Test apparatus for measuring a characteristic of a device under test
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01R-029/26
G01R-031/20
출원번호
US-0590955
(2009-11-16)
등록번호
US-8319503
(2012-11-27)
발명자
/ 주소
Negishi, Kazuki
Hansen, Mark
출원인 / 주소
Cascade Microtech, Inc.
대리인 / 주소
DASCENZO Intellectual Property Law, P.C.
인용정보
피인용 횟수 :
2인용 특허 :
767
초록
A flicker noise test system includes a guarded signal path and an unguarded signal path selectively connectable to respective terminals of a device under test. The selected signal path is connectable a terminal without disconnecting cables or changing probes.
대표청구항▼
1. A test apparatus for measuring a characteristic of a device under test, said test apparatus comprising: (a) a guarded first signal path conductively connected to a signal source and conductively connected to a terminal of said device under test; and(b) an unguarded second signal path conductively
1. A test apparatus for measuring a characteristic of a device under test, said test apparatus comprising: (a) a guarded first signal path conductively connected to a signal source and conductively connected to a terminal of said device under test; and(b) an unguarded second signal path conductively connected to said signal source and conductively connected to said terminal of said device under test, said first signal path operative to conductively connect said signal source to said terminal without disconnecting portions of said second signal path from said signal source and said terminal and said second signal path operative to conductively connect said signal source to said terminal without disconnecting portions of said first signal path from said signal source and said terminal, wherein said second signal path includes a filter to exclude higher frequency components of a signal from said signal source, and further wherein said second signal path includes a plurality of resistors, each resistor of the plurality of resistors conductively interconnectable with said filter and said terminal by operation of a respective one of a plurality of switches. 2. The test apparatus of claim 1 further comprising: (a) a first relay;(b) a second relay operable with said first relay to interconnect said signal source and said terminal with one of a portion of said first signal path and a portion of said second signal path, interconnecting said signal source and said terminal with said portion of said first signal path disconnecting said portion of said second signal path from said signal source and said terminal and interconnecting said signal source and said terminal with said portion of said second signal path disconnecting said portion of said first signal path from said signal source and said terminal; and(c) a third relay operable to connect a guard signal path to said signal source when said first signal path interconnects said signal source and said terminal and to disconnect said guard signal path from said signal source when said second signal path interconnects said signal source and said terminal, said guard signal path at least partially surrounding said first signal path for a substantial portion of a length of said first signal path between said signal source and said terminal. 3. The test apparatus of claim 2 wherein at least one of said first relay, said second relay and said third relay comprises a reed relay. 4. The test apparatus of claim 1 wherein said signal source comprises a source monitor unit. 5. The test apparatus of claim 1 wherein said signal source is a first signal source and said terminal is a first terminal, said test apparatus further comprising: (a) a guarded third signal path conductively connected to a second signal source and conductively connected to a second terminal of said device under test; and(b) an unguarded fourth signal path conductively connected to said second signal source and conductively connected to said second terminal of said device under test, said third signal path operative to conductively connect said second signal source to said second terminal without disconnecting portions of said fourth signal path from said second signal source and said second terminal and said fourth signal path operative to conductively connect said second signal source to said second terminal without disconnecting portions of said third signal path from said second signal source and said second terminal. 6. The test apparatus of claim 5 further comprising: (a) a fourth relay;(b) a fifth relay operable with said fourth relay to interconnect said second signal source and said second terminal with one of a portion of said third signal path and a portion of said fourth signal path, interconnecting said second signal source and said second terminal with said portion of said third signal path disconnecting said portion of said fourth signal path from said second signal source and said second terminal and interconnecting said second signal source and said second terminal with said portion of said fourth signal path disconnecting said portion of said third signal path from said second signal source and said second terminal; and(c) a sixth relay operable to connect a second guard signal path to said second signal source when said third signal path interconnects said second signal source and said second terminal and to disconnect said second guard signal path from said second signal source when said fourth signal path interconnects said second signal source and said second terminal, said second guard signal path at least partially surrounding said third signal path for a substantial portion of a length of said third signal path between said second signal source and said second terminal. 