Method of packaging compound semiconductor substrates
원문보기
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0412368
(2009-03-27)
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등록번호 |
US-8381493
(2013-02-26)
|
우선권정보 |
JP-2008-095923 (2008-04-02) |
발명자
/ 주소 |
- Nishiura, Takayuki
- Mezaki, Yoshio
- Yabuhara, Yoshiki
|
출원인 / 주소 |
- Sumitomo Electric Industries, Ltd.
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인용정보 |
피인용 횟수 :
1 인용 특허 :
3 |
초록
▼
Affords a compound semiconductor substrate packaging method for preventing oxidation of the surface of compound semiconductor substrates. The compound semiconductor substrate packaging method provides: a first step of inserting a compound semiconductor substrate (10) into a gas-permeable, rigid cont
Affords a compound semiconductor substrate packaging method for preventing oxidation of the surface of compound semiconductor substrates. The compound semiconductor substrate packaging method provides: a first step of inserting a compound semiconductor substrate (10) into a gas-permeable, rigid container (20), placing the rigid container (20) into an inner-packing pouch (30) having an oxygen transmission rate of 1 to 100 ml·m−2·day−1·atm−1, and a moisture transmission rate of 1 to 15 g·m−2 ·day−1, replacing the air inside the inner-packing pouch (30) with an inert gas, and hermetically sealing the inner-packing pouch; and a second step of placing the sealed inner-packing pouch (30), and a deoxygenating/dehydrating agent (40) that at least either absorbs or adsorbs oxygen gas and moisture, into an outer-packing pouch (60) that has an oxygen transmission rate that is 5 ml·m−2·day−1·atm−1 or less and is lower than that of the inner-packing pouch (30), and a moisture transmission rate that is 3 g·m−2·day−1 or less and is lower than that of the inner-packing pouch (30), and hermetically sealing the outer-packing pouch (60).
대표청구항
▼
1. A compound semiconductor substrate packaging method comprising: a first step of inserting a compound semiconductor substrate into a gas-permeable, rigid container, placing the rigid container into a heat-sealable inner-packing pouch having an oxygen transmission rate of 1 to 100 ml·m−2·day−1·atm−
1. A compound semiconductor substrate packaging method comprising: a first step of inserting a compound semiconductor substrate into a gas-permeable, rigid container, placing the rigid container into a heat-sealable inner-packing pouch having an oxygen transmission rate of 1 to 100 ml·m−2·day−1·atm−1, and a moisture transmission rate of 1 to 15 g·m−2·day−1, replacing the air inside the inner-packing pouch with an inert gas, and heat-sealing the inner-packing pouch containing the inert gas to thereby hermetically seal the inert gas into the pouch; anda second step of placing the sealed inner-packing pouch, and a deoxygenating/dehydrating agent that absorbs or adsorbs at least either oxygen gas or moisture, into an outer-packing pouch that has an oxygen transmission rate that is 5 ml·m−2·day−1·atm−1 or less and is lower than that of the inner-packing pouch, and a moisture transmission rate that is 3 g·m−2·day−1 or less and is lower than that of the inner-packing pouch, and hermetically sealing the outer-packing pouch. 2. A compound semiconductor substrate packaging method as set forth in claim 1, wherein in said first step, the operation of replacing the air inside the inner-packing pouch with an inert gas is carried out by means of an operation in which a vacuum is drawn on the inner-packing pouch by exhausting the air inside, after which an inert gas is flowed into the inner-packing pouch. 3. A compound semiconductor substrate packaging method as set forth in claim 2, wherein in said first step, the pressure of the air inside the inner-packing pouch after a vacuum is drawn on the inner-packing pouch by exhausting the air inside, and prior to the inert gas being flowed into the inner-packing pouch, is 15 torr or less. 4. A compound semiconductor substrate packaging method as set forth in claim 3, wherein: the outer-packing pouch is transparent; andin said second step, an oxygen/moisture indicator for indicating the concentration of at least either oxygen gas or moisture is also placed into the outer-packing pouch. 5. A compound semiconductor substrate packaging method as set forth in claim 2, wherein: the outer-packing pouch is transparent; andin said second step, an oxygen/moisture indicator for indicating the concentration of at least either oxygen gas or moisture is also placed into the outer-packing pouch. 6. A compound semiconductor substrate packaging method as set forth in claim 1, wherein: the outer-packing pouch is transparent; andin said second step, an oxygen/moisture indicator for indicating the concentration of at least either oxygen gas or moisture is also placed into the outer-packing pouch. 7. A compound semiconductor substrate packaging method as set forth in claim 1, wherein the inner-packing pouch is composed substantially of a plastic material or materials, and in said first step the heat-sealing of the inner pouch is by thermoplastic welding. 8. A compound semiconductor substrate packaging method as set forth in claim 1, wherein the outer-packing pouch is heat-sealable, and in said second step is heat-sealed to close the pouch hermetically.
이 특허에 인용된 특허 (3)
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Freund Joseph Michael ; Przybylek George John ; Romero Dennis Mark, Apparatus and method for storing semiconductor objects.
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Brooks Ray G., Method and apparatus for packaging contaminant-sensitive articles and resulting package.
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Havens, Marvin Russell; Barmore, Charles Rice, Non-invasive method of determining oxygen concentration in a sealed package.
이 특허를 인용한 특허 (1)
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Voute, Nicolas, Pouch with incorporated loss of integrity indicator, method for making such a bag, and method for using same.
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