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Single wafer apparatus for drying semiconductor substrates using an inert gas air-knife 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F26B-021/06
출원번호 US-0249956 (2008-10-12)
등록번호 US-8322045 (2012-12-04)
발명자 / 주소
  • Stein, Nathan D.
  • Achkire, Younes
  • Franklin, Timothy J.
  • Svirchevski, Julia
  • Marohl, Dan A.
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Dugan & Dugan, PC
인용정보 피인용 횟수 : 5  인용 특허 : 262

초록

In one aspect, a substrate processing apparatus is provided. The apparatus comprises a mechanism for forming a meniscus on a surface of a substrate by moving the substrate through a fluid; an air knife apparatus positioned to apply an air knife to shorten the meniscus formed on the surface of the su

대표청구항

1. A substrate processing apparatus, comprising: a mechanism for forming a meniscus on a surface of a substrate by moving the substrate through a fluid;an air knife apparatus positioned to apply an air knife to shorten the meniscus formed on the surface of the substrate, wherein the air knife appara

이 특허에 인용된 특허 (262)

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