An integrated electronics cooling device including a substrate having a first surface for mounting one or more electronic components and a second surface, a cooling assembly including a cooling chamber bounded on one side by the second surface of the substrate, and a vacuum insulated coolant conduit
An integrated electronics cooling device including a substrate having a first surface for mounting one or more electronic components and a second surface, a cooling assembly including a cooling chamber bounded on one side by the second surface of the substrate, and a vacuum insulated coolant conduit for providing a coolant to and removing the coolant from the cooling assembly.
대표청구항▼
1. An integrated electronics cooling device comprising: a substrate having a first surface for mounting one or more electronic components and a second surface;a cooling assembly including a cooling chamber bounded on one side by the second surface of the substrate;a vacuum insulated coolant conduit
1. An integrated electronics cooling device comprising: a substrate having a first surface for mounting one or more electronic components and a second surface;a cooling assembly including a cooling chamber bounded on one side by the second surface of the substrate;a vacuum insulated coolant conduit for providing a coolant to and removing the coolant from the cooling assembly, the vacuum insulated coolant conduit including: an inner tube forming a tubular coolant passageway that communicates with the cooling chamber;a middle tube forming an annular coolant passageway between the middle tube and the inner tube that communicates with the cooling chamber;an outer tube forming an annular vacuum insulated jacket between the outer tube and the middle tube;wherein one of the tubular coolant passageway and the annular coolant passageway is a coolant supply passageway for supplying the coolant to the cooling chamber and the other of the tubular coolant passageway and the annular coolant passageway is a coolant return passageway for returning the coolant from the cooling chamber; andwherein the annular coolant passageway is the coolant supply passageway and the tubular coolant passageway is the coolant return passageway; andat least one side wail extending around a perimeter of the substrate to form an enclosure for receiving the one or more electronic components. 2. The cooling device of claim 1, further comprising at least one feedthrough opening in one of the side walls for wiring to pass from outside the cavity to the one or more electronic components. 3. The cooling device of claim 1, further comprising a cover adapted to enclose the enclosure formed by the first surface of the substrate and the at least one side wall. 4. The cooling device of claim 1, wherein the vacuum insulated jacket is evacuated via a vent to achieve a vacuum deeper than the vacuum applied to the vent. 5. The cooling device of claim 1, further composing an orifice located between the coolant supply passageway and the cooling chamber, the orifice having a cross-sectional flow area less than or equal to the cross-sectional flow area of the coolant supply passageway. 6. The cooling device of claim 1, wherein the cooling assembly includes a second plate that, in combination with the at least one side wall and the second surface of the substrate, encloses the cooling chamber. 7. The cooling device of claim 1, wherein the coolant is a cryogenic coolant. 8. An integrated electronics cooling device comprising: a substrate having a first surface for mounting one or more electronic components and a second surface;a cooling assembly including a cooling chamber bounded on one side by the second surface of the substrate;a vacuum insulated coolant conduit for providing a coolant to and removing the coolant from the cooling assembly, the vacuum insulated coolant conduit including: an inner tube forming a tubular coolant passageway that communicates with the cooling chamber;a middle tube forming an annular coolant passageway between the middle tube and the inner tube that communicates with the cooling chamber;an outer to tube forming an annular vacuum isolated jacket between the outer tube and the middle tube;wherein one of the tubular coolant passageway and the annular coolant passageway is a coolant supply passageway for supplying the coolant to the cooling chamber and the other of the tubular coolant passageway and the annular coolant passageway is a coolant return passageway for returning the coolant from the cooling chamber; andwherein the annular coolant passageway is the coolant supply passageway and the tubular coolant passageway is the coolant return passageway; andan orifice located between the coolant supply passageway and the cooling chamber, the orifice having cross-sectional flow area less than or equal to the cross-sectional flow area of the coolant supply passageway;wherein the coolant is a liquid coolant that adiabatically expands into a gas across the orifice. 