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Chassis system with front cooling intake 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0877710 (2010-09-08)
등록번호 US-8405985 (2013-03-26)
발명자 / 주소
  • Reynov, Boris
  • Kohn, Jack
  • Mowat, Euan F.
  • Siddhaye, Shreeram
  • Nitzan, Ben
  • Nagarajan, Mahesh
출원인 / 주소
  • Juniper Networks, Inc.
대리인 / 주소
    Harrity & Harrity, LLP
인용정보 피인용 횟수 : 21  인용 특허 : 10

초록

A line card includes a metal frame that includes a front section, and a bottom section connected to the front section via an angled section, where the angled section results in an opening between the line card and a second line card, when the line card is installed above the second line card in a ra

대표청구항

1. A line card comprising: a metal frame including: a front section, anda bottom section connected to the front section via an angled section, the angled section resulting in an opening between the line card and a second line card, when the line card is installed above the second line card in a rack

이 특허에 인용된 특허 (10)

  1. Lee Chi Keung,CAX ; Jeakins William David,CAX, Air flow distribution device for shelf-based circuit cards.
  2. Dorinel Patriche CA; Emmanuel Stathopoulos CA; Daniel Tasse CA, Compact shelf unit for electronic equipment rack.
  3. West, Stephen J.; Pradels, Scott; Greer, Stephen S., Cooling a chassis by moving air through a midplane between two sets of channels oriented laterally relative to one another.
  4. Okuyama Katsuo (Kawasaki JPX) Arai Susumu (Machida JPX) Ishiwata Masao (Yokohama JPX) Takada Hirotoshi (Kawasaki JPX), Cooling structure of electronic equipment rack.
  5. Sugiyama Akira,JPX ; Hoshino Tsutomu,JPX ; Yoshida Shinichi,JPX ; Joeng Tan Tjang,JPX, Electronic equipment.
  6. Hanson, Jeffrey W.; Gilliland, Douglas G.; Falke, Darrell E.; Miller, Dennis Patrick, Fan modules.
  7. Paggen Wolfgang (Starnberg DEX) Neblich Josef (Wartenberg DEX), Frame for circuit boards with electronic components.
  8. Andersson Nils A. T. (Jarfalla SEX) Fagerstedt Nils U. H. (Jarfalla SEX) Gudmundsson Bjorn G. (Sollentuna SEX), Modular packaging system.
  9. Matsui Kiyoshi (Kawasaki JPX) Arai Katsuyuki (Kawasaki JPX) Shinbashi Sueo (Kawasaki JPX), Natural air cooled rack for vertically disposed printed boards.
  10. Takahashi Yoshihiro (Kawasaki JPX) Okuyama Katsuo (Kawasaki JPX) Matsukuma Yutaka (Hatano JPX), Shelf unit for electronic communication devices.

이 특허를 인용한 특허 (21)

  1. Nagarajan, Mahesh; Penmetsa, Venkata S. Raju; Biswas, Rebecca; Kohn, Jack W.; Siddhaye, Shreeram, Apparatus, system, and method for increasing access to transceivers.
  2. Gektin, Vadim; Xu, Jiye, Centralized chassis architecture for half-width boards.
  3. Reynov, Boris; Kohn, Jack; Mowat, Euan F; Siddhaye, Shreeram; Nitzan, Ben; Nagarajan, Mahesh, Chassis system with front cooling intake.
  4. Reynov, Boris; Kohn, Jack; Mowat, Euan F; Siddhaye, Shreeram; Nitzan, Ben; Nagarajan, Mahesh, Chassis system with front cooling intake.
  5. Gravina, Matteo B., Data center cooling system having electrical power generation.
  6. Gravina, Matteo B., Data center cooling system having electrical power generation.
  7. Dean, David L.; Bennett, Dennis; Ellis, Robert W., Electronic assembly with thermal channel and method of manufacture thereof.
  8. Dean, David Lee; Bennett, Dennis; Ellis, Robert W., Electronic assembly with thermal channel and method of manufacture thereof.
  9. Kanasaki, Katsumi; Joko, Kenji; Saito, Osamu; Matsumoto, Hideaki; Fujii, Minoru; Izuno, Takaharu; Hayashi, Mitsuaki, Electronic device and method for mounting unit.
  10. Dean, David Lee; Ellis, Robert W., Electronic system with heat extraction and method of manufacture thereof.
  11. Wright, David A.; Dean, David; Ellis, Robert W., Heat dissipation for substrate assemblies.
  12. Wright, David A.; Dean, David; Ellis, Robert W., Heat dissipation for substrate assemblies.
  13. Zhai, Haifang; Zhou, Yujie; Guo, Qingqiang; Wu, Hendry Xiaoping; Dong, David, Heat sink for use in storage and associated storage.
  14. Dean, David; Ellis, Robert W., Self-supporting thermal tube structure for electronic assemblies.
  15. Petrzilek, Jan; Biler, Martin, Solid electrolytic capacitor with improved performance at high voltages.
  16. Shabbir, Hasnain; Lovicott, Dominick A.; Ragupathi, Dinesh K., System and method for providing cooling support of cards in an information handling system.
  17. Ellis, Robert W.; Dean, David, System and method for redirecting airflow across an electronic assembly.
  18. Dean, David Lee; Ellis, Robert W.; Harrow, Scott, Test system with localized heating and method of manufacture thereof.
  19. Gravina, Matteo B., Thermal energy accumulator for power generation and high performance computing center.
  20. Dean, David; Ellis, Robert W., Thermal isolation techniques.
  21. Ellis, Robert W.; Dean, David, Thermal tube assembly structures.
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