초록 ▼

Dental compositions and biphenyl di(meth)acrylate monomers are described. The dental compositions comprise at least one biphenyl di(meth)acrylate monomer comprising two aromatic rings connected with a C—C bond wherein the rings each comprise a substituent comprising a urethane moiety and a (meth)acr

Dental compositions and biphenyl di(meth)acrylate monomers are described. The dental compositions comprise at least one biphenyl di(meth)acrylate monomer comprising two aromatic rings connected with a C—C bond wherein the rings each comprise a substituent comprising a urethane moiety and a (meth)acrylate end group.

대표청구항 ▼

1. A hardenable dental composition comprising at least one biphenyl monomer having the general structure wherein R2 is independently a halogen or a C1 to C4 alkyl group;m ranges from 0 to 4;z is an aromatic ring;t is independently 0;Q is independently O or S;L is independently a C2 to C12 alkylene g

1. A hardenable dental composition comprising at least one biphenyl monomer having the general structure wherein R2 is independently a halogen or a C1 to C4 alkyl group;m ranges from 0 to 4;z is an aromatic ring;t is independently 0;Q is independently O or S;L is independently a C2 to C12 alkylene group optionally substituted with one or more hydroxyl groups;n independently ranges from 0 to 10;L′ is independently a C2 to C12 alkylene group; andR1 is independently H or methyl. 2. The hardenable dental composition of claim 1 wherein each substituent has a molecular weight of less than 500 g/mole. 3. The hardenable dental composition of claim 1 wherein the substituents further comprise an alkoxy group. 4. The hardenable dental composition of claim 1 wherein the substituents are bonded at an ortho position of the aromatic rings. 5. The hardenable dental composition of claim 1 wherein the biphenyl monomer is a solid at 25° C. 6. The hardenable dental composition of claim 5 wherein the dental composition further comprises at least one other ethylenically unsaturated monomer that is a liquid at 25° C. 7. The hardenable dental composition of claim 1 wherein the biphenyl monomer is a liquid at 25° C. 8. The hardenable dental composition of claim 1 wherein the composition further comprises at least one filler. 9. The hardenable dental composition of claim 8 wherein the filler comprises inorganic nanoparticles. 10. The hardenable dental composition of claim 9 wherein the inorganic nanoparticles comprise silica, zirconia, or mixtures thereof. 11. The hardenable dental composition of claim 9 wherein the nanoparticles are in the form of nanoclusters. 12. The hardenable dental composition of claim 1 wherein Q is oxygen. 13. The hardenable dental composition of claim 1 wherein m is 0. 14. The hardenable dental composition of claim 1 wherein n is 1 and L ranges from C2 to C8. 15. A dental article comprising the hardenable dental composition of claim 1 at least partially hardened. 16. A dental article comprising the hardenable dental composition of claim 1 wherein the composition is in the form self-supporting, malleable structure having a first semi-finished shape. 17. A method of treating a tooth surface, the method comprising providing a hardenable dental composition according to claim 1, wherein the composition is in the form self-supporting, malleable structure having a first semi-finished shape; placing the hardenable dental composition on a tooth surface in the mouth of a subject;customizing the shape of the hardenable dental composition; andhardening or partially hardening the hardenable dental composition. 18. A biphenyl di(meth)acrylate monomer having the general structure wherein R2 is independently Br or a C1 to C4 alkyl group;m ranges from 0 to 4;z is an aromatic ring;t is independently 0;Q is independently O or S;L is independently a C2 to C12 alkylene group optionally substituted with one or more hydroxyl groups;n independently ranges from 0 to 10; andwherein R1 is independently H or methyl. 19. The biphenyl di(meth)acrylate monomer of claim 1 wherein the biphenyl di(meth)acrylate monomer is a liquid at 25° C.