9. An integrated electronics cooling device, comprising: a substrate having a first surface for mounting one or more electronic components and a bottom surface;a cooling assembly including a cooling chamber bounded on one side by the second surface of the substrate;a vacuum insulated coolant conduit for providing a coolant to and removing the coolant from the cooling assembly;an inner tube forming a tubular coolant passageway that communicates with the cooling chamber;a middle tube forming an annular coolant passageway between the middle tube and the inner tube that communicates with the cooling chamber; andan outer tube forming an annular vacuum insulated jacket between the outer tube and the middle tube;wherein one of the tubular coolant passageway and the annular coolant passageway is a coolant supply passageway for supplying the coolant to the cooling chamber and the other of the tubular coolant passageway and the annular coolant passageway is a coolant return passageway for returning the coolant from the cooling chamber; andwherein the inner tube extends into the cooling chamber by a first distance greater than or equal to zero, the first distance at least partially controlling the size and shape of a cooling region on the substrate. 10. The cooling device of claim 9, wherein the middle tube extends a second distance into the cooling chamber, the second distance being less than or equal to the first distance, the relationship between the first distance and the second distance further controlling the size and shape of the cooling region on the substrate. 11. An integrated electronics cooling device comprising: a substrate having a first surface for mounting one or more electronic components and a second surface;a cooling assembly including a cooling chamber bounded on one side by the second surface of the substrate;a vacuum insulated coolant conduit for providing a coolant to and removing the coolant from the cooling assembly, the vacuum insulated coolant conduit comprising: a coolant supply conduit having an outer tube and an inner tube, the inner tube forming a tubular coolant supply passageway that communicates with the cooling chamber, the outer tube forming an annular vacuum insulated jacket between the outer tube and the inner tube; anda coolant return conduit having an outer tube and an inner tube, the inner tube forming a tubular coolant return passageway that communicates with the cooling chamber, the outer tube forming an annular vacuum insulated jacket between the outer tube and the inner tube;the cooling assembly comprising a cooling plate having a groove formed in a first surface thereof, the first surface of the cooling plate being disposed in contact with the second surface of the substrate such that the cooling chamber is bounded by the groove, in the first surface of the cooling plate and the second surface of the substrate, the groove having an inlet end communicating with the coolant supply passageway and an outlet end communicating with the coolant return passageway. 12. The cooling, device of claim 11, further comprising an orifice located between the coolant supply passageway and the inlet end of the groove, the orifice having a cross-sectional flow area equal too less than the cross-sectional flow area of the coolant supply passageway. 13. An integrated electronics cooling device comprising: a mounting substrate having a first surface for mounting one or more electronic components and a second surface;a cooling, assembly including a cooling chamber bounded on one side by the second surface of the mounting substrate;a vacuum insulated coolant conduit for providing a coolant to and removing the coolant from the cooling assembly, the vacuum insulated coolant conduit including an inner tube forming a tubular coolant return passageway that communicates with the cooling chamber, a middle tube forming an annular coolant supply passageway between the middle tube and the inner tube that communicates with the cooling chamber, and an outer tube forming an annular vacuum insulated jacket between the outer tube and the middle tube; anda vacuum insulated chamber insulating at least a portion of the cooling assembly to inhibit condensation from forming on the cooling assembly. 14. The cooling device of claim 13, wherein the vacuum insulated jacket is evacuated via a vent to achieve a vacuum deeper than the vacuum applied to the vent. 15. The cooling device of claim 13, wherein the coolant is a cryogenic coolant. 16. An integrated electronics cooling device compromising: a mounting substrate having a first surface for mounting one or more electronic components and a second surface;a cooling assembly including a cooling plate having a groove formed in a first surface thereof, the first surface of the cooling plate being disposed in contact with the second surface of the substrate such that a cooling chamber formed by the groove in the first surface of the cooling plate and the second surface of the substrate, the groove having an inlet end and an outlet end;a coolant supply conduit for supplying a coolant to the inlet end of the groove, the coolant supply conduit having an outer tube and an inner tube, the inner tube forming a tubular coolant supply passageway that communicates with the cooling chamber, the outer tube forming an annular vacuum insulated jacket between the outer tube and the inner tube; anda coolant return conduit for returning the coolant from the outlet end of the groove, the coolant return conduit having an outer tube and an inner tube, the inner tube forming a tubular coolant return passageway that communicates with the cooling chamber, the outer tube forming an annular vacuum insulated jacket between the outer tube and the inner tube. 17. The cooling device of claim 16, wherein each of the vacuum insulated jackets is evacuated via a vent to achieve a vacuum deeper than the vacuum applied to the vent. 18. The cooling device of claim 16, further comprising, an orifice located between the coolant supply passageway and the inlet end of the groove, the orifice having a cross-sectional flow area equal to or less than the cross-sectional flow area of the coolant supply passageway. 