Hermetically-sealed packages for electronic components having reduced unused areas
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0473171
(2012-05-16)
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등록번호 |
US-8317562
(2012-11-27)
|
발명자
/ 주소 |
- Nguyen, Kelvin
- Pastel, Michelle Nicole Haase
- Zhang, Lu
|
출원인 / 주소 |
|
대리인 / 주소 |
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인용정보 |
피인용 횟수 :
1 인용 특허 :
4 |
초록
▼
Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the su
Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).
대표청구항
▼
1. A method of making a glass package comprising: depositing a frit-containing paste on a major surface of a first glass substrate in a predetermined pattern;sintering the frit-containing paste to form a sintered frit;placing the first glass substrate on a second glass substrate such that the sinter
1. A method of making a glass package comprising: depositing a frit-containing paste on a major surface of a first glass substrate in a predetermined pattern;sintering the frit-containing paste to form a sintered frit;placing the first glass substrate on a second glass substrate such that the sintered frit is positioned between the first and second glass substrates;traversing a laser beam over the sintered frit to melt the frit, thereby bonding the first glass substrate to the second glass substrate to form a glass package comprising the first glass substrate, the second glass substrate, and a wall that comprises the sintered glass frit and separates the first and second substrates;scoring and breaking the glass package to a predetermined size wherein:(a) the glass package has first and second sides:(b) the wall has first and second sides that are substantially parallel to the first and second sides of the package, respectively;(c) the first side of the glass package and the first side of the wall are separated by a distance Dfirst;(d) the second side of the package and the second side of the wall are separated by a distance Dsecond; andtrimming the glass package such that at least one of Dfirst and Dsecond is less than or equal to 200 microns. 2. The method according to claim 1, wherein the step of trimming comprises grinding a scored and broken glass edge to form at least one of the first or second sides. 3. The method according to claim 2, further comprising flooding the scored and broken glass edge with a cooling medium while performing the grinding step. 4. The method according to claim 2, further comprising filling a space between the first and second glass substrates and the wall with a resin prior to the grinding. 5. The method according to claim 1, wherein an electronic component is hermetically sealed between the first and second glass substrates. 6. The method according to claim 5, wherein the electronic component is an organic light emitting diode. 7. The method according to claim 1, wherein at least one of Dfirst and Dsecond is less than or equal to 100 microns. 8. The method according to claim 1, further comprising grinding the sintered frit prior to the step of placing. 9. A method of making a glass package comprising: depositing a frit-containing paste on a major surface of a first glass substrate in a predetermined pattern;sintering the frit-containing paste to form a sintered frit;placing the first glass substrate on a second glass substrate such that the sintered frit is positioned between the first and second glass substrates;traversing a laser beam over the sintered frit to melt the frit, thereby bonding the first glass substrate to the second glass substrate to form a glass package comprising the first glass substrate, the second glass substrate, and a wall that comprises the sintered glass frit and separates the first and second substrates;scoring and breaking the glass package to a predetermined size wherein:(a) the glass package has first and second sides:(b) the wall has first and second sides that are substantially parallel to the first and second sides of the package, respectively;(c) the first side of the glass package and the first side of the wall are separated by a distance Dfirst;(d) the second side of the package and the second side of the wall are separated by a distance Dsecond; andgrinding a scored and broken glass edge to form at least one of the first or second sides the glass package such that at least one of Dfirst and Dsecond is less than or equal to 200 microns. 10. The method according to claim 9, further comprising flooding the scored and broken glass edge with a cooling medium while performing the grinding step. 11. The method according to claim 9 further comprising filling a space between the first and second glass substrates and the wall with a resin prior to the grinding. 12. The method according to claim 9, wherein an electronic component is hermetically sealed between the first and second glass substrates. 13. The method according to claim 12, wherein the electronic component is an organic light emitting diode. 14. The method according to claim 9, wherein at least one of Dfirst and Dsecond is less than or equal to 100 microns. 15. The method according to claim 9, further comprising grinding the sintered frit prior to the step of placing.
이 특허에 인용된 특허 (4)
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Maruyama, Junya; Yamazaki, Shunpei, Display device and manufacturing method thereof.
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Aitken,Bruce G.; Carberry,Joel P.; DeMartino,Steven E.; Hagy,Henry E.; Lamberson,Lisa A.; Miller, II,Richard J.; Morena,Robert; Schroeder, III,Joseph F.; Streltsov,Alexander; Widjaja,Sujanto, Glass package that is hermetically sealed with a frit and method of fabrication.
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Chang,Youn Gyoung; Nam,Seung Hee, Liquid crystal display panel and fabricating method thereof.
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Allaire, Roger A.; Brown, James W.; Gierbolini, Clive D.; Schaeffler, Robert G., Methods and apparatus for edge finishing glass sheets.
이 특허를 인용한 특허 (1)
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Chen, Kuang-Jung; Lin, Wei-Yi, Environmental sensitive electronic device package.
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