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A plurality of single crystal semiconductor substrates are arranged and then the plurality of single crystal semiconductor substrates which have been arranged are overlapped with a base substrate, so that the base substrate and the plurality of single crystal semiconductor substrates are bonded to e

A plurality of single crystal semiconductor substrates are arranged and then the plurality of single crystal semiconductor substrates which have been arranged are overlapped with a base substrate, so that the base substrate and the plurality of single crystal semiconductor substrates are bonded to each other. Then, each of the plurality of single crystal semiconductor substrates is separated to form a plurality of single crystal semiconductor layers over the base substrate. Next, in order to reduce crystal defects in the plurality of single crystal semiconductor layers, the plurality of single crystal semiconductor layers are irradiated with a laser beam. The plurality of single crystal semiconductor layers are thinned by being etched before or after irradiation with a laser beam.

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1. A method for manufacturing a semiconductor substrate, comprising: arranging a plurality of single crystal semiconductor substrates on a tray;placing a base substrate over the tray provided with the plurality of single crystal semiconductor substrates;bonding the plurality of single crystal semico

1. A method for manufacturing a semiconductor substrate, comprising: arranging a plurality of single crystal semiconductor substrates on a tray;placing a base substrate over the tray provided with the plurality of single crystal semiconductor substrates;bonding the plurality of single crystal semiconductor substrates to the base substrate while the plurality of single crystal semiconductor substrates are arranged in the tray;separating the plurality of single crystal semiconductor substrates to form a plurality of single crystal semiconductor layers over the base substrate;thinning the plurality of single crystal semiconductor layers by etching; andirradiating the plurality of single crystal semiconductor layers with a laser beam,wherein the tray has a plurality of depressions for holding the plurality of single crystal semiconductor substrates, andwherein each of the plurality of depressions in the tray has a size which is within a region to be exposed to light of one shot of a reduced-projection light exposure apparatus. 2. A method for manufacturing a semiconductor substrate according to claim 1, further comprising: forming an insulating film over the plurality of single crystal semiconductor substrates while the plurality of single crystal semiconductor substrates are arranged in the tray. 3. A method for manufacturing a semiconductor substrate according to claim 1, further comprising: performing ion irradiation on the plurality of single crystal semiconductor substrates to form a damaged region in the plurality of single crystal semiconductor substrates while the plurality of single crystal semiconductor substrates are arranged in the tray. 4. A method for manufacturing a semiconductor substrate according to claim 1, wherein the step of thinning the plurality of single crystal semiconductor layers is performed before the step of irradiating the plurality of single crystal semiconductor layers. 5. A method for manufacturing a semiconductor substrate according to claim 1, wherein the step of thinning the plurality of single crystal semiconductor layers is performed after the step of irradiating the plurality of single crystal semiconductor layers. 6. A method for manufacturing a semiconductor substrate according to claim 1, further comprising: forming an insulating film including nitrogen over the plurality of single crystal semiconductor substrates while the plurality of single crystal semiconductor substrates are arranged in the tray. 7. A method for manufacturing a semiconductor substrate according to claim 1, further comprising: forming an oxide insulating film over the plurality of single crystal semiconductor substrates by performing a thermal oxidation treatment while the plurality of single crystal semiconductor substrates are arranged in the tray. 8. A method for manufacturing a semiconductor substrate according to claim 1, wherein a size of the tray is the same as a size of the base substrate. 9. A method for manufacturing a semiconductor substrate, comprising: forming an insulating film over a plurality of single crystal semiconductor substrates while the plurality of single crystal semiconductor substrates are arranged in a first tray;moving the plurality of single crystal semiconductor substrates from the first tray to a second tray;placing a base substrate over the second tray provided with the plurality of single crystal semiconductor substrates;bonding the plurality of single crystal semiconductor substrates to the base substrate so that the insulating film is interposed between the plurality of single crystal semiconductor substrates and the base substrate while the plurality of single crystal semiconductor substrates are arranged in the second tray;separating the plurality of single crystal semiconductor substrates to form a plurality of single crystal semiconductor layers over the base substrate;thinning the plurality of single crystal semiconductor layers by etching; andirradiating the plurality of single crystal semiconductor layers with a laser beam,wherein the first tray and the second tray have a plurality of depressions for holding the plurality of single crystal semiconductor substrates, andwherein each of the plurality of depressions in the first and the second tray has a size which is within a region to be exposed to light of one shot of a reduced-projection light exposure apparatus. 