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A multilayered feedthrough for an implantable medical device includes a substrate having a first edge, a second edge, and a substrate length. A plurality of traces is formed on the substrate and extends along the substrate length. The plurality of traces extends to the first and second edges of the

A multilayered feedthrough for an implantable medical device includes a substrate having a first edge, a second edge, and a substrate length. A plurality of traces is formed on the substrate and extends along the substrate length. The plurality of traces extends to the first and second edges of the substrate. An insulator layer is formed on the substrate and the plurality of traces. A ground plane layer is formed on the insulator layer.

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1. A multilayered feedthrough for an implantable medical device, the feedthrough including a first edge and a second edge, comprising: a substrate having a first edge corresponding to the first edge of the feedthrough, a second edge corresponding to the second edge of the feedthrough, a substrate le

1. A multilayered feedthrough for an implantable medical device, the feedthrough including a first edge and a second edge, comprising: a substrate having a first edge corresponding to the first edge of the feedthrough, a second edge corresponding to the second edge of the feedthrough, a substrate length, a first surface and a second surface opposite the first surface,a first plurality of traces formed on the first surface and extending along the substrate length;a second plurality of traces formed on the second surface and extending along the substrate length;a first plurality of contact pads electrically coupled with the first plurality of traces;a second plurality of contact pads electrically coupled with the second plurality of traces;a first insulator layer formed on the first surface and the first plurality of traces;a second insulator layer formed on the second surface and the second plurality of traces;a first ground plane layer;a second ground plane layer, wherein the first and second plurality of contact pads extend to the first and second edges of the feedthrough; andan integrated capacitor or filtering device, or both formed directly on the first surface of the substrate and the first insulator layer hermetically encasing the capacitor or the filtering device or both. 2. The multilayered feedthrough of claim 1, wherein the first plurality of traces includes at least one power line and at least one signal line for the integrated transceiver. 3. The multilayered feedthrough of claim 2, wherein the first plurality of contact pads and the second plurality of contact pads extend around the first and second edges of the substrate. 4. The multilayered feedthrough of claim 1, further comprising a third insulator layer formed on the first ground plane layer; and a fourth insulator layer formed on the second ground plane layer. 5. The multilayered feedthrough of claim 4, wherein the first and second plurality of contact pads are formed on the third and fourth insulator layers, respectively. 6. The multilayered feedthrough of claim 5, wherein a first plurality of vias electrically couple the first plurality of contact pads with the first plurality of traces, and a second plurality of vias electrically couple the second plurality of contact pads with the second plurality of traces. 7. The multilayered feedthrough of claim 1, wherein the first ground plane layer comprises a continuous layer of conductive material. 8. The multilayered feedthrough of claim 1, wherein the first ground plane layer comprises a mesh of conductive material. 9. The multilayered feedthrough of claim 1, wherein the substrate, the first insulator layer, and the second insulator layer comprise a non-conductive material. 10. The multilayered feedthrough of claim 9, wherein the non-conductive material comprises a high temperature co-fired ceramic. 11. The multilayered feedthrough of claim 1, wherein the substrate further includes a first edge portion proximate the first edge and a second edge portion proximate the second edge, the first and second insulator layers being absent from the first and second edge portions. 12. The multilayered feedthrough of claim 1, wherein the first and second plurality of contact pads are formed on the substrate. 13. An implantable medical device, comprising the multilayered feedthrough of claim 1. 14. The multilayered feedthrough of claim 1, wherein the first ground plane layer is electrically connected with one of the first plurality of traces. 15. A multilayered feedthrough for an implantable medical device, the feedthrough including a first edge and a second edge, comprising: a substrate having a first edge corresponding to the first edge of the feedthrough, a second edge corresponding to the first edge of the feedthrough, and a substrate length,a plurality of traces formed on the substrate and extending along the substrate length;a plurality of contact pads electrically coupled with the plurality of traces;an insulator layer formed on the substrate and the plurality of traces;a ground plane layer, wherein the plurality of contact pads extends to the first and second edges of the feedthrough; andan integrated capacitor or filtering device, or both formed directly on the substrate and the insulator layer hermetically encasing the capacitor or the filtering device or both. 16. The multilayered feedthrough of claim 15, wherein the plurality of traces includes at least one power line and at least one signal line for the integrated transceiver. 17. The multilayered feedthrough of claim 16, wherein the plurality of contact pads extend around the first and second edges of the substrate. 18. The multilayered feedthrough of claim 15, further comprising a second insulator layer formed on the ground plane layer. 19. The multilayered feedthrough of claim 18, wherein the plurality of contact pads are formed on the second insulator layer. 20. The multilayered feedthrough of claim 19, wherein a plurality of vias electrically couple the plurality of contact pads with the plurality of traces. 21. The multilayered feedthrough of claim 15, wherein the ground plane layer comprises a continuous layer of conductive material. 22. The multilayered feedthrough of claim 15, wherein the ground plane layer comprises a mesh of conductive material. 23. The multilayered feedthrough of claim 15, wherein the substrate, the insulator layer, and the second insulator layer comprise a non-conductive material. 24. The multilayered feedthrough of claim 23, wherein the non-conductive material comprises a high temperature co-fired ceramic. 25. The multilayered feedthrough of claim 15, wherein the substrate further includes a first edge portion proximate the first edge and a second edge portion proximate the second edge, the first and second insulator layers being absent from the first and second edge portions. 26. The multilayered feedthrough of claim 15, wherein the ground plane layer is substantially perpendicular to the first and second surfaces. 27. The multilayered feedthrough of claim 15, wherein the plurality of contact pads are formed on the substrate. 28. An implantable medical device, comprising the multilayered feedthrough of claim 15. 29. The multilayered feedthrough of claim 15, wherein the ground plane layer is electrically connected with one of the plurality of traces.