Folding medical sensor and technique for using the same
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
A61B-005/1455
출원번호
US-0472212
(2009-05-26)
등록번호
US-8352010
(2013-01-08)
발명자
/ 주소
Matlock, George L.
출원인 / 주소
Covidien LP
대리인 / 주소
Fletcher Yoder
인용정보
피인용 횟수 :
0인용 특허 :
747
초록▼
A sensor assembly is provided that includes a frame upon which electrical and optical components may be disposed and a covering, such as an overmold coating, provided about the frame. The frame may be moved between an open and a closed configuration, such as during the manufacture of the sensor asse
A sensor assembly is provided that includes a frame upon which electrical and optical components may be disposed and a covering, such as an overmold coating, provided about the frame. The frame may be moved between an open and a closed configuration, such as during the manufacture of the sensor assembly. The sensor assembly includes a retaining component configured to hold the sensor in the closed configuration when engaged. In one embodiment, the sensor may be placed on a patient's finger, toe, ear, and so forth to obtain pulse oximetry or other physiological measurements.
대표청구항▼
1. A sensor assembly, comprising: a frame configured to move between an open and a closed position by other than a biasing mechanism;an emitter disposed on the frame;a detector disposed on the frame; andan overmolded coating molded over the entire frame to form a unitary sensor assembly. 2. The sens
1. A sensor assembly, comprising: a frame configured to move between an open and a closed position by other than a biasing mechanism;an emitter disposed on the frame;a detector disposed on the frame; andan overmolded coating molded over the entire frame to form a unitary sensor assembly. 2. The sensor assembly of claim 1, wherein the overmolded coating is chemically bonded to the frame. 3. The sensor assembly of claim 1, wherein the overmolded coating comprises an injection molded coating. 4. The sensor assembly of claim 1, comprising a retaining component configured to maintain the sensor assembly in the closed position when the retaining component is engaged. 5. The sensor assembly of claim 4, wherein the retaining component comprises one or more locking tabs formed in the frame or overmolded coating. 6. The sensor assembly of claim 5, wherein the one or more locking tabs have more than one engaged position. 7. The sensor assembly of claim 4, wherein the retaining component comprises an integral structure formed in the frame or overmolded coating. 8. The sensor assembly of claim 4, wherein the retaining component comprises an elastic band that is engaged to hold the sensor assembly in the closed position. 9. The sensor assembly of claim 4, wherein the retaining component comprises a snap fit configured to be engaged when the sensor assembly is moved to the closed position. 10. The sensor assembly of claim 9, wherein the snap fit engages a fitted region of the sensor assembly when the sensor assembly is in the closed position. 11. The sensor assembly of claim 4, wherein the retaining component comprises complementary portions of the sensor assembly configured to provide an interference fit when engaged. 12. The sensor assembly of claim 11, wherein the overmolded coating comprises side extensions configured to exclude ambient light from a volume defined by the sensor assembly when the sensor assembly is in the closed position. 13. A sensor assembly, comprising: a sensor body that is not biased toward either an open configuration or a closed configuration;an emitter disposed on the sensor body;a detector disposed on the sensor body; anda retaining component configured to be engaged when the sensor body is in the closed configuration such that the sensor body is held in the closed configuration until the retaining component is disengaged, wherein the sensor body in the closed configuration completely encloses a volume within one end of the sensor body. 14. The sensor assembly of claim 13, wherein the retaining component comprises one or more complementary engagement features formed in the sensor body. 15. The sensor assembly of claim 13, wherein the complementary engagement features comprise one or more of locking tabs, a snap fit assembly, or an interference fit assembly. 16. The sensor assembly of claim 13, wherein the retaining component comprises an elastic band or strap provided integrally with the sensor body. 17. A method of applying a sensor, comprising: manually closing an overmolded sensor assembly in the absence of a biasing force so that the overmolded sensor assembly completely encloses a volume within one end of the overmolded sensor assembly; andengaging a retaining component configured to maintain the sensor assembly in a closed configuration until such time as the retaining component is disengaged. 18. The method of claim 17, comprising disengaging the retaining component to open the sensor assembly. 19. The method of claim 17, wherein engaging the retaining component comprises engaging one or more complementary structures provided on the sensor assembly to produce a snap fit, an interference fit, or engagement of one or more locking tabs. 20. The method of claim 17, wherein engaging the retaining component comprises positioning an elastic band or strap around the closed sensor assembly.
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이 특허에 인용된 특허 (747)
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