|국가/구분||United States(US) Patent 등록|
|우선권정보||EP-08005606 (2008-03-26); EP-08018167 (2008-10-16)|
|§371/§102 date||20110114 (20110114)|
|발명자 / 주소|
|출원인 / 주소|
|인용정보||피인용 횟수 : 1 인용 특허 : 1|
A vacuum insulation element, which consists of a multi-layer configuration of at least two molded plates, that can be subjected to a vacuum, wherein the molded plates in each case have a surrounding edge region which in each case form a sealing surface, wherein the sealing surfaces of the molded plates are hermetically bonded together in the assembled state thus forming a sealing frame, such that a cavity between the, at least two, molded plates is sealed in a manner that is vacuum-tight, and the structure of the, at least two, molded plates distributes ...
1. A vacuum insulation element (1), that includes: a multi-layer arrangement which can be subjected to a vacuum which contains at least two molded plates (2, 3), whereinthe molded plates (2, 3) have, in each case, a surrounding edge region (7) which, in each case forms a sealing surfaces (13), wherein the sealing surface (13) of the molded plates (2, 3) are hermetically bonded to each other in the assembled state thus forming a sealing frame (12), such that a cavity between the, at least two, molded plates (2, 3) is sealed in a vacuum-tight manner, and w...