19. The cooling device of claim 16, further comprising: a vacuum insulated chamber insulating at least a portion of the cooling assembly to inhibit condensation from forming on the cooling assembly. 20. A method for cooling an electronic component, comprising: mounting the electronic component on a first surface of a substrate;providing a cryogenic coolant via a vacuum insulated coolant conduit to a cooling chamber bounded on one side by a second surface of the substrate, the cooling chamber including a cavity formed by a cooling assembly attached to the second surface of the substrate, the vacuum insulated coolant conduit including an inner tube forming a tubular coolant passageway that communicates with the cooling chamber, a middle tube forming an annular coolant passageway between the middle tube and the inner tube that communicates with the cooling chamber, and an outer tube forming an annular vacuum insulated jacket between the outer tube and the middle tube;supplying a coolant to the cooling chamber via the annular coolant passageway; andreturning the coolant from the cooling chamber via the tubular coolant passageway. 21. A method for cooling an electronic component, comprising: mounting the electronic component on a first surface of a substrate;providing a cryogenic coolant via a vacuum insulated coolant conduit to a cooling chamber bounded on one side by a second surface of the substrate, the cooling chamber including a cooling plate having a groove formed in an first surface thereof, the first surface of the cooling plate being disposed in contact with the second surface of the substrate such that the cooling chamber is bounded by the groove in the first surface of the cooling plate and the second surface of the substrate, the groove having an inlet end and an outlet end, the vacuum insulated coolant conduit including a coolant supply conduit communicating with the inlet end of the groove, the coolant supply conduit having an outer tube and an inner tube, the inner tube forming a tubular coolant supply passageway that communicates with the cooling chamber, the outer tube forming an annular vacuum insulated jacket between the outer tube and the inner tube, and a coolant return conduit communicating with the outlet end of the groove, the coolant return conduit having an outer tube and an inner tube, the inner tube forming a tubular coolant return passageway that communicates with the cooling chamber, the outer tube forming an annular vacuum insulated jacket between the outer tube and the inner tube;supplying a coolant to the inlet end of the groove via the coolant supply passageway; andreturning the coolant from the outlet end of the groove via the coolant return passageway. 22. A cooling device for use with a coolant, the device comprising: a cooling plate having a first surface and a second surface, the first surface being exposed for contacting an object to be cooled;a cooling chamber bounded on one side by the second surface of the cooing plate and surrounded on at least one other side by a vacuum insulated jacket that is evacuated via a vent to achieve a vacuum deeper than the vacuum applied to the vent; anda vacuum insulated coolant conduit for providing a coolant to and removing the coolant from the cooling chamber, the coolant conduit comprising: an inner tube forming a tubular coolant passageway that communicates with the cooling chamber;is middle tube forming an annular coolant passageway between the middle tube and the inner tube that communicates with the cooling chamber; andan outer tube forming an annular vacuum insulated jacket between the outer tube and the middle tube;wherein the tubular coolant passageway is a coolant supply passageway for supplying the coolant to the cooling chamber and the annular coolant passageway is a coolant return passageway for returning the coolant front the cooling chamber;wherein the inner tube extends into the cooling chamber by a first distance greater than or equal to zero, the first distance at least partially controlling the size and shape of a cooling region on the substrate. 23. The cooling device of claim 22, wherein the middle tube extends a second distance into the cooling chamber, the second distance being less than or equal to the first distance, the relationship between the first distance and the second distance further controlling the size and shape of the cooling region on the substrate.
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이 특허에 인용된 특허 (12)
Bezama,Raschid Jose; Colgan,Evan George; Magerlein,John Harold; Schmidt,Roger Ray, Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages.
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