초록 ▼

Backside recesses in a base member host components, such as sensors or circuits, to allow closer proximity and efficient use of the surface space and internal volume of the base member. Recesses may include covers, caps, filters and lenses, and may be in communication with circuits on the frontside

Backside recesses in a base member host components, such as sensors or circuits, to allow closer proximity and efficient use of the surface space and internal volume of the base member. Recesses may include covers, caps, filters and lenses, and may be in communication with circuits on the frontside of the base member, or with circuits on an active backside cap. An array of recessed components may a form complete, compact sensor system.

대표청구항 ▼

1. A sensor system comprising: a base having a frontside surface, and a backside surface comprising a plurality of recesses, and wherein the base further comprises at least one recess via from a recess to the frontside surface;a plurality of sensors, two or more of the recesses each having at least

1. A sensor system comprising: a base having a frontside surface, and a backside surface comprising a plurality of recesses, and wherein the base further comprises at least one recess via from a recess to the frontside surface;a plurality of sensors, two or more of the recesses each having at least one of the sensors; andat least one of the two or more recesses having a port configured to permit entry of environmental media for receipt by its sensor(s). 2. A sensor system according to claim 1, further including circuitry coupled to at least two of the plurality of sensors, wherein the circuitry coordinates the activity of the at least two sensors. 3. A sensor system according to claim 1 wherein at least one recess has at least one sensor and at least one additional circuit element. 4. A sensor system according to claim 3 wherein the at least one sensor and the at least one additional circuit element are in a stacked configuration. 5. A sensor system according to claim 3 wherein the at least one sensor and the at least one additional circuit element are in a side-by-side configuration. 6. A sensor system according to claim 3 wherein the at least one sensor is encapsulated. 7. A sensor system according to claim 1, wherein the port comprises an open aperture. 8. A sensor system according to claim 1 wherein at least one recesses further comprises one of a cover, a filter that selectively permits environmental media to access the recess and a lens that focuses environmental media. 9. A sensor system according to claim 8 wherein the filter, cover or lens further comprises an interlocking feature adapted to secure the filter to the base. 10. A sensor system according to claim 1, further comprising a cover with at least one of a filter that selectively permits environmental media to access the recess and a lens that focuses environmental media. 11. A sensor system according to claim 10, wherein the cover comprises a laminated member. 12. A sensor system according to claim 11, wherein the laminated member is prefabricated prior to being coupled to the backside surface. 13. A sensor system according to claim 10 wherein the cover comprises circuitry. 14. A sensor system according to claim 1, wherein at least two of the sensors sense the same environmental media. 15. A sensor system according to claim 1, wherein at least two of the sensors sense different environmental media. 16. A sensor system according to claim 1 comprising a first sensor in a first recess, and a second sensor in a second recess, wherein the first sensor and the second sensor are configured to sense the same environmental media, and the second sensor is isolated from the environment external to the second recess. 17. A sensor system according to claim 1 wherein the base comprises silicon. 18. A sensor system according to claim 17 wherein the base further comprises integrated circuits on the frontside surface. 19. A sensor system according to claim 1 wherein the base further comprises a via all the way through the base.