Method of manufacturing organic light emitting device with water vapor absorption material containing transparent sealant layer
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-033/62
H01L-051/40
출원번호
US-0163631
(2011-06-17)
등록번호
US-8399270
(2013-03-19)
우선권정보
KR-10-2005-0135858 (2005-12-30)
발명자
/ 주소
Cho, Yoon-Hyeung
Lee, Jong-Hyuk
Kim, Won-Jong
Oh, Min-Ho
Lee, Byoung-Duk
Choi, Jin-Baek
출원인 / 주소
Samsung Display Co., Ltd.
대리인 / 주소
Knobbe Martens Olson & Bear LLP
인용정보
피인용 횟수 :
1인용 특허 :
14
초록▼
Disclosed is an organic light emitting device which includes a substrate; a encapsulation substrate, an organic light emitting unit interposed between the substrate and the encapsulation substrate. A water vapor absorption material-containing transparent sealant layer covers the organic light emitti
Disclosed is an organic light emitting device which includes a substrate; a encapsulation substrate, an organic light emitting unit interposed between the substrate and the encapsulation substrate. A water vapor absorption material-containing transparent sealant layer covers the organic light emitting unit. The sealant layer includes a transparent sealant having a water vapor transmission rate (WVTR) of about 20 g/m2·day or less and a water vapor absorption material having an average particle size of about 100 nm or less.
대표청구항▼
1. A method of manufacturing an organic light emitting device, the method comprising: forming an organic light emitting unit on a substrate, the organic light emitting unit comprising a first electrode, a second electrode and an organic layer interposed between the first and second electrodes;coatin
1. A method of manufacturing an organic light emitting device, the method comprising: forming an organic light emitting unit on a substrate, the organic light emitting unit comprising a first electrode, a second electrode and an organic layer interposed between the first and second electrodes;coating on a surface of an encapsulation substrate a composition comprising a sealant, at least one water vapor absorption material and a solvent, wherein the sealant is substantially transparent and has a water vapor transmission rate (WVTR) of about 20 g/m2·day or less, wherein the WVTR is measured using a film of the sealant having a thickness of 100 μm in an environment at the temperature of 38° C. and the relative humidity of 100%, wherein the at least one water vapor absorption material is selected from the group consisting of metal oxide and metal salt having an average particle size of about 100 nm or less; andarranging the encapsulation substrate and the substrate such that the composition contacts the organic light emitting unit between the encapsulation substrate and the organic light emitting unit; andcuring the composition so as to form a water vapor absorption material-containing sealant layer. 2. The method of claim 1, wherein the amount of the sealant in the composition is in the range of about 1000 parts by weight to about 4000 parts by weight based on 100 parts by weight of the water vapor absorption material. 3. The method of claim 1, wherein the solvent comprises at least one material selected from the group consisting of ethanol, methanol, propanol, butanol, isopropanolme, methyl ethyl ketone, deionized water, propylene glycol (mono) methyl ether (PGM), isopropylcellulose (IPC), methylcellusolve (MC), and ethylcellosolve (EC), wherein the amount of the solvent is in the range of about 100 parts by weight to about 1900 parts by weight based on 100 parts by weight of the water vapor absorption material. 4. The method of claim 1, wherein the composition further comprises at least one dispersant selected from the group consisting of a low molecular weight organic dispersant, a high molecular weight organic dispersant, a low molecular weight organic/inorganic complex dispersant, a high molecular weight organic/inorganic complex dispersant, and an organic acid, wherein the amount of the dispersant is in the range of about 1 to about 100 parts by weight based on 100 parts by weight of the water vapor absorption material. 5. The method of claim 1, wherein coating is performed by dip coating, spray coating, dispensing coating, or screen printing. 6. The method of claim 1, wherein curing is performed by thermal curing or UV curing. 7. The method of claim 6, wherein the thermal curing is performed at a temperature in the range of about 50° C. to about 200° C. 8. The method of claim 1, wherein the organic light emitting unit further comprises a protective layer, which contacts the composition.
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