7. The test apparatus of claim 5 wherein said fourth signal path includes a filter to exclude higher frequency components of a signal conducted between said second terminal and said second signal source. 8. The test apparatus of claim 5 wherein said second signal source comprises a second source monitor unit. 9. The test apparatus of claim 5, wherein: (a) a guarded fifth signal path conductively connected to a third signal source and conductively connected to a third terminal of said device under test; and(b) an unguarded sixth signal path conductively connected to said third signal source and conductively connected to said third terminal of said device under test, said fifth signal path operative to conductively connect said third signal source to said third terminal without disconnecting portions said sixth signal path from said third signal source and said third terminal and said sixth signal path operative to conductively connect said third signal source to said third terminal without disconnecting portions of said fifth signal path from said third signal source and said third terminal. 10. A test apparatus for measuring a characteristic of a device under test, said test apparatus comprising: (a) a guarded first signal path conductively connected to a first signal source and conductively connected to a first terminal of said device under test;(b) an unguarded second signal path conductively connected to said first signal source and conductively connected to said first terminal of said device under test, said first signal path operative to conductively connect said first signal source to said first terminal without disconnecting portions of said second signal path from said first signal source and said first terminal and said second signal path operative to conductively connect said first signal source to said first terminal without disconnecting portions of said first signal path from said first signal source and said first terminal;(c) a guarded third signal path conductively connected to a second signal source and conductively connected to a second terminal of said device under test;(d) an unguarded fourth signal path conductively connected to said second signal source and conductively connected to said second terminal of said device under test, said third signal path operative to conductively connect said second signal source to said second terminal without disconnecting portions of said fourth signal path from said second signal source and said second terminal and said fourth signal path operative to conductively connect said second signal source to said second terminal without disconnecting portions of said third signal path from said second signal source and said second terminal;(e) a guarded fifth signal path conductively connected to a third signal source and conductively connected to a third terminal of said device under test; and(f) an unguarded sixth signal path conductively connected to said third signal source and conductively connected to said third terminal of said device under test, said fifth signal path operative to conductively connect said third signal source to said third terminal without disconnecting portions of said sixth signal path from said third signal source and said third terminal and said sixth signal path operative to conductively connect said third signal source to said third terminal without disconnecting portions of said fifth signal path from said third signal source and said third terminal. 11. The test apparatus of claim 10 wherein said sixth signal path includes a filter to exclude higher frequency components of a signal from said third signal source. 12. The test apparatus of claim 11 wherein said sixth signal path further includes a resistor conductively connecting said filter and said third terminal. 13. The test apparatus of claim 11 wherein said sixth signal path includes a plurality of resistors, each resistor of the plurality of resistors conductively interconnectable with said filter and said third terminal by operation of a respective one of a plurality of switches. 14. The test apparatus of claim 13 further comprising: (a) a low noise amplifier having an output and an input, which is connected to said sixth signal path between said individual resistor and said third terminal; and(b) a test instrument connected to said output of said low noise amplifier. 15. The test apparatus of claim 10 further comprising: (a) a seventh relay;(b) a eighth relay operable with said seventh relay to interconnect said third signal source and said third terminal with one of a portion of said fifth signal path and a portion of said sixth signal path, interconnecting said third signal source and said third terminal with said portion of said fifth signal path disconnecting said portion of said sixth signal path from said third signal source and said third terminal and interconnecting said third signal source and said third terminal with said portion of said sixth signal path disconnecting said portion of said fifth signal path from said third signal source and said third terminal; and(c) a ninth relay operable to connect a third guard signal path to said third signal source when said fifth signal path interconnects said third signal source and said third terminal and to disconnect said third guard signal path from said third signal source when said sixth signal path interconnects said third signal source and said third terminal, said third guard signal path at least partially surrounding said fifth signal path for a substantial portion of a length of said fifth signal path between said third signal source and said third terminal. 