초록 ▼

A substrate is implanted with a species to form a layer of microbubbles in the substrate. The species may be hydrogen or helium in some embodiments. The size at which the microbubbles are stable within the substrate is controlled. In one example, this is by cooling the substrate. In one embodiment,

A substrate is implanted with a species to form a layer of microbubbles in the substrate. The species may be hydrogen or helium in some embodiments. The size at which the microbubbles are stable within the substrate is controlled. In one example, this is by cooling the substrate. In one embodiment, the substrate is cooled to approximately between −150° C. and 30° C. This cooling also may reduce diffusion of the species in the substrate and will reduce surface roughness when the substrate is cleaved along the layer of microbubbles.

대표청구항 ▼

1. A method comprising: performing ion implantation into a substrate with a species to form a layer of bubbles in said substrate, wherein said species is selected from the group consisting of hydrogen, helium, nitrogen, and oxygen; andcontrolling a size of said bubbles within said substrate by cooli

1. A method comprising: performing ion implantation into a substrate with a species to form a layer of bubbles in said substrate, wherein said species is selected from the group consisting of hydrogen, helium, nitrogen, and oxygen; andcontrolling a size of said bubbles within said substrate by cooling said substrate to an implant temperature approximately between −150° C. and 30° C. during said ion implantation using a platen with at least a first zone and a second zone, wherein said controlling comprises cooling a first region of said substrate to a higher temperature than a second region of said substrate, said first region disposed on said first zone and said second region disposed on said second zone, said first zone operating at a first temperature and said second zone operating at a second temperature different than said first temperature, wherein said bubbles have a larger diameter in said first region than said second region. 2. The method of claim 1, wherein said method further comprises selecting at least one of an implant energy and an implant dose of said species in response to a rate of diffusion of said species in said substrate caused by said cooling. 3. The method of claim 1, wherein said method further comprises varying said implant temperature over an implanting time interval. 4. The method of claim 1, wherein said bubbles have a mean void diameter of approximately 5 nm to 7 nm due to said controlling. 5. The method of claim 1, further comprising cleaving said substrate after said ion implantation, wherein said cleaving begins at said first region of said substrate. 6. The method of claim 1, wherein said cooling said substrate comprises providing a gas between said platen and said substrate. 7. A method comprising: performing ion implantation into a substrate with hydrogen and helium to form a layer of bubbles in said substrate; andcontrolling a size of said bubbles within said substrate by cooling said substrate to an implant temperature approximately between −150° C. and 30° C. during said ion implantation using a platen with at least a first zone and a second zone, wherein said controlling comprises cooling a first region of said substrate to a higher temperature than a second region of said substrate, said first region disposed on said first zone and said second region disposed on said second zone, said first zone operating at a first temperature and said second zone operating at a second temperature different than said first temperature, wherein said bubbles have a larger diameter in said first region than said second region. 8. The method of claim 7, wherein implant energies of said hydrogen and said helium are selected such that said hydrogen and said helium are implanted at a substantially similar depth in said substrate using said ion implantation. 9. The method of claim 7, wherein said method further comprises selecting at least one of an implant energy and an implant dose of at least one of said hydrogen and said helium in response to a rate of diffusion of at least one of said hydrogen and said helium in said substrate caused by said cooling. 10. The method of claim 7, wherein said method further comprises varying said implant temperature over an implanting time interval. 11. The method of claim 7, further comprising cleaving said substrate after said ion implantation, wherein said cleaving begins at said first region of said substrate. 12. The method of claim 7, wherein said cooling said substrate comprises providing a gas between said platen and said substrate. 13. A method comprising: performing ion implantation into a substrate with hydrogen to form a layer of bubbles in said substrate; andcontrolling a size of said bubbles within said substrate by cooling said substrate to an implant temperature approximately between −150° C. and 30° C. during said ion implantation using a platen with at least a first zone and a second zone, wherein said controlling comprises cooling a first region of said substrate to a higher temperature than a second region of said substrate, said first region disposed on said first zone and said second region disposed on said second zone, said first zone operating at a first temperature and said second zone operating at a second temperature different than said first temperature, wherein said bubbles have a larger diameter in said first region than said second region. 14. The method of claim 13, wherein said method further comprises selecting at least one of an implant energy and an implant dose of said hydrogen in response to a rate of diffusion of said hydrogen in said substrate caused by said cooling. 15. The method of claim 13, wherein said method further comprises varying said implant temperature over an implanting time interval. 16. The method of claim 13, further comprising cleaving said substrate after said ion implantation, wherein said cleaving begins at said first region of said substrate. 17. The method of claim 13, wherein said cooling said substrate comprises providing a gas between said platen and said substrate.