IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0331187
(2006-01-13)
|
등록번호 |
US-8334464
(2012-12-18)
|
발명자
/ 주소 |
- Edwards, Chuck
- Howarth, James John
- Vanheusden, Karel
|
출원인 / 주소 |
|
인용정보 |
피인용 횟수 :
8 인용 특허 :
250 |
초록
▼
An apparatus and method for making a printed circuit board comprising a substrate and an electrical circuit is provided. The circuit is formed by deposition of a plurality of electronic inks onto the substrate and curing of each of the electronic inks. The deposition may be performed using an ink-je
An apparatus and method for making a printed circuit board comprising a substrate and an electrical circuit is provided. The circuit is formed by deposition of a plurality of electronic inks onto the substrate and curing of each of the electronic inks. The deposition may be performed using an ink-jet printing process. The inkjet printing process may include the step of printing a plurality of layers, wherein a first layer includes at least one electronic ink deposited directly onto the substrate, and wherein each subsequent layer includes at least one electronic ink deposited on top of at least a portion of a previous layer when the previous layer has been cured. One or more of the layers may include at least two of the electronic inks.
대표청구항
▼
1. A printed electronic device comprising: a substrate; andan electrical circuit formed on the substrate, the circuit comprising at least one layer of at least one of a plurality of electronic inks ink-jet printed directly onto the substrate in a predetermined pattern and cured to form a silicide ba
1. A printed electronic device comprising: a substrate; andan electrical circuit formed on the substrate, the circuit comprising at least one layer of at least one of a plurality of electronic inks ink-jet printed directly onto the substrate in a predetermined pattern and cured to form a silicide barrier layer, and at least a second layer of at least a second of the plurality of electronic inks deposited upon at least a portion of the at least one layer and cured to form a conductive layer. 2. A process for printing the printed electronic device of claim 1, the process comprising: printing in a non-vacuum the at least one layer by directly depositing droplets of at the least one of a plurality of electronic inks in a first positional pattern onto the substrate;curing the at least one layer to form the silicide barrier layer;printing the at least a second layer by depositing the at least a second of the electronic inks in a next positional pattern onto at least a portion of the silicide barrier layer; andcuring the at least a second layer to form the conductive layer. 3. The process of claim 2, wherein each of the electronic inks is directly deposited using ink-jet printing. 4. The process of claim 3, wherein at least one of the printable layers is printed using at least two of the plurality of electronic inks. 5. The process of claim 2, the electrical device including a plurality of components and a plurality of interconnections between components. 6. The process of claim 5, wherein each of the plurality of components and each of the plurality of interconnections is selected from the group consisting of a conductor; a resistor; a capacitor; an inductor; a transistor; a dielectric insulator; a sensor; a diode; a keyboard; an input device; a switch; a relay; and a pixel. 7. The device of claim 1, wherein each of the plurality of electronic inks is selected from the group consisting of a conductive ink; a resistive ink having a resistivity greater than 10,000 ohms per square of printed ink when cured; a resistive ink having a resistivity less than 10,000 ohms per square of printed ink and greater than 500 ohms per square of printed ink when cured; a resistive ink having a resistivity less than 500 ohms per square of printed ink when cured; a high-K dielectric ink having a dielectric constant greater than 50.0 when cured; a low-k dielectric ink having a dielectric constant less than 50.0 when cured; an insulative ink; a ferrite ink; a clear conductive ink; and a semiconductive ink. 8. The device of claim 1, wherein at least one of the electronic inks is deposited using a process selected from the group consisting of photolithography, flexography, gravure, and screen printing. 9. The device of claim 1, wherein for at least one printable layer, each of the electronic inks is deposited using ink-jet printing, and for at least one other printable layer, each of the electronic inks is deposited using a process selected from the group consisting of photolithography, flexography, gravure, and screen printing. 10. The process of claim 2, further comprising: printing and curing a next printable layer a number of times. 11. The process of claim 2, wherein the silicide barrier layer comprises nickel silicide and the conductive layer comprises silver. 12. The process of claim 2, the electrical device being part of a solar cell. 13. The device of claim 1, wherein the silicide barrier layer comprises nickel silicide and the conductive layer comprises silver. 14. The device of claim 1, wherein the device is a solar cell. 15. The device of claim 1, wherein each of the electronic inks is directly deposited using ink-jet printing. 16. The device of claim 1, wherein at least one of the silicide barrier or conductive layers comprises at least two of the plurality of electronic inks. 17. The device of claim 1, the electrical circuit including a plurality of components and a plurality of interconnections between components. 18. The device of claim 1, wherein each of the plurality of components and each of the plurality of interconnections is selected from the group consisting of a conductor; a resistor; a capacitor; an inductor; a transistor; a dielectric insulator; a sensor; a diode; a keyboard; an input device; a switch; a relay; and a pixel. 19. The device of claim 1, wherein each of the plurality of electronic inks is selected from the group consisting of a conductive ink; a resistive ink having a resistivity greater than 10,000 ohms per square of printed ink when cured; a resistive ink having a resistivity less than 10,000 ohms per square of printed ink and greater than 500 ohms per square of printed ink when cured; a resistive ink having a resistivity less than 500 ohms per square of printed ink when cured; a high-K dielectric ink having a dielectric constant greater than 50.0 when cured; a low-k dielectric ink having a dielectric constant less than 50.0 when cured; an insulative ink; a ferrite ink; a clear conductive ink; and a semiconductive ink. 20. The device of claim 1, wherein at least one of the electronic inks is deposited using a process selected from the group consisting of photolithography, flexography, gravure, and screen printing. 21. The device of claim 1, wherein for at least one printable layer, each of the electronic inks is deposited using ink-jet printing, and for at least one other printable layer, each of the electronic inks is deposited using a process selected from the group consisting of photolithography, flexography, gravure, and screen printing. 22. The device of claim 21, wherein the silicide barrier layer comprises nickel silicide and the conductive layer comprises silver. 23. The device of claim 1, the device being part of a solar cell. 24. A solar cell device comprising: a substrate; andan electrical circuit formed on the substrate, the circuit comprising a first layer of electronic ink ink-jet printed directly onto the substrate and cured to form a silicide barrier layer, and at least a second layer of electronic ink deposited upon at least a portion of the silicide barrier layer and cured to form a conductive layer. 25. The device of claim 24, wherein the silicide barrier layer comprises nickel silicide and the conductive layer comprises silver. 26. The device of claim 24, wherein at least one of the first and second layers includes multiple electronic inks.
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