초록 ▼

To provide a semiconductor substrate in which a semiconductor element having favorable crystallinity and high performance can be formed. A single crystal semiconductor substrate having an embrittlement layer and a base substrate are bonded with an insulating layer interposed therebetween; the single

To provide a semiconductor substrate in which a semiconductor element having favorable crystallinity and high performance can be formed. A single crystal semiconductor substrate having an embrittlement layer and a base substrate are bonded with an insulating layer interposed therebetween; the single crystal semiconductor substrate is separated along the embrittlement layer by heat treatment; a single crystal semiconductor layer is fixed to the base substrate; the single crystal semiconductor layer is irradiated with a laser beam; the single crystal semiconductor layer is in a partially melted state to be recrystallized; and crystal defects are repaired. In addition, the energy density of a laser beam with which the best crystallinity of the single crystal semiconductor layer is obtained is detected by a microwave photoconductivity decay method.

대표청구항 ▼

1. A method for manufacturing semiconductor substrates, comprising the steps of: irradiating each of first to n-th (n≧2) single crystal semiconductor substrates with ions to form embrittlement layers in each of the first to n-th single crystal semiconductor substrates;bonding the first to n-th singl

1. A method for manufacturing semiconductor substrates, comprising the steps of: irradiating each of first to n-th (n≧2) single crystal semiconductor substrates with ions to form embrittlement layers in each of the first to n-th single crystal semiconductor substrates;bonding the first to n-th single crystal semiconductor substrates to first to n-th base substrates, with insulating layers provided on at least one of the single crystal semiconductor substrates and the base substrates and interposed between the first to n-th single crystal semiconductor substrates and the first to n-th base substrates, respectively;creating first to n-th single crystal semiconductor layers to the first to n-th base substrates, respectively by separation of the first to n-th single crystal semiconductor substrates, along the embrittlement layers by heat treatment;irradiating a plurality of regions in the first single crystal semiconductor layer having a median of thicknesses of n pieces of the single crystal semiconductor layers with laser beams, wherein each of the plurality of regions is irradiated with a laser beam having different energy density than other laser beams used for irradiation of other regions of the plurality of regions;detecting a plurality of peak values of detection signals of reflected microwaves of the first single crystal semiconductor layer irradiated with the laser beams, by a microwave photoconductivity decay method, wherein an energy density of a laser beam that corresponds to a maximum peak value of the detected signals is expressed by E1max; andirradiating the second to n-th single crystal semiconductor layers with laser beams whose energy density E satisfies the following Formula 1: 0.90E1max+3.9σ≦E≦E1max−3.9σ,wherein σ satisfies the following Formula 2: σ=√{square root over ((2.87σd)2+σe2)},wherein σd represents a standard deviation of thicknesses of n pieces of the single crystal semiconductor layers, andwherein σe represents a standard deviation of the energy density of the laser beams for irradiation. 2. The method for manufacturing semiconductor substrates according to claim 1, wherein the laser beams are emitted with energy density with which the second to n-th single crystal semiconductor layers are in a partially melted state. 3. The method for manufacturing semiconductor substrates according to claim 1, wherein the laser beams are pulsed laser beams. 4. A method for manufacturing semiconductor substrates, comprising the steps of: irradiating each of first to n-th (n≧2) single crystal semiconductor substrates with ions to form embrittlement layers in each of the first to n-th single crystal semiconductor substrates;bonding the first to n-th single crystal semiconductor substrates to first to n-th base substrates, with insulating layers interposed between the first to n-th single crystal semiconductor substrates and the first to n-th base substrates, respectively;creating first to n-th single crystal semiconductor layers to the first to n-th base substrates, respectively by separation of the first to n-th single crystal semiconductor substrates, along the embrittlement layers by heat treatment;irradiating a plurality of regions in the first single crystal semiconductor layer with laser beams, wherein each of the plurality of regions is irradiated with a laser beam having different energy density than other, wherein a thickness of the first single crystal semiconductor layer is the same as, or is the closest to a median of thicknesses of n pieces of the single crystal semiconductor layers;detecting a plurality of peak values of detection signals of reflected microwaves of the first single crystal semiconductor layer irradiated with the laser beams, by a microwave photoconductivity decay method, wherein an energy density of a laser beam that corresponds to a maximum peak value of the detected signals is expressed by E1max; andirradiating the second to n-th single crystal semiconductor layers with laser beams whose energy density E satisfies the following Formula 1: 0.90E1max+3.9σ≦E≦E1max−3.9σ,wherein σ satisfies the following Formula 2: σ=√{square root over ((2.87σd)2+σe2)},wherein σd represents a standard deviation of thicknesses of n pieces of the single crystal semiconductor layers, andwherein σe represents a standard deviation of the energy density of the laser beams for irradiation. 5. The method for manufacturing semiconductor substrates according to claim 4, wherein the laser beams are emitted with energy density with which the second to n-th single crystal semiconductor layers are in a partially melted state. 6. The method for manufacturing semiconductor substrates according to claim 4, wherein the laser beams are pulsed laser beams.