10. A method for manufacturing a semiconductor substrate according to claim 9, wherein the step of thinning the plurality of single crystal semiconductor layers is performed before the step of irradiating the plurality of single crystal semiconductor layers. 11. A method for manufacturing a semiconductor substrate according to claim 9, wherein the step of thinning the plurality of single crystal semiconductor layers is performed after the step of irradiating the plurality of single crystal semiconductor layers. 12. A method for manufacturing a semiconductor substrate according to claim 9, wherein the insulating film includes nitrogen. 13. A method for manufacturing a semiconductor substrate according to claim 9, wherein the insulating film is formed by thermal oxidation treatment of the plurality of single crystal semiconductor substrates. 14. A method for manufacturing a semiconductor substrate according to claim 9, wherein a size of the second tray is the same as a size of the base substrate. 15. A method for manufacturing a semiconductor substrate, comprising: performing ion irradiation on a plurality of single crystal semiconductor substrates to form a damaged region in the plurality of single crystal semiconductor substrates while the plurality of single crystal semiconductor substrates are arranged in a first tray;moving the plurality of single crystal semiconductor substrates from the first tray to a second tray;placing a base substrate over the second tray provided with the plurality of single crystal semiconductor substrates;bonding the plurality of single crystal semiconductor substrates to the base substrate while the plurality of single crystal semiconductor substrates are arranged in the second tray;separating the plurality of single crystal semiconductor substrates at the damaged region to form a plurality of single crystal semiconductor layers over the base substrate;thinning the plurality of single crystal semiconductor layers by etching; andirradiating the plurality of single crystal semiconductor layers with a laser beam,wherein the first tray and the second tray have a plurality of depressions for holding the plurality of single crystal semiconductor substrates, andwherein each of the plurality of depressions in the first and the second tray has a size which is within a region to be exposed to light of one shot of a reduced-projection light exposure apparatus. 16. A method for manufacturing a semiconductor substrate according to claim 15, wherein the step of thinning the plurality of single crystal semiconductor layers is performed before the step of irradiating the plurality of single crystal semiconductor layers. 17. A method for manufacturing a semiconductor substrate according to claim 15, wherein the step of thinning the plurality of single crystal semiconductor layers is performed after the step of irradiating the plurality of single crystal semiconductor layers. 18. A method for manufacturing a semiconductor substrate according to claim 15, further comprising: forming an insulating film including nitrogen over the plurality of single crystal semiconductor substrates while the plurality of single crystal semiconductor substrates are arranged in the first tray. 19. A method for manufacturing a semiconductor substrate according to claim 15, further comprising: forming an oxide insulating film over the plurality of single crystal semiconductor substrates by performing a thermal oxidation treatment while the plurality of single crystal semiconductor substrates are arranged in the first tray. 20. A method for manufacturing a semiconductor substrate according to claim 15, wherein a size of the second tray is the same as a size of the base substrate. 21. A method for manufacturing a semiconductor device, comprising: arranging a plurality of single crystal semiconductor substrates on a tray;placing a base substrate over the tray provided with the plurality of single crystal semiconductor substrates;bonding the plurality of single crystal semiconductor substrates to the base substrate while the plurality of single crystal semiconductor substrates are arranged in the tray;separating the plurality of single crystal semiconductor substrates to form a plurality of single crystal semiconductor layers over the base substrate;thinning the plurality of single crystal semiconductor layers by etching;irradiating the plurality of single crystal semiconductor layers with a laser beam; andforming a semiconductor element by use of the plurality of single crystal semiconductor layers which are thinned,wherein the tray has a plurality of depressions for holding the plurality of single crystal semiconductor substrates, andwherein each of the plurality of depressions in the tray has a size which is within a region to be exposed to light of one shot of a reduced-projection light exposure apparatus. 22. A method for manufacturing a semiconductor device according to claim 21, further comprising: forming an insulating film over the plurality of single crystal semiconductor substrates while the plurality of single crystal semiconductor substrates are arranged in the tray. 23. A method for manufacturing a semiconductor device according to claim 21, further comprising: performing ion irradiation on the plurality of single crystal semiconductor substrates to form a damaged region in the plurality of single crystal semiconductor substrates while the plurality of single crystal semiconductor substrates are arranged in the tray. 24. A method for manufacturing a semiconductor device according to claim 21, wherein the step of thinning the plurality of single crystal semiconductor layers is performed before the step of irradiating the plurality of single crystal semiconductor layers. 25. A method for manufacturing a semiconductor device according to claim 21, wherein the step of thinning the plurality of single crystal semiconductor layers is performed after the step of irradiating the plurality of single crystal semiconductor layers. 