IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0173647
(2011-06-30)
|
등록번호 |
US-8384212
(2013-02-26)
|
우선권정보 |
JP-2010-053874 (2010-03-10) |
발명자
/ 주소 |
- Otsuka, Nobuyuki
- Yanagihara, Manabu
- Nagai, Shuichi
- Ueda, Daisuke
|
출원인 / 주소 |
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
3 |
초록
▼
To provide a semiconductor equipment having high heat-transfer effect and breakdown voltage, and a method of manufacturing the same. The semiconductor equipment includes: a sealed container; a stem connected to the sealed container via a stem peripheral portion; and a semiconductor chip mounted on a
To provide a semiconductor equipment having high heat-transfer effect and breakdown voltage, and a method of manufacturing the same. The semiconductor equipment includes: a sealed container; a stem connected to the sealed container via a stem peripheral portion; and a semiconductor chip mounted on a top surface of the stem, inside the sealed container. The semiconductor chip is electrically connected to a lead provided to the stem, the stem peripheral portion, which is of a material that is different from the material of stem and the same as the material of the sealed container, is bonded along a periphery of the stem, and the sealed container is filled with a working fluid including at least one of ethanol, a perfluorocarbon, and a fluoroether.
대표청구항
▼
1. A semiconductor equipment comprising: a sealed container;a stem connected to said sealed container via a stem peripheral portion; anda semiconductor device mounted on a top surface of said stem, inside said sealed container,wherein said semiconductor device is electrically connected to a lead pro
1. A semiconductor equipment comprising: a sealed container;a stem connected to said sealed container via a stem peripheral portion; anda semiconductor device mounted on a top surface of said stem, inside said sealed container,wherein said semiconductor device is electrically connected to a lead provided to said stem,said stem peripheral portion is bonded along a periphery of said stem, said stem peripheral portion being made of a material that is different from a material of said stem and the same as a material of said sealed container,said stem peripheral portion and said sealed container are connected by welding,said sealed container is filled with a working fluid which is any one of a mixed solution of ethanol and perfluorooctane, a mixed solution of ethanol and perfluorobutyl tetrahydrofuran, and a mixed solution of ethanol and ethoxynonafluorobutane, andthe top surface of said stem on which said semiconductor device is mounted has a concave shape. 2. The semiconductor equipment according to claim 1, wherein the mixed solution of ethanol and perfluorooctane consists of 90 percent ethanol and 10 percent perfluorooctane. 3. The semiconductor equipment according to claim 1, wherein the mixed solution of ethanol and perfluorobutyl tetrahydrofuran consists of 70 percent ethanol and 30 percent perfluorobutyl tetrahydrofuran. 4. The semiconductor equipment according to claim 1, wherein the mixed solution of ethanol and ethoxynonafluorobutane consists of 95 percent ethanol and 5 percent ethoxynonafluorobutane. 5. A semiconductor equipment comprising: a sealed container;a stem connected to said sealed container via a stem peripheral portion; anda semiconductor device mounted on a top surface of said stem, inside said sealed container,wherein said semiconductor device is electrically connected to a lead provided to said stem,said stem peripheral portion is bonded along a periphery of said stem, said stem peripheral portion being made of a material that is different from a material of said stem and the same as a material of said sealed container,said stem peripheral portion and said sealed container are connected by welding,said sealed container is filled with a working fluid including at least one of ethanol, a perfluorocarbon, and a fluoroether,said lead is placed inside a lead hole formed in said stem,said lead has a smaller diameter at a bottom-side of said stem than at a top-side of said stem, andsaid lead hole has a smaller diameter at a bottom-side of said stem than at a top-side of said stem. 6. A semiconductor equipment comprising: a sealed container;a stem connected to said sealed container via a stem peripheral portion; anda semiconductor device mounted on a top surface of said stem, inside said sealed container,wherein said semiconductor device is electrically connected to a lead provided to said stem,said stem peripheral portion is bonded along a periphery of said stem, said stem peripheral portion being made of a material that is different from a material of said stem and the same as a material of said sealed container,said stem peripheral portion and said sealed container are connected by welding,said sealed container is filled with a working fluid including at least one of ethanol, a perfluorocarbon, and a fluoroether, andwhen pressure inside said sealed container is represented by P (MPa) and volume by V (m3), a value of P×V is equal to or less than 0.004. 7. The semiconductor equipment according to claim 1, wherein said stem peripheral portion is connected to a bottom portion of said stem by brazing so as to be coplanar with the bottom portion. 8. The semiconductor equipment according to claim 5, wherein said stem peripheral portion is connected to a bottom portion of said stem by brazing so as to be coplanar with the bottom portion. 9. The semiconductor equipment according to claim 6, wherein said stem peripheral portion is connected to a bottom portion of said stem by brazing so as to be coplanar with the bottom portion. 10. The semiconductor equipment according to claim 1, wherein said semiconductor device is connected to said lead using bonding wire, andsaid semiconductor device and the bonding wire are covered with a passivation film. 11. The semiconductor equipment according to claim 5, wherein said semiconductor device is connected to said lead using bonding wire, andsaid semiconductor device and the bonding wire are covered with a passivation film. 12. The semiconductor equipment according to claim 6, wherein said semiconductor device is connected to said lead using bonding wire, andsaid semiconductor device and the bonding wire are covered with a passivation film. 13. The semiconductor equipment according to claim 1, wherein said semiconductor device is flip-chip mounted on said stem. 14. The semiconductor equipment according to claim 1, wherein said semiconductor device is connected onto said stem using a conductive resin. 15. The semiconductor equipment according to claim 1, wherein said semiconductor device is made of a semiconductor that includes a nitride semiconductor or silicon carbide or diamond. 16. The semiconductor equipment according to claim 1, wherein said semiconductor device includes a hetero semiconductor thin film formed on a sapphire substrate or a silicon substrate. 17. The semiconductor equipment according to claim 1, wherein said semiconductor device includes, in a surface of said semiconductor device, an aluminum nitride film or a polycrystalline diamond film. 18. The semiconductor equipment according to claim 1, wherein said semiconductor device, the bonding wire, and said stem include an insulating dielectric film in a surface of said semiconductor device, the bonding wire, and said stem. 19. The semiconductor equipment according to claim 14, wherein said insulating dielectric film is made of aluminum nitride or diamond.
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