Heated planar element and method for its attachment
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05B-003/02
B29C-065/52
출원번호
US-0640703
(2009-12-17)
등록번호
US-8383997
(2013-02-26)
우선권정보
DE-10 2008 063 849 (2008-12-19)
발명자
/ 주소
Keite-Telgenbüscher, Klaus
Junghans, Monika
Dietz, Bernd
Dominikat, Udo
Domann, Frank
Ellringmann, Ute
출원인 / 주소
tesa SE
인용정보
피인용 횟수 :
2인용 특허 :
2
초록▼
A double-sidedly bondable planar element which has an electrical contacting layer via which it is self-regulatingly intrinsically heatable and at the same time has a high flexibility. The particular features of this planar element are that the planar element in the storage condition is adhesive on o
A double-sidedly bondable planar element which has an electrical contacting layer via which it is self-regulatingly intrinsically heatable and at the same time has a high flexibility. The particular features of this planar element are that the planar element in the storage condition is adhesive on one side only, and is therefore particularly easy to handle, and that, on bonding, the adhesive passes through cutouts in the contacting layer, and the planar element thus becomes double-sidedly bondable. The invention further provides a method for the bonding of this planar element, including as a key step the passage of the adhesive through the cutouts in the contacting layer, thus turning a single-sidedly adhesive planar element into a double-sidedly adhesive planar element.
대표청구항▼
1. Planar element having an obverse and a reverse and comprising a heating layer and a contacting layer, the heating layer being composed of an intrinsically heatable self-adhesive which is designed as a conductor which heats up when an electric current is passed through, andthe contacting layer bei
1. Planar element having an obverse and a reverse and comprising a heating layer and a contacting layer, the heating layer being composed of an intrinsically heatable self-adhesive which is designed as a conductor which heats up when an electric current is passed through, andthe contacting layer being designed as an at least substantially two-dimensionally extended contacting element which is perforated by cutouts, and having a first side face and a second side face, the contacting layer via the first side face being in contact with the heating layer and being in electrically conducting communication therewith,whereinthe second side face of the contacting layer forms the obverse of the planar element, and in thatthe cutouts in the contacting element are designed with passage through the thickness of the contacting element and are present in adhesive-free form at least in the region of the second side face. 2. Planar element according to claim 1, wherein the intrinsically heatable self-adhesive is a posistor. 3. Planar element according to claim 1, wherein the first side face of the contacting layer is embedded at least partly in the intrinsically heatable self-adhesive. 4. Planar element according to claim 1, wherein the first side face of the contacting layer bears at least substantially flatly on one side face of the intrinsically heatable self-adhesive. 5. Planar element according to claim 1, wherein the contacting element has a thickness of not more than 50 μm. 6. Planar element according to claim 1, wherein the cutouts make up at least 25% of the area of the first side face of the contacting layer. 7. Planar element according to claim 1, wherein the perforated contacting element has bridge-like regions. 8. Planar element according to claim 7, wherein the bridge-like regions have a width of not more than 5 mm. 9. Planar element according to claim 7, wherein the bridge-like regions of the perforated contacting element are present in a branched comb structure or finger structure. 10. Planar element according to claim 1, wherein the intrinsically heatable self-adhesive comprises at least one electrically conducting filler. 11. Planar element according to claim 10, wherein the electrically conducting filler is selected from the group consisting of graphite, carbon nanoparticles and carbon black. 12. Method of joining a planar element according to claim 1 to at least one bonding substrate, the method comprising the following steps: contacting the planar element with a bonding substrate in such a way that the second side face of the contacting layer touches a region of the surface of the bonding substrate and so forms a loose preassembly,passing the intrinsically heatable self-adhesive through the cutouts in the contacting element and at least partly filling them, andbonding the obverse of the planar element to the bonding substrate via the intrinsically heatable self-adhesive which has passed through the cutouts. 13. Method according to claim 12, wherein, for the passage of the intrinsically heatable self-adhesive through the cutouts in the contacting element, the preassembly composed of planar element and bonding substrate is pressed together. 14. Method according to claim 12, wherein, for the passage of the intrinsically heatable self-adhesive through the cutouts in the contacting element, the preassembly composed of planar element and bonding substrate is heated. 15. Method according to claim 14, wherein the preassembly is heated by passing an electric current through the intrinsically heatable self-adhesive. 16. Method of heating a bonding substrate, comprising providing the bonding substrate with a planar element according to claim 1 and heating the planar element. 17. Planar element having an obverse and a reverse and comprising a heating layer and a contacting layer, the heating layer being composed of an intrinsically heatable self-adhesive which is designed as a conductor which heats up when an electric current is passed through, andthe contacting layer being designed as an at least substantially two-dimensionally extended contacting element which is perforated by cutouts, and having a first side face and a second side face, the contacting layer via the first side face being in contact with the heating layer and being in electrically conducting communication therewith,whereinthe second side face of the contacting layer forms the obverse of the planar element, and in thatthe cutouts in the contacting element are only partially filled with adhesive.
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이 특허에 인용된 특허 (2)
Hall Tom J., Electrical circuits with improved overcurrent protection.
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