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Cooling manifold 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
  • H01M-010/50
출원번호 US-0433427 (2009-04-30)
등록번호 US-8403030 (2013-03-26)
발명자 / 주소
  • Payne, Josh
출원인 / 주소
  • LG Chem, Ltd.
대리인 / 주소
    Buckert Patent & Trademark Law Firm, P.C.
인용정보 피인용 횟수 : 4  인용 특허 : 100

초록

A cooling manifold and a method for manufacturing the cooling manifold are provided. The cooling manifold includes a housing that defines an interior region having a serpentine flow path therein. The housing has a first plurality of grooves extending from a first surface of the housing into the hous

대표청구항

1. A cooling manifold, comprising: a thermally conductive member having a flat panel portion and an extension portion extending from the flat panel portion, the extension portion having first, second and third portions, the first portion extending from an end of the flat panel portion substantially

이 특허에 인용된 특허 (100)

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이 특허를 인용한 특허 (4)

  1. Wong, Suzanne Marye; Cornes, Martin Peter John; Tufford, Robert Charles, Integrated thermal inserts and cold plate.
  2. Wong, Suzanne Marye; Cornes, Martin Peter John; Tufford, Robert Charles, Integrated thermal inserts and cold plate.
  3. Heckenberger, Thomas; Isermeyer, Tobias; Kohlberger, Markus; Schiehlen, Thomas; Herrmann, Hans-Georg; Fehrenbacher, Christoph, Method for producing an energy storage device holder for a vehicle.
  4. Traczek, Jeff; Brewster, Tim, Mobile battery modules for high power applications.
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