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Apparatus and method for thermal management using vapor chamber 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • H01L-023/34
  • H01L-023/367
  • F28D-015/00
출원번호 US-0909669 (2010-10-21)
등록번호 US-8335083 (2012-12-18)
발명자 / 주소
  • Yang, Wei
  • Eickhoff, Steven J.
  • Zhang, Chunbo
  • Gu, Alex
  • Zook, J. David
출원인 / 주소
  • Honeywell International Inc.
인용정보 피인용 횟수 : 3  인용 특허 : 40

초록

An apparatus includes a plurality of islands each carrying multiple cantilevers. The apparatus also includes a fluidic network having a plurality of channels separating the islands. The channels are configured to provide fluid to the islands, and the fluid at least partially fills spaces between the

대표청구항

1. An apparatus comprising: one or more islands each having a surface with multiple cantilevers; anda fluidic network configured to provide liquid over the surface of each island with the cantilevers;wherein the one or more islands include a first island, the surface of the first island including a

이 특허에 인용된 특허 (40)

  1. Brewer,Richard Grant; Upadhya,Girish; Zhou,Peng; McMaster,Mark; Tsao,Paul, Apparatus and method of efficient fluid delivery for cooling a heat producing device.
  2. Messina Gaetano P. (Hopewell Junction NY) Brewster Robert A. (Poughkeepsie NY) Kara Theodore J. (Poughkeepsie NY) Song Seaho (Highland NY), Apparatus for cooling integrated circuit chips.
  3. Edelstein Fred (Hauppauge NY) Haslett Robert A. (Dix Hills NY) Kosson Robert L. (Massapequa NY) Harwell William (Coram NY), Capillary-pumped heat transfer panel and system.
  4. Erturk,Hakan; Sauciuc,Ioan, Cooling integrated circuits using a cold plate with two phase thin film evaporation.
  5. Fruhberger,Bernd; Baselt,David R., Dense thin film-based chemical sensors and methods for making and using same.
  6. Kadlec,Leonard; Tallman,Daniel; Kilawee,Patrick, Deodorizing and sanitizing employing a wicking device.
  7. Heydari,Ali; Yang,Ji L., Direct contact cooling liquid embedded package for a central processor unit.
  8. Brosnihan,Timothy J.; Hagood, IV,Nesbitt W.; Steyn,Jasper Lodewyk; Gandhi,Jignesh; Fijol,John J.; Payne,Richard S.; Barton,Roger, Display apparatus and methods for manufacture thereof.
  9. Thundat Thomas G. ; Warmack Robert J. ; Wachter Eric A., Electromagnetic and nuclear radiation detector using micromechanical sensors.
  10. Jingkuang Chen ; Feixia Pan ; Joel A. Kubby, Electromechanical memory cell.
  11. Oden,Patrick Ian; McDonald,William Craig, Energy storage structures using electromechanically active materials for micro electromechanical systems.
  12. da Silva, Elson Dias, Fluid conduction utilizing a reversible unsaturated siphon with tubarc porosity action.
  13. Myers,Bruce A.; Peugh,Darrel E.; Sanftleben,Henry M., Fluid-cooled electronic system.
  14. O'Rourke, Shawn; Sadler, Daniel J.; Chason, Marc K.; Eliacin, Manes; Gamboa, Claudia V.; Terbrueggen, Robert; Lian, Ke K., Heater for temperature control integrated in circuit board and method of manufacture.
  15. Fitzpatrick, Glen Arthur; Gelbart, Daniel, High frequency deformable mirror device.
  16. Dhuler Vijayakumar R., High frequency tunable capacitors.
  17. Dangelo, Carlos; Olson, Darin, Integrated circuit micro-cooler having multi-layers of tubes of a CNT array.
  18. Monroe,Christopher; Stick,Daniel; Madsen,Martin; Hensinger,Winfried; Schwab,Keith, Ion trap in a semiconductor chip.
  19. Aisenbrey,Thomas, Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials.
  20. Hartzell,John Walter; Zhan,Changqing; Wolfson,Michael Barrett, MEMS pixel sensor.
  21. Rust,Thomas F.; Stark,Robert N.; Noggle,Thomas L.; Cribbs,Daniel F., Memory having a layer with electrical conductivity anisotropy.
  22. Joshi,Yogendra; Wei,Xiaojin; Patterson,Michael K., Method and apparatus for a layered thermal management arrangement.
  23. Prasher,Ravi S.; Sankman,Robert, Method and apparatus for providing distributed fluid flows in a thermal management arrangement.
  24. Cromwell S. Daniel ; Nobi Laszlo, Method for making a modular integrated apparatus for heat dissipation.
  25. Tee,Lay Har Angeline; Chir,Kim Pong Daniel; Kok,Kitt Wai; Sooriakumar,Kathirgamasundaram; Patmon,Bryan Keith, Method of forming atomic force microscope tips.
  26. Douglas Monte A. (Coppell TX) Wallace Robert M. (Dallas TX), Method of unsticking components of micro-mechanical devices.
  27. Henck Steven A., Micro mechanical device with memory metal component.
  28. Chui, Clarence; Endisch, Denis; Kogut, Lior; Tung, Ming Hau; Tung, Yeh Jiun; Chiang, Chih Wei, Microelectromechanical device with optical function separated from mechanical and electrical function.
  29. Knipe Richard L. ; Strumpell Mark H. ; Mignardi Michael A., Micromechanical devices with spring tips.
  30. Patel,Satyadev; Huibers,Andrew, Micromirror device.
  31. Doan,Jonathan; Huibers,Andrew; Patel,Satyadev; Dunphy,James; Simonian,Dmitri; Shi,Hongqin; Zhang,Jianglong, Micromirror device and method for making the same.
  32. Daniel, Jurgen; Fork, David K.; Völkel, Armin R., Oblique parts or surfaces.
  33. Lin Tsen-Hwang (Dallas TX) Congdon Philip A. (Dallas TX) Magel Gregory A. (Dallas TX) Florence James M. (Richardson TX) Boysel Robert Mark (Hopewell Jct NY), Optical switch having an analog beam for steering light.
  34. Richards,Robert F.; Bahr,David F.; Richards,Cecilia, Piezoelectric micro-transducers, methods of use and manufacturing methods for same.
  35. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  36. Heimbuch Scott D., Spatial light modulator with superstructure light shield.
  37. Shyy, Wei; Francois, Marianne Monique; Chung, Jacob Nan-Chu, Thermal management device.
  38. Wu,Jay Hsing; Qiu,Chunong; Qiu,Cindy Xing; Shih,Ishiang, Tunable photonic band gap structures for microwave signals.
  39. Dangelo, Carlos; Spitzer, Jason, Vapor chamber heat sink having a carbon nanotube fluid interface.
  40. Zhou,Peng; Goodson,Kenneth; Suntiago,Juan, Vapor escape microchannel heat exchanger.

이 특허를 인용한 특허 (3)

  1. Ranjan, Ram; Pearson, Matthew Robert; Krishnamurthy, Shashank, Advanced cooling for power module switches.
  2. Strehlow, Russell H.; Bobgan, Peter M., Thermal energy storage assembly.
  3. Strehlow, Russell H.; Bobgan, Peter M., Thermal ground plane with tension elements.
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