초록 ▼

A substrate processing apparatus includes a processing chamber for accommodating therein a processing target substrate; a gas exhaust path through which a gas inside the processing chamber is exhausted; one or more exhaust pumps provided in the gas exhaust path; and a scrubber for collecting harmful

A substrate processing apparatus includes a processing chamber for accommodating therein a processing target substrate; a gas exhaust path through which a gas inside the processing chamber is exhausted; one or more exhaust pumps provided in the gas exhaust path; and a scrubber for collecting harmful components from an exhaust gas. The apparatus further includes an ionized gas supply unit for supplying to the gas exhaust path an ionized gas for neutralizing charged particles included in the exhaust gas flowing therethrough.

대표청구항 ▼

1. A substrate processing apparatus comprising: a processing chamber for accommodating therein a processing target substrate;a first gas exhaust path connected to the processing chamber through which a gas inside the processing chamber is exhausted;an exhaust pump provided downstream of the first ga

1. A substrate processing apparatus comprising: a processing chamber for accommodating therein a processing target substrate;a first gas exhaust path connected to the processing chamber through which a gas inside the processing chamber is exhausted;an exhaust pump provided downstream of the first gas exhaust path;a second gas exhaust path connected to the exhaust pump;a scrubber provided downstream of the second gas exhaust path for collecting harmful components from the exhaust gas in the second gas exhaust path; andan ionized gas providing unit configured to provide an ionized gas to the first or the second gas exhaust path or to the exhaust pump to thereby neutralize charged particles included in the exhaust gas flowing therethrough. 2. The apparatus of claim 1, wherein the ionized gas providing unit is provided in the first gas exhaust path at immediately upstream of the exhaust pump. 3. The apparatus of claim 2, wherein the ionized gas providing unit is an ionized gas supply pipe connected to the first gas exhaust path to provide the ionized gas. 4. The apparatus of claim 1, wherein the ionized gas is a gas containing positive and negative ions. 5. The apparatus of claim 1, wherein the ionized gas providing unit is provided to the second gas exhaust path at immediately downstream of the exhaust pump. 6. The apparatus of claim 5, wherein the ionized gas unit is a gas ionizing unit. 7. The apparatus of claim 6, wherein the gas ionizing unit includes one or more of a soft X-ray ionizer, a corona discharge ionizer, a local plasma generator, and a UV beam irradiation ionizer. 8. A method for exhausting a gas inside a processing chamber of a substrate processing apparatus by neutralizing charged particles included in the exhaust gas, in which the apparatus includes the processing chamber for accommodating therein a processing target substrate; a first gas exhaust path connected to the processing chamber through which the gas inside the processing chamber is exhausted; an exhaust pump provided at downstream of the first gas exhaust path; a second gas exhaust path connected to the exhaust pump; a scrubber provided at downstream of the second gas exhaust path for collecting harmful components from the exhaust gas in the second gas exhaust path; and an ionized gas providing unit for providing an ionized gas to the first or the second gas exhaust path or to the exhaust pump to thereby neutralize the charged particles included in the exhaust gas flowing therethrough, the method comprising: providing the ionized gas to the exhaust gas flowing through the first or the second gas exhaust path or to the exhaust pump by the ionized gas providing unit to charge-neutralize the charged particles included in the exhaust gas. 9. The method of claim 8, wherein the ionized gas is provided in the first gas exhaust path at immediately upstream of the exhaust pump or in the second gas exhaust path at immediately downstream of the exhaust pump. 10. The method of claim 8, wherein the ionized gas is a gas containing positive and negative ions. 11. The method of claim 8, wherein the ionized gas providing unit is a gas ionizing unit and said providing the ionized gas includes ionizing the exhausted gas in the second gas exhaust path. 12. The method of claim 11, wherein the gas ionizing unit includes one or more of a soft X-ray ionizer, a corona discharge ionizer, a local plasma generator, and an UV beam irradiation ionizer.