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Housing for encasing an object 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65D-085/00
  • B65D-006/40
  • G06F-001/16
  • H04M-001/00
출원번호 US-0355447 (2012-01-20)
등록번호 US-8393466 (2013-03-12)
발명자 / 주소
  • Rayner, Gary
출원인 / 주소
  • Treefrog Developments, Inc
대리인 / 주소
    Mintz Levin Cohn Ferris Glovsky and Popeo PC
인용정보 피인용 횟수 : 83  인용 특허 : 131

초록

This disclosure relates generally to an apparatus and/or system for housing a device. The apparatus includes a housing that is configured such that a device may be fitted within the housing and thereby be protected, such as from shocks and/or liquid. The housing may include top and bottom members th

대표청구항

1. A housing within which an electronic device may be fitted, the housing comprising: a top member and a bottom member configured for being removably coupled together to form the housing, each top and bottom member of the housing comprising a front surface and a back surface each surrounded by a per

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이 특허를 인용한 특허 (83)

  1. Rayner, Gary A., Accessories for use with housing for an electronic device.
  2. Rayner, Gary A., Accessory for use with housing for an electronic device.
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  9. Huang, Daniel; Brand, Matthew, Battery pack, holster, and extendible processing and interface platform for mobile devices.
  10. Huang, Daniel; Brand, Matthew, Battery pack, holster, and extendible processing and interface platform for mobile devices.
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