16. The test apparatus of claim 15 wherein a portion of said first, said second, said third, said fourth, said fifth and said sixth signal paths; and said first, said second, said third, said fourth, said fifth, said sixth, said seventh, said eighth and said ninth relays and at least two resistors are secured to a holder of a probe having probe tips operable to connect said signal paths to the respective first, second and third terminals of said device under test. 17. The test apparatus of claim 10 wherein said third signal source comprises a third source monitor unit. 18. The test apparatus of claim 10 further comprising: (a) a guarded seventh signal path conductively connected to a fourth signal source and conductively connected to a fourth terminal of said device under test; and(b) an unguarded eighth signal path conductively connected to said fourth signal source and conductively connected to said fourth terminal of said device under test, said seventh signal path operative to conductively connect said fourth signal source to said fourth terminal without disconnecting portions of said eighth signal path from said fourth signal source and said fourth terminal and said fourth signal path operative to conductively connect said fourth signal source to said fourth terminal without disconnecting portions of said seventh signal path from said fourth signal source and said fourth terminal. 19. The test apparatus of claim 18 further comprising: (a) a tenth relay;(b) a eleventh relay operable with said tenth relay to interconnect said fourth signal source and said fourth terminal with one of a portion of said seventh signal path and a portion of said eighth signal path, interconnecting said fourth signal source and said fourth terminal with said portion of said seventh signal path disconnecting said portion of said eighth signal path from said fourth signal source and said fourth terminal and interconnecting said fourth signal source and said fourth terminal with said portion of said eighth signal path disconnecting said portion of said seventh signal path from said fourth signal source and said fourth terminal; and(c) a twelfth relay operable to connect a fourth guard signal path to said fourth signal source when said seventh signal path interconnects said fourth signal source and said fourth terminal and to disconnect said fourth guard signal path from said fourth signal source when said eighth signal path interconnects said fourth signal source and said fourth terminal, said fourth guard signal path at least partially surrounding said seventh signal path for a substantial portion of a length of said seventh signal path between said fourth signal source and said fourth terminal. 20. The test apparatus of claim 19 wherein said eighth signal path includes a filter to exclude higher frequency components of a signal conducted between said fourth terminal and said fourth signal source. 21. The test apparatus of claim 19 wherein said fourth signal source comprises a fourth source monitor unit. 22. The test apparatus of claim 10, wherein said second signal path includes a filter to exclude higher frequency components of a signal from said first signal source. 23. The test apparatus of claim 22, wherein said second signal path includes a plurality of resistors, each resistor of the plurality of resistors conductively interconnectable with said filter and said first terminal by operation of a selected one of a plurality of switches.
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Mahant-Shetti Shivaling S. (Richardson TX) Aton Thomas J. (Dallas TX) Gale Rebecca J. (Richardson TX), Scanning electron microscope based parametric testing method and apparatus.
Linker Frederick I. (Menlo Park CA) Kirk Michael D. (San Jose CA) Alexander John D. (Sunnyvale CA) Park Sang-il (Palo Alto CA) Park Sung-il (San Jose CA) Smith Ian R. (Los Gatos CA), Scanning probe microscope.
Drake Robert E. (Somers NY) Faris Sadeg M. (Pleasantville NY) Patt Roy M. (Walden NY) Shen Zhi-Yuan (Ossining NY), Soft probe for providing high speed on-wafer connections to a circuit.
Satya, Akella V. S.; Adler, David L.; Richardson, Neil; Pinto, Gustavo A.; Walker, David J., Stepper type test structures and methods for inspection of semiconductor integrated circuits.
Platz Albin (Ried-Baindlkirch DEX) Schweitzer Klaus (Niederpoecking DEX) Adam Peter (Dachau DEX), Structural component with a protective coating having a nickel or cobalt basis and method for making such a coating.
Cadwallader Robert H. ; Morrison Thomas ; Probst Klaus,DEX ; Yager William A., Substrate tester location clamping, sensing, and contacting method and apparatus.
Woollam, John A.; Pfeiffer, Galen L.; Thompson, Daniel W.; Johs, Blaine D.; Herzinger, Craig M., System and method enabling simultaneous investigation of sample with two beams of electromagnetic radiation.
Piety Richard W. ; Bowers ; III Stewart V. ; Gaddis David Q., System and method for measuring and analyzing electrical signals on the shaft of a machine.
Johnsgard Kristian E. ; Mattson Brad S. ; McDiarmid James ; Zeitlin Vladimir J., System and method for thermal processing of a semiconductor substrate.
