A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for prev
A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for preventing air from entering the enclosure. In a particular embodiment, the top-side flow obstructer and the bottom-side flow obstructer each include a curtain constructed from a flexible fabric having a plurality of individual adjacent fingers. In another particular embodiment, the inert environment enclosure is a nitrogen hood that houses a wave soldering machine. A inert gas nozzle is mounted at or near the inlet and/or the outlet. The inert environment enclosure maintains a positive pressure with respect to the surrounding environment when production objects are passed through the enclosure.
대표청구항▼
1. An inert environment enclosure comprising: a wall defining an interior of said enclosure and an exterior of said enclosure;at least one gas inlet coupled to said wall, said gas inlet configured to provide gas to said interior of said enclosure;at least one sensor coupled to a control system, the
1. An inert environment enclosure comprising: a wall defining an interior of said enclosure and an exterior of said enclosure;at least one gas inlet coupled to said wall, said gas inlet configured to provide gas to said interior of said enclosure;at least one sensor coupled to a control system, the at least one sensor operative to indicate a pressure in said interior of said enclosure, the control system operative to control a pressure in said interior of said enclosure;an object inlet through which production objects enter said enclosure;an object outlet through which said production objects exit said enclosure; wherein said enclosure substantially encloses wave soldering equipment; andwherein at least one of said object inlet and said object outlet includes a top-side flow obstructer and a bottom-side flow obstructer for inhibiting gases from the exterior of said enclosure from entering said interior of said enclosure, said top-side flow obstructer being adapted to contact top surfaces of said production objects, said bottom-side flow obstructer being adapted to contact bottom surfaces of said production objects. 2. An inert environment enclosure according to claim 1, wherein the control system is operable to maintain a positive pressure in said interior of said enclosure with respect to said exterior of said enclosure. 3. An inert environment enclosure according to claim 2, further comprising at least one flow controller operative to control a flow of gas through the at least one gas inlet; wherein the control system actuates the flow controller to maintain a positive pressure in said interior of said enclosure with respect to said exterior of said enclosure. 4. An inert environment enclosure according to claim 2, further comprising at least one electrically actuated valve; wherein the control system actuates the at least one electrically actuated valve. 5. An inert environment enclosure according to claim 4, wherein the control system actuates the at least one electrically actuated valve in response to an indication from the at least one sensor. 6. An inert environment enclosure according to claim 5, wherein the control system maintains a positive pressure in said interior of said enclosure even when a production object enters or exits said enclosure. 7. An inert environment enclosure according to claim 2, wherein the control system maintains a positive pressure in said interior of said enclosure even when a production object enters or exits said enclosure. 8. An inert environment enclosure according to claim 2, wherein said gas inlet is coupled to provide said gas from an inert gas source. 9. An inert environment enclosure according to claim 8, wherein said inert gas source is a nitrogen gas source. 10. An inert environment enclosure according to claim 2, wherein said at least one gas inlet is disposed at one of said object inlet and said object outlet. 11. An inert environment enclosure according to claim 2, further comprising a guide system operative to guide production objects into said enclosure through said object inlet and out of said enclosure through said object outlet. 12. An inert environment enclosure according to claim 11, wherein said guide system includes a set of tracks disposed through said object inlet and said object outlet. 13. An inert environment enclosure according to claim 12, wherein said set of tracks is operative to guide pallets through said enclosure, said pallets being operative carry production objects thereon. 14. An inert environment enclosure according to claim 2, wherein at least one of said top-side flow obstructer and said bottom-side flow obstructer includes a flexible material adapted to slidably contact production objects. 15. An inert environment enclosure according to claim 14, wherein said flexible material is a part of said bottom-side flow obstructer,said flexible material deflects downward when urged by passing production objects, andsaid flexible material has sufficient elasticity to return to an upright position after being deflected downward by said production objects. 