IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0832184
(2010-07-08)
|
등록번호 |
US-8319336
(2012-11-27)
|
발명자
/ 주소 |
- Chang, Hung-Pin
- Yu, Chen-Hua
|
출원인 / 주소 |
- Taiwan Semiconductor Manufacturing Company, Ltd.
|
대리인 / 주소 |
Lowe Hauptman Ham & Berner, LLP
|
인용정보 |
피인용 횟수 :
5 인용 특허 :
35 |
초록
▼
The patterns (or layout), and pattern densities of TSVs described above provide layout of TSVs that could be etched with reduced etch microloading effect(s) and with good within-die uniformity. The patterns and pattern densities of TSVs for different groups of TSVs (or physically separated groups, o
The patterns (or layout), and pattern densities of TSVs described above provide layout of TSVs that could be etched with reduced etch microloading effect(s) and with good within-die uniformity. The patterns and pattern densities of TSVs for different groups of TSVs (or physically separated groups, or groups with different functions) should be fairly close amongst different groups. Different groups of TSVs (or TSVs with different functions, or physically separated TSV groups) should have relatively close shapes, sizes, and depths to allow the aspect ratio of all TSVs to be within a controlled (and optimal) range. The size(s) and depths of TSVs should be carefully selected to optimize the etching time and the metal gap-fill time.
대표청구항
▼
1. A package of a light-emitting device (LED) chip, comprising the LED chip; anda support structure, wherein the LED chip is disposed on the support structure, and wherein the support structure has a first group of through silicon vias (TSVs) for providing electrical connection for the LED chip and
1. A package of a light-emitting device (LED) chip, comprising the LED chip; anda support structure, wherein the LED chip is disposed on the support structure, and wherein the support structure has a first group of through silicon vias (TSVs) for providing electrical connection for the LED chip and a second group of TSVs for providing a function of heat dissipation for the LED chip, wherein the first group of TSVs are arranged in a first pattern with a first pattern density and the second group of TSVs are arranged in a second pattern with a second pattern density, and wherein the first and the second groups of TSVs all have a same depth and the first pattern of the first group of TSVs and the second pattern of the second group of TSVs are the same. 2. The package of claim 1, wherein the first group of TSVs and the second group of TSVs have significantly same shapes, significantly same sizes, and significantly same aspect ratios. 3. The package of claim 1, wherein first pattern density of the first group of TSVs and the second pattern density of the second group of TSVs are significantly the same. 4. The package of claim 1, wherein the first group of TSVs and the second group of TSVs all have a cross-sectional shape selected from a group consisting of circle, oval, square, rectangle, triangle, hexagonal, and octagonal. 5. The package of claim 1, wherein each of the first pattern density and the second pattern density is between about 25% to about 60%. 6. The package of claim 1, wherein absolute value of a difference between the first pattern density and the second pattern density has an absolute value between about 0.1% to about 5%. 7. The package of claim 6, wherein the first pattern density is higher than the second pattern density to reduce the edge effect of the first group of TSVs. 8. The package of claim 1, wherein the second group of TSVs also provide electrical connection for the LED. 9. The package of claim 1, wherein the second group of TSVs are disposed below the LED. 10. The package of claim 1, wherein aspect ratio of each of the first group of TSVs and second group of TSVs is between about 3 to about 10. 11. The package of claim 1, wherein a width of each of the first group of TSVs and the second group of TSVs is between about 15 μm to about 40 and wherein the depth of each of the first group of TSVs and the second group of TSVs is between about 30 μm to about 400 μm. 12. A semiconductor device comprising: the semiconductor device; anda support structure, wherein the semiconductor device is disposed on the support structure, and wherein the support structure has a first group of through silicon vias (TSVs) for providing electrical connection for the semiconductor device and a second group of TSVs for providing a function of heat dissipation for the semiconductor device, wherein the first group of TSVs are arranged in a first pattern with a first pattern density and the second group of TSVs are arranged in a second pattern with a second pattern density, and wherein the first and the second groups of TSVs all have a same depth and an absolute value of a difference between the first pattern density and the second pattern density has an absolute value between about 0.1% to about 5%. 13. The semiconductor device of claim 12, wherein the second group of TSVs is positioned between a first portion of the first group of TSVs and a second portion of the first group of TSVs. 14. The semiconductor device of claim 12, wherein a distance between TSVs within the first group of TSVs and within the second group of TSVs is equal to a diameter of the TSVs. 15. The semiconductor device of claim 12, wherein the first group of TSVs includes at least two first columns of TSVs, the second group of TSVs includes at least one second column of TSVs, and the at least two first columns of TSVs are arranged in alternating fashion with the at least one second column of TSVs. 16. The semiconductor device of claim 15, wherein the at least one second column of TSVs is offset from the at least two first columns of TSVs in a direction perpendicular to a line connecting the at least two first columns of TSVs. 17. The semiconductor device of claim 12, wherein a distance between the first group of TSVs and the second group of TSVs is greater than a distance between TSVs within the second group of TSVs. 18. The semiconductor device of claim 12, wherein a number of TSVs in the second group of TSVs is greater than a number of TSVs in the first group of TSVs. 19. The semiconductor device of claim 12, wherein the first group of TSVs are connected to an electrical interface, and the second group of TSVs are connected to a thermal interface separate from the electrical interface. 20. A semiconductor device comprising: the semiconductor device; anda support structure, wherein the semiconductor device is disposed on the support structure, and wherein the support structure has a first group of through silicon vias (TSVs) connected to an electrical interface for providing electrical connection for the semiconductor device and a second group of TSVs connected to a thermal interface for providing a function of heat dissipation for the semiconductor device, wherein the thermal interface is separate from the electrical interface, the first group of TSVs are arranged in a first pattern with a first pattern density and the second group of TSVs are arranged in a second pattern with a second pattern density, and the first and the second groups of TSVs all have a same depth.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.