초록 ▼

A method of attaching a component to a substrate, including providing a component guide attached to a substrate, the component guide having a cavity substantially conforming to contours of a portion of a component, attaching a first solder pad to the component, inserting the component into the guide

A method of attaching a component to a substrate, including providing a component guide attached to a substrate, the component guide having a cavity substantially conforming to contours of a portion of a component, attaching a first solder pad to the component, inserting the component into the guide cavity, providing a second solder pad, offset from the first solder pad and near the cavity, and inserting the component, the component guide and the substrate into an oven heating the solder pads, wherein the component is drawn further into the guide cavity by a capillary effect of the heated solder pads.

대표청구항 ▼

1. A method of attaching a component to a substrate, comprising: providing a component guide attached to a substrate, the component guide having a cavity substantially conforming to contours of a portion of a component;attaching a first solder pad to the component;inserting the component into the gu

1. A method of attaching a component to a substrate, comprising: providing a component guide attached to a substrate, the component guide having a cavity substantially conforming to contours of a portion of a component;attaching a first solder pad to the component;inserting the component into the guide cavity;providing a second solder pad, offset from the first solder pad and near the cavity; andinserting the component, the component guide and the substrate into an oven heating the solder pads, wherein the component is drawn further into the guide cavity by a capillary effect of the heated solder pads. 2. The method of claim 1 further comprising providing a plurality of notches in the component guide outside of the cavity, for guiding the component into the cavity during the capillary effect. 3. The method of claim 1, wherein the component guide is removably attached to the substrate and is detached for subsequent use when the substrate is removed from the oven. 4. The method of claim 1, wherein the component comprises a light emitter and the component guide comprises a lens for directing light emitted by the emitter. 5. The method of claim 1, wherein the component comprises a light receiver and the component guide comprises a lens for directing light onto the receiver.