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Control of system coolant to facilitate two-phase heat transfer in a multi-evaporator cooling system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-005/02
  • F25D-017/02
  • F28D-015/02
출원번호 US-0556031 (2009-09-09)
등록번호 US-8322154 (2012-12-04)
발명자 / 주소
  • Campbell, Levi A.
  • Chu, Richard C.
  • Ellsworth, Jr., Michael J.
  • Iyengar, Madhusudan K.
  • Simons, Robert E.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Jung, Esq., Dennis
인용정보 피인용 횟수 : 15  인용 특허 : 30

초록

A cooling system and method are provided for facilitating two-phase heat transfer from an electronics system including a plurality of electronic devices to be cooled. The cooling system includes a plurality of evaporators coupled to the electronic devices, and a coolant loop for passing system coola

대표청구항

1. A cooling system comprising: a plurality of evaporators configured to couple to a plurality of electronic devices to be cooled;a coolant loop for passing system coolant through the plurality of evaporators, the coolant loop comprising a plurality of coolant branches coupled in parallel, each cool

이 특허에 인용된 특허 (30)

  1. Ishigaki Shigeya,JPX ; Sinnsi Mikiyasu,JPX ; Koizumi Tomohito,JPX ; Tuno Katuyuki,JPX ; Suzuki Takahiro,JPX ; Akutu Masanori,JPX ; Abukawa Norio,JPX, Air conditioner having refrigerant pressure control means and driving control method therefor.
  2. Bash,Cullen E.; Beitelmal,Abdlmonem H.; Sharma,Ratnesh K.; Patel,Chandrakant D., Air-cooled heat generating device airflow control system.
  3. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Porter,Donald W.; Schmidt,Roger R.; Simons,Robert E., Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack.
  4. Dong,Xingen; Ellenburg,Albert C.; Holzschuh,Frank P., Combination valve.
  5. Friday ; Jr. Arthur F. (Liverpool NY) Chan Chi-Ping (Liverpool NY) Desmarais Brett A. (Cicero NY), Configurative control for HVAC systems.
  6. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Coolant control unit, and cooled electronics system and method employing the same.
  7. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Schmidt,Roger R.; Simons,Robert E.; Tsukamoto,Takeshi, Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems.
  8. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Schmidt,Roger R.; Simons,Robert E.; Zoodsma,Randy J., Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems.
  9. Amiot,Denis; Arraitz,Anne Marie; Fachat,Thierry; Gendraud,Alain; Roussin,Delphine, Device for tuning clearance in a gas turbine, while balancing air flows.
  10. Douglas, Jonathan D.; Bianchi, Marcus V. A.; Rossi, Todd M., Estimating evaporator airflow in vapor compression cycle cooling equipment.
  11. Kobayashi,Kazuto; Watanabe,Kazuhiko; Sudo,Makoto, Expansion valve.
  12. Rohrer,Clay A.; Stewart,Ryan G., Flat-tube evaporator with micro-distributor.
  13. Dennis Richard Dale, Heat pump operating in the heating mode refrigerant pressure control.
  14. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center.
  15. Bean, Jr.,John H., IT equipment cooling.
  16. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Liquid-based cooling system for cooling a multi-component electronics system.
  17. Richardson Curt D, Machinery cooling system.
  18. Knight, John Terry; Landers, Anthony William; Gavula, Patrick Gordon; Pickle, Stephen Blake, Method for refrigerant pressure control in refrigeration systems.
  19. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations.
  20. Kline,Kevin B., Method of mixing fluids using a valve.
  21. Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
  22. Huziwara, Wilson Kenzo; Martignoni, Waldir Pedro; Silva, Mauro; Ramos, José Geraldo Furtado; Dubois, Aurelio Medina; Freire, Paulo Sergio, Multifunctional entry device for a downward flow tube reactor.
  23. Goth, Gary F.; Kearney, Daniel J.; Lucas, Paul M.; Porter, Donald W., Multiple chip module cooling system and method of operation thereof.
  24. Willitts Benjamin R. (Lawrenceville NJ), Pressure control means for refrigeration systems of the energy conservation type.
  25. Bash, Cullen E.; Beitelmal, Abdlmonem H.; Sharma, Ratnesh K.; Patel, Chandrakant D., Refrigeration system with parallel evaporators and variable speed compressor.
  26. Patel, Chandrakant D.; Bash, Cullen E.; Beitelmal, Abdlmonem H., Smart cooling of data centers.
  27. Patel, Chandrakant; Bash, Cullen E.; Sharma, Ratnesh K., System and method for cooling an electronic device.
  28. Cowans,Kenneth W.; Cowans,William W.; Zubillaga,Glenn W.; Millan,Isaac, Thermal control system and method.
  29. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Schmidt,Roger R.; Simons,Robert E., Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack.
  30. Molivadas, Stephen, Two-phase heat-transfer systems.

이 특허를 인용한 특허 (15)

  1. Barringer, Wayne A.; Graybill, David P.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Steffes, James J.; Weber, Jr., Gerard V., Apparatus and method for adjusting coolant flow resistance through liquid-cooled electronics rack(s).
  2. Barringer, Wayne A.; Graybill, David P.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Steffes, James J.; Weber, Jr., Gerard V., Apparatus for adjusting coolant flow resistance through liquid-cooled electronics racks.
  3. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  4. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  5. Shedd, Timothy A.; Lindeman, Brett A., Flexible two-phase cooling system.
  6. Shedd, Timothy A.; Meives, Mark S., Fluid distribution unit for two-phase cooling system.
  7. Shedd, Timothy A.; Lindeman, Brett A., Heat sink module.
  8. Tang, Hu; Tan, Xianguang; Zhou, Tianyu; Ding, Ruiquan; Zhang, Binghua, Machine cabinet for dissipating heat.
  9. Shedd, Timothy A., Method of absorbing sensible and latent heat with series-connected heat sinks.
  10. Shedd, Timothy A.; Lindeman, Brett A., Method of cooling series-connected heat sink modules.
  11. Shedd, Timothy A., Method of operating a cooling apparatus to provide stable two-phase flow.
  12. Shedd, Timothy A.; Lindeman, Brett A.; Buchanan, Robert A., Microprocessor assembly adapted for fluid cooling.
  13. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Pressure control unit and method facilitating single-phase heat transfer in a cooling system.
  14. Shedd, Timothy A.; Lindeman, Brett A., Redundant heat sink module.
  15. Chainer, Timothy J.; David, Milnes P.; Parida, Pritish R., Two-phase cooling with ambient cooled condensor.
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