16. An inert environment enclosure according to claim 2, further comprising at least one of a thermometer, light sensor, electrical charge sensor, oxygen sensor, nitrogen sensor. 17. An inert environment enclosure comprising: a wall defining an interior of said enclosure and an exterior of said enclosure;at least one gas inlet coupled to said wall, said gas inlet configured to provide gas to said interior of said enclosure; wherein said enclosure substantially encloses wave soldering equipment;an object inlet through which production objects enter said enclosure;an object outlet through which said production objects exit said enclosure;at least one pressure sensor coupled to a control system, the pressure sensor operative to indicate a pressure in said interior of said enclosure with respect to said exterior of said enclosure;at least one flow controller operative to control a flow of gas through the at least one gas inlet;wherein the control system actuates the flow controller to maintain a positive pressure in said interior of said enclosure with respect to said exterior of said enclosure; andwherein at least one of said object inlet and said object outlet includes flow obstructer for inhibiting gases from the exterior of said enclosure from entering said interior of said enclosure above and below said production objects. 18. An inert environment enclosure comprising: a wall defining an interior of said enclosure and an exterior of said enclosure;at least one gas inlet coupled to said wall, said gas inlet configured to provide gas to said interior of said enclosure;an object inlet through which production objects enter said enclosure;an object outlet through which said production objects exit said enclosure;at least one pressure sensor coupled to a control system, the pressure sensor operative to indicate a pressure in said interior of said enclosure with respect to said exterior of said enclosure;at least one electrically actuated valve coupled to said at least one gas inlet;wherein the control system actuates the at least one electrically actuated valve to maintain a positive pressure in said interior of said enclosure with respect to said exterior of said enclosure; wherein said enclosure substantially encloses wave soldering equipment;wherein at least one of said object inlet and said object outlet includes a top-side flow obstructer and a bottom-side flow obstructer for inhibiting gases from the exterior of said enclosure from entering said interior of said enclosure, said top-side flow obstructer being adapted to contact top surfaces of said production objects, said bottom-side flow obstructer being adapted to contact bottom surfaces of said production objects; andwherein at least one of said top-side flow obstructer and said bottom-side flow obstructer includes a flexible material adapted to slidably contact production objects. 19. An inert environment enclosure according to claim 18, wherein said flexible material is a part of said bottom-side flow obstructer,said flexible material deflects downward when urged by passing production objects, andsaid flexible material has sufficient elasticity to return to an upright position after being deflected downward by said production objects. 20. An inert environment enclosure according to claim 18, wherein said at least one gas inlet is disposed atone of said object inlet and said object outlet.
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이 특허에 인용된 특허 (29)
Stach Steven R. (Austin TX) Johnson Jay R. (Doylestown PA), Apparatus and method for cleaning solder paste from items associated with surface mount technology manufacturing.
McGrath Robert E. (Buena Park CA) Girard Thomas J. B. (Ferndale MI) Buonauro John A. (Mission Viejo CA) Romance Joseph S. (Diamond Bar CA), Furnace assembly for reflowing solder on printed circuit boards.
Jacobs Stephen W. (Fleetwood PA) Arslanian Gregory K. (Chalfont PA) Adams Bruce M. (Macungie PA) Ivankovits John C. (Allentown PA) Bowe Donald J. (Macungie PA), Inert gas delivery for reflow solder furnaces.
Alley Richard C. (Santa Cruz CA) Carmassi Stephen E. (Scotts Valley CA) Daley William T. (Aptos CA) Roffey Michael F. (Scotts Valley CA), Method of soldering in a controlled-convection surface-mount reflow furnace.
Connors Robert W. (Western Springs IL) Giacobbe Frederick W. (Naperville IL) Jurcik Benjamin (Willowbrook IL) McKean Kevin P. (Naperville IL), Process and apparatus for the wave soldering of circuit boards.
Baker Jess J. (Simi Valley CA) Cable Alan J. (Simi Valley CA) Templeton Michael S. (Simi Valley CA), Soldering machine having a vertical transfer oven.
Hagerty Lawrence J. (Stamford CT) Nowotarski Mark S. (Stamford CT) Diamantopoulous David A. (Ringwood NJ), Wave soldering in a protective atmosphere enclosure over a solder pot.
Hagerty Lawrence J. (Stamford CT) Nowotarski Mark S. (Stamford CT) Diamantopoulous David A. (Ringwood NJ), Wave soldering in a protective atmosphere enclosure over a solder pot.
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