26. A method for manufacturing a semiconductor device according to claim 21, further comprising: forming an insulating film including nitrogen over the plurality of single crystal semiconductor substrates while the plurality of single crystal semiconductor substrates are arranged in the tray. 27. A method for manufacturing a semiconductor device according to claim 21, further comprising: forming an oxide insulating film over the plurality of single crystal semiconductor substrates by performing a thermal oxidation treatment while the plurality of single crystal semiconductor substrates are arranged in the tray. 28. A method for manufacturing a semiconductor device according to claim 21, wherein a size of the tray is the same as a size of the base substrate. 29. A method for manufacturing a semiconductor device, comprising: forming an insulating film over a plurality of single crystal semiconductor substrates while the plurality of single crystal semiconductor substrates are arranged in a first tray;moving the plurality of single crystal semiconductor substrates from the first tray to a second tray;placing a base substrate over the second tray provided with the plurality of single crystal semiconductor substrates;bonding the plurality of single crystal semiconductor substrates to the base substrate so that the insulating film is interposed between the plurality of single crystal semiconductor substrates and the base substrate while the plurality of single crystal semiconductor substrates are arranged in the second tray;separating the plurality of single crystal semiconductor substrates to form a plurality of single crystal semiconductor layers over the base substrate;thinning the plurality of single crystal semiconductor layers by etching;irradiating the plurality of single crystal semiconductor layers with a laser beam; andforming a semiconductor element by use of the plurality of single crystal semiconductor layers which are thinned,wherein the first tray and the second tray have a plurality of depressions for holding the plurality of single crystal semiconductor substrates, andwherein each of the plurality of depressions in the first and the second tray has a size which is within a region to be exposed to light of one shot of a reduced-projection light exposure apparatus. 30. A method for manufacturing a semiconductor device according to claim 29, wherein the step of thinning the plurality of single crystal semiconductor layers is performed before the step of irradiating the plurality of single crystal semiconductor layers. 31. A method for manufacturing a semiconductor device according to claim 29, wherein the step of thinning the plurality of single crystal semiconductor layers is performed after the step of irradiating the plurality of single crystal semiconductor layers. 32. A method for manufacturing a semiconductor device according to claim 29, wherein the insulating film includes nitrogen. 33. A method for manufacturing a semiconductor device according to claim 29, wherein the insulating film is formed by thermal oxidation treatment of the plurality of single crystal semiconductor substrates. 34. A method for manufacturing a semiconductor device according to claim 29, wherein a size of the second tray is the same as a size of the base substrate. 35. A method for manufacturing a semiconductor device, comprising: performing ion irradiation on a plurality of single crystal semiconductor substrates to form a damaged region in the plurality of single crystal semiconductor substrates while the plurality of single crystal semiconductor substrates are arranged in a first tray;moving the plurality of single crystal semiconductor substrates from the first tray to a second tray;placing a base substrate over the second tray provided with the plurality of single crystal semiconductor substrates;bonding the plurality of single crystal semiconductor substrates to the base substrate while the plurality of single crystal semiconductor substrates are arranged in the second tray;separating the plurality of single crystal semiconductor substrates at the damaged region to form a plurality of single crystal semiconductor layers over the base substrate;thinning the plurality of single crystal semiconductor layers by etching;irradiating the plurality of single crystal semiconductor layers with a laser beam; andforming a semiconductor element by use of the plurality of single crystal semiconductor layers which are thinned,wherein the first tray and the second tray have a plurality of depressions for holding the plurality of single crystal semiconductor substrates, andwherein each of the plurality of depressions in the first and the second tray has a size which is within a region to be exposed to light of one shot of a reduced-projection light exposure apparatus. 36. A method for manufacturing a semiconductor device according to claim 35, wherein the step of thinning the plurality of single crystal semiconductor layers is performed before the step of irradiating the plurality of single crystal semiconductor layers. 37. A method for manufacturing a semiconductor device according to claim 35, wherein the step of thinning the plurality of single crystal semiconductor layers is performed after the step of irradiating the plurality of single crystal semiconductor layers. 38. A method for manufacturing a semiconductor device according to claim 35, further comprising: forming an insulating film including nitrogen over the plurality of single crystal semiconductor substrates while the plurality of single crystal semiconductor substrates are arranged in the first tray. 39. A method for manufacturing a semiconductor device according to claim 35, further comprising: forming an oxide insulating film over the plurality of single crystal semiconductor substrates by performing a thermal oxidation treatment while the plurality of single crystal semiconductor substrates are arranged in the first tray. 40. A method for manufacturing a semiconductor device according to claim 35, wherein a size of the second tray is the same as a size of the base substrate.