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CMP pad dressers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-055/00
출원번호 US-0267172 (2008-11-07)
등록번호 US-8393938 (2013-03-12)
발명자 / 주소
  • Sung, Chien-Min
출원인 / 주소
  • Sung, Chien-Min
대리인 / 주소
    Thorpe North & Western LLP
인용정보 피인용 횟수 : 1  인용 특허 : 107

초록

An abrasive tool includes an assembly of tool precursors. At least one of the tool precursors has a continuous polycrystalline diamond, polycrystalline cubic boron nitride, or ceramic material cutting element formed into a blade shape. The abrasive tool can additionally include a setting material, w

대표청구항

1. An abrasive tool, comprising: an assembly of tool precursors including at least one elongated substrate having a continuous cutting element of polycrystalline diamond, polycrystalline cubic boron nitride, or ceramic formed into a blade shape on a surface thereof; anda setting material configured

이 특허에 인용된 특허 (107)

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  40. Chien-Min Sung TW; Frank Lin TW, Diamond grid CMP pad dresser.
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  100. Zador Eugene (Ballston Lake NY) Hsu Shyiguei (Watervliet NY) Kaczmarek Wesley R. (Ballston Lake NY) Ravipati Sitaramaiah (Latham NY) Supkis Stanley (Averill Park NY) Vogel Richard H. (Saratoga Spring, Single step, radiation curable ophthalmic fining pad.
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  103. Preston Jay B. ; Tselesin Naum N. ; Gorsuch Ian,GBX, Tools with abrasive segments.
  104. Wu Shih-Jen (Pittsburgh PA) Lawton Ernest L. (Allison Park PA), Twistable chemically treated glass fibers, fabrics and coated articles.
  105. Ishizaki, Junji; Ito, Kenji; Fujii, Tsuyoshi; Watanabe, Kimihiro, Vitrified bond tool and method of manufacturing the same.
  106. Ishizaki,Junji; Ito,Kenji; Fujii,Tsuyoshi; Watanabe,Kimihiro, Vitrified bond tool and method of manufacturing the same.
  107. Sakuma, Noriyuki; Tsunenari, Kinji, Wafer polishing method and wafer polishing apparatus in semiconductor fabrication equipment.

이 특허를 인용한 특허 (1)

  1. Kasonde, Maweja; Barry, John James, Method of making a bit for a rotary drill.
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