deposition apparatus of claim 1, further comprising a driving unit providing rotation power to rotate the susceptor in one direction. 3. The chemical vapor deposition apparatus of claim 1, further comprising a heating unit disposed close to the susceptor for supplying heat to the susceptor. 4. The chemical vapor deposition apparatus of claim 1, wherein the gas introduction unit comprises a plurality of gas supply lines communicating with the gas chambers for supplying different gases to the gas chambers. 5. The chemical vapor deposition apparatus of claim 2, wherein the driving unit comprises: a driven gear formed at an outer surface of the susceptor;a driving gear engaged with the driven gear; anda rotary motor disposed at an end of a drive shaft rotating the driving gear for providing rotation power. 6. The chemical vapor deposition apparatus of claim 2, further comprising a shaft disposed at a center portion of the susceptor for rotating the susceptor, the shaft comprising the gas exhausting unit therein, wherein the driving unit comprises:a driven gear disposed at the susceptor;a driving gear engaged with the driven gear; anda rotary motor disposed at an end of a drive shaft rotating the driving gear. 7. The chemical vapor deposition apparatus of claim 1, wherein the gas exhaust unit comprises: an exhaust hole formed at an inner top portion of the reaction chamber or a center portion of the susceptor; andan exhaust line communicating with the exhaust hole. 8. The chemical vapor deposition apparatus of claim 1, wherein the barrier wall is inclined at a predetermined angle.