Wafer container with purgeable supporting module
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B65D-085/30
H01L-021/673
출원번호
US-0183522
(2011-07-15)
등록번호
US-8387799
(2013-03-05)
우선권정보
TW-97132635 A (2008-08-27); TW-100208340 U (2011-05-10)
발명자
/ 주소
Chiu, Ming-Long
Hung, Kuo-Chun
Ku, Chen-Wei
Sheng, Jain-Ping
Hou, Yi-Liang
출원인 / 주소
Gudeng Precision Industrial Co, Ltd.
인용정보
피인용 횟수 :
2인용 특허 :
11
초록▼
A wafer container includes a container body, formed by a pair of side walls, a top surface, and a bottom surface, a supporting module being disposed on each of said sidewall for supporting a plurality of wafers; and a door joining with opening of the container body with its inner surface for protect
A wafer container includes a container body, formed by a pair of side walls, a top surface, and a bottom surface, a supporting module being disposed on each of said sidewall for supporting a plurality of wafers; and a door joining with opening of the container body with its inner surface for protecting the plurality of wafers within the container body, the characteristic in that: a purgeable supporting module is respectively disposed between each sidewall to of the container body and the back wall, a long slit is further disposed on the side of purgeable supporting module facing the opening and a porous material is disposed within the long slit, and an air inlet is further disposed on one end of the purgeable supporting module for being connected to a gas valve, wherein the purgeable supporting module is composed of a plurality of supporting ribs vertically arranged at intervals.
대표청구항▼
1. A wafer container including a container body formed by a top surface and a bottom surface a pair of sidewalls, with an opening between said pair of sidewalls and a back wall formed opposite said opening, a pair of supporting modules being disposed on said pair of sidewalls for supporting a plural
1. A wafer container including a container body formed by a top surface and a bottom surface a pair of sidewalls, with an opening between said pair of sidewalls and a back wall formed opposite said opening, a pair of supporting modules being disposed on said pair of sidewalls for supporting a plurality of wafers; and a door with an outer surface and an inner surface, said door joining with said opening of said container body via said inner surface for protecting said plurality of wafers in said container body, the characteristic in that: a purgeable supporting module is further respectively disposed between each of said pair of sidewalls and said back wall of said container body, a long slit being disposed on said purgeable supporting module facing said opening and a porous material being disposed within said long slit, a gas inlet being disposed on one end of said purgeable supporting module and connected to a gas valve on said bottom surface, wherein said purgeable supporting module is composed of a plurality of supporting ribs vertically arranged at intervals, and the plurality of supporting ribs are separated from the long slit. 2. The wafer container according to claim 1, where said porous material is a ceramic material. 3. The wafer container according to claim 1, wherein said purgeable supporting module is an integrated structure. 4. A wafer container including a container body formed by a top surface and a bottom surface a pair of sidewalls, with an opening between said pair of sidewalls and a back wall formed opposite said opening, a pair of supporting modules being disposed on said pair of sidewalls for supporting a plurality of wafers; and a door with an outer surface and an inner surface, said door joining with said opening of said container body via said inner surface for protecting said plurality of wafers in said container body, the characteristic in that: at least a purgeable supporting module is further respectively disposed between each of said pair of sidewalls and said back wall of said container body, one end of said purgeable supporting module being disposed with a gas inlet and being connected with a gas valve on said bottom surface, said purgeable supporting module being formed by a first part and a second part and a long slit being formed where said first part and said second part are adjacent, a porous material being disposed within said long slit, wherein said first part and said second part of said purgeable supporting module are respectively disposed with a plurality of supporting ribs vertically arranged at intervals, and the plurality of supporting ribs are separated from the long slit. 5. The wafer container according to claim 4, where said porous material is a ceramic material. 6. A wafer container including a container body formed by a pair of sidewalls, a top surface and a bottom surface adjacent to said pair of sidewalls, with an opening formed between said pair of sidewalls and a back wall formed opposite said opening, a pair of supporting modules being disposed on said pair of sidewalls for supporting a plurality of wafers; and a door with an outer surface and an inner surface, said door joining with said opening of said container body via said inner surface for protecting said plurality of wafers in said container body, the characteristic in that: at least a purgeable supporting module is further respectively disposed between each of said pair of sidewalls and said back wall of said container body, one end of said purgeable supporting module being disposed with a gas inlet and being connected with a gas valve on said bottom surface, said purgeable supporting module being formed by a first part and a second part and a long slit being formed where said first part and said second part are adjacent, a porous material being disposed within said long slit, wherein said first part of said purgeable supporting module is disposed with a plurality of supporting ribs vertically arranged at intervals and said second part of said purgeable supporting module is disposed with a plurality of restraint components vertically arranged at intervals, the plurality of supporting ribs separated from the long slit. 7. The wafer container according to claim 6, where said porous material is a ceramic material. 8. A wafer container including a container body formed by a top surface and a bottom surface a pair of sidewalls, with an opening formed between said pair of sidewalls and a back wall formed opposite said opening, a pair of supporting modules being disposed on said pair of sidewalls for supporting a plurality of wafers; and a door with an outer surface and an inner surface, said door joining with said opening of said container body via said inner surface for protecting said plurality of wafers in said container body, the characteristic in that: at least a purgeable supporting module is disposed respectively between each of said pair of sidewalls and said back wall of said container body, said purgeable supporting module including a main body with one end disposed with a gas inlet and connected with a gas valve on said bottom surface, said purgeable supporting module further including an array of plurality of supporting ribs vertically arranged at intervals and an array of plurality of restraint components vertically arranged at intervals for said plurality of wafers to be co-supported by said plurality of supporting ribs, said plurality of restraint components and said plurality of supporting modules on said pair of sidewalls, wherein at least a long slit is disposed between said plurality of supporting ribs and said plurality of restraint components without overlapping said plurality of supporting ribs, and a porous material is disposed within said long slit. 9. The wafer container according to claim 8, where said porous material is a ceramic material.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (11)
Toshihiko Miyajima JP, Clean box, clean transfer method and apparatus therefor.
Takanabe Eiichiro (Kanagawa JPX), Wafers transferring method in vertical type heat treatment apparatus and the vertical type heat treatment apparatus prov.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.