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Apparatus and method for facilitating servicing of a liquid-cooled electronics rack 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B21D-053/02
  • B23P-006/00
  • F28D-015/00
  • H01S-004/00
출원번호 US-0942221 (2007-11-19)
등록번호 US-8387249 (2013-03-05)
발명자 / 주소
  • Campbell, Levi A.
  • Chu, Richard C.
  • Ellsworth, Jr., Michael J.
  • Iyengar, Madhusudan K.
  • Simons, Robert E.
  • Singh, Prabjit
출원인 / 주소
  • International Business Machines Corporation
인용정보 피인용 횟수 : 13  인용 특허 : 43

초록

Apparatus and method for facilitating servicing of a liquid-cooled electronics rack are provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of

대표청구항

1. A method of servicing a cooling system of a liquid-cooled electronics rack, the method comprising: filling a cooling system of a liquid-cooled electronics rack employing a coolant servicing apparatus, the electronics rack comprising at least one electronics subsystem cooled by the cooling system,

이 특허에 인용된 특허 (43)

  1. Bash,Cullen E.; Beitelmal,Abdlmonem H.; Sharma,Ratnesh K.; Patel,Chandrakant D., Air-cooled heat generating device airflow control system.
  2. Reyzin,Ilya; Bhatti,Mohinder Singh; Scherer,Lawrence P.; Hayes,Andrew R.; Joshi,Shrikant Mukund, Apparatus for controlling thermal interface between cold plate and integrated circuit chip.
  3. Piccirilli Davide F., Brazing fixture for a heat exchanger.
  4. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cold plate for dual refrigeration systems.
  5. R. Stephen Spinazzola ; Dennis L. Peltz, Computer rack heat extraction device.
  6. Spinazzola, R. Stephen; Peltz, Dennis L., Computer room air flow method and apparatus.
  7. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Schmidt,Roger R.; Simons,Robert E., Condensate removal system and method for facilitating cooling of an electronics system.
  8. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow.
  9. Bash, Cullen E.; Patel, Chandrakant D.; Beitelmal, Abdlmonem H.; Sharma, Ratnesh K., Cooling of data centers.
  10. Fukuda, Hiroshi; Fujita, Kenji, Cooling structure for disk storage device.
  11. Patel, Chandrakant D.; Bash, Cullen E., Cooling system.
  12. Patel, Chandrakant D.; Bash, Cullen E., Cooling system.
  13. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Schmidt,Roger R.; Simons,Robert E.; Zoodsma,Randy J., Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems.
  14. Day, Tony, Data center cooling.
  15. Donald J. Schumacher ; William C. Beckman, Data center cooling system.
  16. Lotz Paul B. (1860 Schwenksville Rd. Schwenksville PA 19473), Enclosure for electronic equipment.
  17. Malone,Christopher G.; Simon,Glenn C., External liquid loop heat exchanger for an electronic system.
  18. Woerner, Klaus W.; Armstrong, Ross D., Folded-fin heatsink manufacturing method and apparatus.
  19. Teneketges,Nicholas J.; Kwok,Tarzen, Heat exchange apparatus with parallel flow.
  20. Jordan William D. (Dallas TX) Smithers Matthew C. (Lewisville TX), Heat sink attachment assembly.
  21. Payne, Dave A., High efficiency pump for liquid-cooling of electronics.
  22. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Hybrid cooling system and method for a multi-component electronics system.
  23. Mongia,Rajiv K.; Pokharna,Himanshu; DiStefano,Eric; McEuen,Shawn S.; Wilk,Brian A., IC coolant microchannel assembly with integrated attachment hardware.
  24. Chrysler,Gregory M.; Prasher,Ravi, Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon.
  25. Campbell,Levi A.; Chu,Richard C.; Ellsworth,Michael J.; Iyengar,Madhusudan K.; Porter,Donald W.; Schmidt,Roger R.; Simons,Robert E., Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing.
  26. Shih, Shoei-Yuan, Liquid cooled radiation module for servers.
  27. Belady,Christian L., Liquid cooled system module.
  28. Hamman,Brian A., Liquid cooling system.
  29. Ota,Shigemi; Matsushita,Shinji, Liquid cooling system for a rack-mount server system.
  30. Chu, Richard C.; Ellsworth, Jr., Michael J.; Furey, Edward; Schmidt, Roger R.; Simons, Robert E., Method and apparatus for combined air and liquid cooling of stacked electronics components.
  31. Hall,Shawn A.; Tian,Shurong; Coteus,Paul W.; Karidis,John P.; Colgan,Evan G.; Guernsey, Jr.,Robert W., Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling.
  32. Corrado,Joseph P.; Eberth,John F.; Mazzuca,Steven J.; Schmidt,Roger R.; Tsukamoto,Takeshi, Method and apparatus for cooling electronic components.
  33. Weber,Richard M.; Barson,George F.; Koehler,Michael D., Method and apparatus for cooling heat-generating structure.
  34. Chu, Richard C.; Ellsworth, Jr., Michael J.; Furey, Edward; Schmidt, Roger R.; Simons, Robert E., Method for combined air and liquid cooling of stacked electronics components.
  35. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Method of assembling a cooling system for a multi-component electronics system.
  36. Colbert,John Lee; Eckberg,Eric Alan; Hamilton,Roger Duane; Hoffmeyer,Mark Kenneth; Mikhail,Amanda Elisa Ennis; Sinha,Arvind Kumar, Mounting a heat sink in thermal contact with an electronic component.
  37. Murakami,Vance; Belady,Christian L., Rack-mount equipment bay cooling heat exchanger.
  38. Novotny, Shlomo D., Self-cooled electronic equipment enclosure with failure tolerant cooling system and method of operation.
  39. Bash,Cullen E.; Simon,Glenn C.; Malone,Christopher G.; Sharma,Ratnesh K., Small form factor liquid loop cooling system.
  40. Belady, Christian; Tanksalvala, Darius; Gostin, Gary, System and method for cooling an electronic component.
  41. Ellsworth, Jr., Michael J.; Krug, Jr., Francis R.; Mullady, Robert K.; Schmidt, Roger R.; Seminaro, Edward J., System and method for facilitating cooling of a liquid-cooled electronics rack.
  42. Murakami,Vance; Hintz,Robert; Coles,Henry C., System for hot swapping heat exchangers.
  43. Novotny, Shlomo; Rousmaniere, Arthur S.; Vogel, Marlin, Water-cooled system and method for cooling electronic components.

