초록 ▼

A power amplifying semiconductor element is mounted in a package 13, having a heat dissipating surface acting as high frequency ground as well. The package 13 is mounted upside down with flip-chip mounting method in a concave portion 12 formed on a housing 11 having a high frequency ground acting as

A power amplifying semiconductor element is mounted in a package 13, having a heat dissipating surface acting as high frequency ground as well. The package 13 is mounted upside down with flip-chip mounting method in a concave portion 12 formed on a housing 11 having a high frequency ground acting as a heat dissipating surface as well. A cooling mechanism 14 thermally independent from that of the housing 11 is arranged on a heat dissipating base surface of the package 13 facing upward. The cooling mechanism 14 is composed of a heat dissipating fin 15 and a heat pipe 16. The present invention can prevent thermal influence upon other electronic components and can improve greatly the degree of freedom on the designing of the cooling system, because the cooling mechanism of the power amplifying semiconductor element is made independent from that of the housing 11.

대표청구항 ▼

1. A mounting device for a semiconductor package comprising: a housing having a concave portion;a semiconductor package having a base, a semiconductor element on one side of the base, the semiconductor package being mounted on the housing so that a top surface of the semiconductor element opposes a

1. A mounting device for a semiconductor package comprising: a housing having a concave portion;a semiconductor package having a base, a semiconductor element on one side of the base, the semiconductor package being mounted on the housing so that a top surface of the semiconductor element opposes a bottom portion of the concave portion and a side opposing the top surface of the semiconductor element is mounted to the base; anda cooling mechanism provided on an opposing side of the base and on an outer side of the housing,wherein the base is provided with a high frequency ground function and the semiconductor package is provided with a frame surrounding the semiconductor element and a lid for covering the space surrounded by the frame, andwherein the base of the semiconductor package and the housing are connected by a ground connection conductor, thereby a high frequency ground of the semiconductor package and a high frequency ground of the housing are connected to each other. 2. A mounting device for a semiconductor package according to claim 1, wherein the semiconductor package is fixed to the housing by screw at the end of the base. 3. A mounting device for a semiconductor package according to claim 1, wherein the semiconductor package is arranged in the concave portion so that a gap is kept between the semiconductor package and the housing. 4. A mounting device for a semiconductor package according to claim 1, wherein the cooling mechanism comprises a heat dissipating fin and a heat pipe. 5. A mounting device for semiconductor package according to claim 1, further comprising: an input side matching circuit; an output side matching circuit; an input terminal connected with the input side matching circuit; and an output terminal connected with the output side matching circuit;wherein the housing is further provided with a microwave transmission line formed on the periphery of the concave portion through an insulating layer, and one end of the ground connection conductor is connected with the surface of the housing exposed by removing the insulating layer. 6. A mounting device for a semiconductor package according to claim 1, further comprising: the lid covering the semiconductor package, which is disposed between a bottom of the concave portion and a top surface of the semiconductor element.