초록 ▼

Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a f

Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

대표청구항 ▼

1. A method of making a light emitting device, the method comprising: (a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated;(b) providing a transparent mold having a cavi

1. A method of making a light emitting device, the method comprising: (a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated;(b) providing a transparent mold having a cavity filled with a second polymerizable composition;(c) polymerizing the second polymerizable composition to form a second partially polymerized composition, wherein polymerizing the second polymerizable composition comprises applying actinic radiation having a wavelength of 700 nm or less; and(d) inverting the mold to contact the first polymerizable composition and the second partially polymerized composition;(e) polymerizing the first polymerizable composition to form a first partially polymerized composition, wherein polymerizing the first polymerizable composition comprises applying actinic radiation having a wavelength of 700 nm or less. 2. The method of claim 1, wherein polymerizing the first polymerizable composition to form a first partially polymerized composition comprises simultaneously heating and applying actinic radiation having a wavelength of 700 nm or less. 3. The method of claim 1, the method further comprising: (f) heating the first and second partially polymerized compositions. 4. The method of claim 1, the method further comprising: (f) separating the mold from the second partially polymerized composition to form a molded second partially polymerized composition; and(g) heating the first partially polymerized composition and the molded second partially polymerized composition. 5. The method of claim 1, wherein providing an LED package comprising an LED die disposed in a reflecting cup comprises providing a plurality of LED packages disposed on a lead frame, each LED package comprising an LED die disposed in a reflecting cup. 6. A method of making a light emitting device, the method comprising: (a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated;(b) providing a mold having a cavity filled with a second polymerizable composition;(c) polymerizing the second polymerizable composition to form a second partially polymerized composition, wherein polymerizing the second polymerizable composition comprises heating;(d) inverting the mold to contact the first polymerizable composition and the second partially polymerized composition; and(e) polymerizing the first polymerizable composition to form a first partially polymerized composition, wherein polymerizing the first polymerizable composition comprises heating. 7. The method of claim 6, the method further comprising: (f) separating the mold from the second partially polymerized composition to form a molded second partially polymerized composition; and(g) heating the first partially polymerized composition and the molded second partially polymerized composition. 8. The method of claim 6, wherein providing an LED package comprising an LED die disposed in a reflecting cup comprises providing a plurality of LED packages disposed on a lead frame, each LED package comprising an LED die disposed in a reflecting cup. 9. A method of making a light emitting device, the method comprising: (a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated;(b) providing a mold having a cavity filled with a second polymerizable composition, and partially polymerizing the second polymerizable composition to form a second partially polymerized composition;(c) contacting the first polymerizable composition and the second partially polymerized composition;(d) polymerizing the first polymerizable composition and the second partially polymerized composition to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and(e) optionally separating the mold from the second polymerized composition. 10. The method of claim 9, wherein contacting the first polymerizable composition and the second partially polymerized composition comprises inverting the mold.