Strid Eric W. (Portland OR) Schappacher Jerry B. (Portland OR) Carlton Dale E. (Portland OR) Gleason K. Reed (Portland OR), System for evaluating probing networks.
Carlton Dale E. (Portland OR) Jones Keith E. (Aloha OR) Myers Thomas A. (Beaverton OR), System for facilitating planar probe measurements of high-speed interconnect structures.
Moulene, Daniel; Gourdon, Pierre, Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support.
Burton David P. (Parteen IEX) Dillon Paul A. (Foxrock IEX) Stephenson Malcolm I. (Adare IEX), Temperature control instrument for electronic components under test.
Swart Mark A. (Upland CA) Johnston Charles J. (Walnut CA) Van Loan David R. (Diamond Bar CA), Test fixture alignment system for printed circuit boards.
Bhangu Labh S. (Hopewell Junction NY) Morrison Thomas (Pleasant Valley NY) Probst Klaus (Herrenberg DEX), Test system with reduced test contact interface resistance.
Carrieri, Arthur H.; Roese, Erik S.; Colclough, Stephen J.; Schlitzkus, Peter J.; Younger, V. Kenneth; Orndoff, James R., Thermal luminescence liquid monitoring system and method.
Iwakura Kenichi (Kawasaki JPX) Ohtsuka Tetsuo (Kawasaki JPX), Touch sensor unit of prober for testing electric circuit and electric circuit testing apparatus using the touch sensor u.
Dechene Ronald L. (Boxford MA) Newton Robert E. (Tewksbury MA) Swartzentruber Ron L. (Somerville MA), Triboelectric instrument with DC drift compensation.
Sleva Michael Z. (Atlanta GA) Hunt William D. (Decatur GA) Connuck David M. (Augusta GA) Briggs Ronald D. (Duluth GA), Ultrasonic transducer and method for using same.
Inouye Alan T. (Ventura CA) Wilson Jeffrey V. (Camarillo CA) Tausig Wayne R. (Oxnard CA) Roe ; Jr. Thorndyke (Oxnard CA), Underwater splice for submarine coaxial cable.
Mizuta Masaharu,JPX, Vertical needle type probe card, method of manufacturing thereof, method of replacing defective probe needle and test method of wafer using the probe card.
Bargett Charley B. (Santa Barbara CA) Osgood Roderic L. (Goleta CA) Davis Joseph L. (Santa Barbara CA) Joyce Richard J. (Thousand Oaks CA), Voltage calibration in E-beam probe using optical flooding.
Schwindt Randy J. (Portland OR) Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Smith Kenneth R. (Portland OR) Warner Richard H. (Portland OR), Wafer probe station for low-current measurements.
Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Koxxy Martin J. (Hillsboro OR), Wafer probe station having environment control enclosure.
Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Koxxy Martin J. (Hillsboro OR), Wafer probe station having environment control enclosure.
Schwindt Randy J. (Portland OR) Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Smith Kenneth R. (Portland OR) Warner Richard H. (Portland OR) Andrews Peter D. (Tigard OR), Wafer probe station having integrated guarding, Kelvin connection and shielding systems.
Schwindt Randy J. (Portland OR) Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA) Smith Kenneth R. (Portland OR) Warner Richard H. (Portland OR) Andrews Peter D. (Tigard OR), Wafer probe station having integrated guarding, Kelvin connection and shielding systems.
Harwood Warren K. (Vancouver WA) Koxxy Martin J. (Hillsboro OR) Tervo Paul A. (Vancouver WA), Wafer probe station with integrated environment control enclosure.
Mallory Roy E. (Bedford MA) Domenicali Peter (Montepelier VT) Poduje Noel S. (Needham Heights MA) Belyaev Alexander (Wayland MA) Harvey Peter A. (Wilmington MA) Smith Richard S. (Harvard MA), Wafer testing and self-calibration system.
Kleinberg Robert L. (Ridgefield CT) Clark Brian (Missouri City TX) Chew Weng C. (Champaign IL) Mariani David (Darien CT), Well logging apparatus for determining dip, azimuth, and invaded zone conductivity.
Howland, Jr.,William H.; Hillard,Robert J.; Hung,Steven Chi Shin, Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof.
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