초록 ▼

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clip

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

대표청구항 ▼

1. A substrate carrier for use in electroplating a plurality of substrates, the substrate carrier comprising: a non-conductive carrier body on which the substrates are to be held;cavities in the non-conductive carrier body;electrically-conductive lines embedded within the carrier body; anda pluralit

1. A substrate carrier for use in electroplating a plurality of substrates, the substrate carrier comprising: a non-conductive carrier body on which the substrates are to be held;cavities in the non-conductive carrier body;electrically-conductive lines embedded within the carrier body; anda plurality of contact clips which are coupled to the electrically-conductive lines embedded within the carrier body, the contact clips holding the substrates in place and electrically coupling the substrates to the electrically-conductive lines,wherein the non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. 2. The substrate carrier of claim 1, wherein non-conductive carrier body comprises a first thermoplastic layer and a second thermoplastic layer which are joined together thereby forming the cavities, and wherein the electrically-conductive lines are arranged in between the first and second thermoplastic layers. 3. The substrate carrier of claim 1, wherein the cavities are arranged at positions so as to be behind the substrates when the substrates are clipped to the substrate carrier. 4. The substrate carrier of claim 3, further comprising: a ribbing pattern within said cavities. 5. The substrate carrier of claim 4, wherein the ribbing pattern comprises an X-shaped pattern. 6. The substrate carrier of claim 1, further comprising: a plurality of spacing features on the non-conductive carrier body, the spacing features being configured to space the substrates from a top surface of the non-conductive carrier body when the substrates are clipped onto the substrate carrier. 7. The substrate carrier of claim 1, further comprising: a plurality of aligning features on the non-conductive carrier body, wherein the aligning features are arranged to surround and align the substrates placed on the substrate carrier. 8. The substrate carrier of claim 7, wherein the aligning features are configured to be removable from the carrier body and replaceable with new aligning features. 9. The substrate carrier of claim 8, wherein the aligning features comprise pegs. 10. The substrate carrier of claim 9, wherein the pegs are tapered. 11. The substrate carrier of claim 1, further comprising: an electrically-conductive bus bar configured at a top side of the non-conductive carrier body and conductively coupled to the electrically-conductive lines embedded in the non-conductive carrier body. 12. The substrate carrier of claim 11, further comprising: a plurality of mounting holes in the bus bar for mounting the substrate carrier onto a work arm for dipping the non-conductive carrier body into, and raising the non-conductive carrier body out of, an electroplating bath while a voltage is applied to the bus bar. 13. A substrate carrier for use in electroplating a plurality of substrates, the substrate carrier comprising: a non-conductive carrier body on which the substrates are to be held, wherein the non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body;electrically-conductive lines embedded within the carrier body;a plurality of contact clips which are coupled to the electrically-conductive lines embedded within the carrier body, the contact clips holding the substrates in place and electrically coupling the substrates to the electrically-conductive lines; anda plurality of spacing features on the non-conductive carrier body, the spacing features being configured to space the substrates from a top surface of the non-conductive carrier body when the substrates are clipped onto the substrate carrier, wherein the spacing features comprise removable pads. 14. The substrate carrier of claim 13, wherein the removable pads have a flat surface which is tear-drop shaped. 15. A method of electroplating a plurality of substrates, the method comprising: mechanically holding the plurality of substrates onto a substrate carrier having a non-permeable, non-conductive carrier body and an electrically-conductive path through the carrier body to substrates;mounting the substrate carrier on a work arm;dipping the carrier body with the substrates held thereon into an electroplating bath; andapplying a voltage to the substrates via the electrically-conductive path through the non-permeable, non-conductive carrier body.