이 특허를 인용한 특허 (13)

  1. Shelnutt, Austin Michael; North, Travis C.; Helberg, Christopher M.; Bailey, Edmond I., Information handling system having fluid manifold with embedded heat exchanger system.
  2. Shelnutt, Austin Michael; North, Travis C.; Helberg, Christopher M., Integrated air-spring for hydraulic force damping of a rigid liquid cooling subsystem.
  3. Shelnutt, Austin Michael; North, Travis C.; Helberg, Christopher M.; Curlee, James Don; Huang, Chin-An, Liquid cooled rack information handling system having storage drive carrier for leak containment and vibration mitigation.
  4. Shelnutt, Austin Michael; North, Travis C.; Helberg, Christopher M., Liquid flow control based upon energy balance and fan speed for controlling exhaust air temperature.
  5. Desiano, Frank M.; Edwards, David L.; Mullady, Robert K.; Porter, Donald W.; Zoodsma, Randy, Liquid-cooled heat sink configured to facilitate drainage.
  6. Desiano, Frank M.; Edwards, David L.; Mullady, Robert K.; Porter, Donald W.; Zoodsma, Randy, Liquid-cooled heat sink configured to facilitate drainage.
  7. Desiano, Frank M.; Edwards, David L.; Mullady, Robert K.; Porter, Donald W.; Zoodsma, Randy, Liquid-cooled heat sink configured to facilitate drainage.
  8. Shelnutt, Austin Michael; Vancil, Paul W.; Stuewe, John R.; Bailey, Edmond I., Runtime service of liquid cooled servers operating under positive hydraulic pressure without impacting component performance.
  9. Shelnutt, Austin Michael; North, Travis C.; Helberg, Christopher M.; Bailey, Edmond I., Scalable rack-mount air-to-liquid heat exchanger.
  10. Shaw, Mark Edward; Vu, Wilson V.; Peterson, Martha Geoghegan; Thai, Hien A.; Peterson, Eric C., Sidewall-accessible dense storage rack.
  11. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced air and liquid cooling of an electronic system.
  12. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madusudan K.; Simons, Robert E.; Singh, Prabjit, Two-phase, water-based immersion-cooling apparatus with passive deionization.
  13. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Michael J.; Iyengar, Madhusudan K.; Simons, Robert E.; Singh, Prabjit, Two-phase, water-based immersion-cooling apparatus with passive deionization.
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