초록 ▼

A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set

A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

대표청구항 ▼

1. A method of using a laser to sever multiple selected target links in associated ones of multiple electrically conductive link structures fabricated in an integrated circuit, the target links formed with passivation layer material overlying electrically conductive link material, comprising: provid

1. A method of using a laser to sever multiple selected target links in associated ones of multiple electrically conductive link structures fabricated in an integrated circuit, the target links formed with passivation layer material overlying electrically conductive link material, comprising: providing position data representative of locations of the multiple electrically conductive link structures;generating, for emission and propagation along a beam axis, multiple laser pulses of which consecutive ones have substantially no temporal overlap;providing a beam positioning system that imparts rapid relative motion of the integrated circuit and the beam axis along which the multiple laser pulses propagate, the beam positioning system, in response to the position data, moving the beam axis between successive ones of the multiple selected target links and directing the beam axis to the multiple selected target links so that multiple ones of the laser pulses within a specified duration impinge on the link material of each of the multiple selected target links; andcoordinating control of the rapid relative motion of the integrated circuit and the beam axis and control of the impingement on the link material of the multiple ones of the laser pulses within the specified duration to successively remove, by interaction of the multiple ones of the laser pulses with the link material and without stopping the beam axis over any one of the multiple selected target links, portions of the overlying passivation layer material and link material to sever the multiple target links. 2. The method of claim 1, wherein a pulse width of each of the multiple laser pulses impinging on the link material of any one of the multiple selected target links is less than 25 picoseconds. 3. The method of claim 1, further comprising directing the multiple laser pulses through a gating device. 4. The method of claim 1, wherein the multiple selected target links comprise links of a memory device or a logic device. 5. The method of claim 1, wherein first and second pulse sets of the multiple ones of the laser pulses within the specified duration impinge on the link material of respective first and second selected target links, and wherein a repetition rate between the first and second pulse sets is greater than about 1 kHz. 6. The method of claim 5, wherein the repetition rate is greater than about 20 kHz. 7. The method of claim 1, wherein the specified duration has a range of between 10 ns and 200 ns and the multiple ones of laser pulses include 2 to 50 laser pulses. 8. The method of claim 1, wherein at least one of the multiple selected target links has a width less than or equal to about 1 μm. 9. The method of claim 1, wherein the multiple laser pulses form laser spots on the overlying passivation layer and link materials, and wherein the laser spots have the same spot sizes. 10. The method of claim 1, wherein the step of generating the multiple laser pulses is performed using a mode locked laser. 11. The method of claim 1, wherein the laser pulses within a specified duration produce corresponding laser spots at the integrated circuit, and wherein the laser spots overlap at one of the multiple selected target links. 12. The method of claim 1, wherein each of the multiple laser pulses impinging on the link material of any one of the multiple selected target links has a single peak pulse shape. 13. The method of claim 1, wherein the multiple laser pulses have ultraviolet (UV) wavelengths. 14. The method of claim 1, wherein the multiple laser pulses impinging on the link material of any one of the multiple selected target links have a total energy of about 0.01 μJ to 10 mJ. 15. The method of claim 1, wherein each of the multiple selected target links has a width, wherein the laser pulses within a specified duration produce corresponding laser spots at the integrated circuit, and wherein at least one of the laser spots has a spot size that is greater than one of the widths of the multiple selected target links. 16. The method of claim 1, wherein the multiple laser pulses produce corresponding laser spots at the integrated circuit, and wherein the beam positioning system includes at least two stages in a stacked configuration operable to support the integrated circuit and move any one of the multiple selected target links relative to the laser spots. 17. The method of claim 1, wherein the step of generating the multiple laser pulses is performed using a Q-switched laser. 18. The method of claim 1, further comprising changing an energy characteristic of at least one of the multiple laser pulses. 19. The method of claim 1, wherein at least one of the multiple ones of the laser pulses removes a 0.02-0.2 micron depth of the link material. 20. The method of claim 1, wherein the link material of one of the multiple selected target links has a link thickness and at least one of the laser pulses within a specified duration removes from the one of the multiple selected target links a depth of the link material of an amount that is less than the link thickness. 21. The method of claim 1, wherein at least some of the laser pulses within a specified duration have different energy characteristics. 22. The method of claim 1, wherein first and second pulse sets of the multiple ones of the laser pulses within the specified duration impinge on the link material of respective first and second selected target links, and wherein the first and second pulse sets have different energy profiles. 23. The method of claim 1, wherein the multiple ones of the laser pulses within the specified duration include a sequence of first, second, and third laser pulses having respective first, second, and third intensities in which the first and third intensities are less than the second intensity. 24. The method of claim 1, wherein the multiple ones of the laser pulses within the specified duration include a sequence of first, second, and third laser pulses having respective first, second, and third intensities in which the first intensity is greater than each of the second and third intensities. 25. The method of claim 1, wherein the step of generating the multiple laser pulses is performed by an operational configuration of a laser and an amplifier. 26. The method of claim 1, wherein the beam positioning system includes a platform that supports the integrated circuit, and wherein the rapid relative motion includes motion of the platform as the laser pulses within the specified duration sever the multiple selected target links. 27. The method of claim 1, wherein the specified duration of multiple ones of the laser pulses is less than 500 ns. 28. The method of claim 1, further comprising operatively coupling a focusing lens to the beam positioning system, and wherein the rapid relative motion includes relative motion of the focusing lens with respect to the multiple selected target links as they are severed by the laser pulses within the specified duration. 29. The method of claim 1, further comprising operatively coupling a focusing lens to the beam positioning system, and wherein: the multiple selected target links comprise links of a memory device or a logic device;the specified duration of multiple ones of the laser pulses is less than 500 ns;the multiple laser pulses have wavelengths between about 200 nm and about 1320 nm;first and second pulse sets of the multiple ones of the laser pulses within the specified duration impinge on the link material of respective first and second selected target links, and a repetition rate between the first and second pulse sets is greater than about 1 kHz;the laser pulses within the specified duration produce at the integrated circuit corresponding laser spots that overlap at one of the multiple selected target links; andthe rapid relative motion includes relative motion of the focusing lens with respect to the multiple selected target links as they are severed by the laser pulses within the specified duration. 30. The method of claim 29, wherein the specified duration has a range of between 10 ns and 200 ns and the multiple ones of laser pulses include 2 to 50 laser pulses.