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Methods of bonding superabrasive particles in an organic matrix 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-021/18
출원번호 US-0715583 (2010-03-02)
등록번호 US-8414362 (2013-04-09)
발명자 / 주소
  • Sung, Chien-Min
출원인 / 주소
  • Sung, Chien-Min
대리인 / 주소
    Thorpe North & Western LLP
인용정보 피인용 횟수 : 2  인용 특허 : 72

초록

Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic ma

대표청구항

1. A superabrasive tool having improved superabrasive particle retention, consisting of: a continuous solidified organic material layer; anda plurality of superabrasive particles ranging from about 30 microns to about 250 microns in size and secured in the continuous solidified organic material laye

이 특허에 인용된 특허 (72)

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  13. Toge,Naoki; Inoue,Yasuaki, CMP pad conditioner having working surface inclined in radially outer portion.
  14. Zimmer Jerry W., CVD diamond coated substrate for polishing pad conditioning head and method for making same.
  15. Sung,Chien Min, Chemical mechanical polishing pad dresser.
  16. Kirchner Eric J. ; Kalpathy-Cramer Jayashree, Chemical-mechanical polishing pad conditioning systems.
  17. Christianson Todd J., Coated abrasive article, method for preparing the same, and method of using a coated abrasive article to abrade a hard.
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  19. Benedict Harold W. ; Bange Donna W. ; Heacox Gary L. ; Trudeau Timothy J., Coated abrasives and methods of preparation.
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  26. Sung,Chien Min, Contoured CMP pad dresser and associated methods.
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  28. Ronald K. Eyre, Cutting element with improved polycrystalline material toughness and method for making same.
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  32. Chien-Min Sung TW; Frank Lin TW, Diamond grid CMP pad dresser.
  33. Sung, Chien-Min; Lin, Frank, Diamond grid CMP pad dresser.
  34. Kim, Soo Kwang; Yoon, So Young; Kim, Jong Ho, Diamond tool.
  35. Kimura Kenichi,JPX ; Kanenari Moriyasu,JPX, Dresser for polishing cloth and manufacturing method therefor.
  36. Notter Theo A. (29 Langley Drive Camberley ; Surrey ; GU15 3TB GB2) James David W. (68 Derby Square Douglas GB4), Drill bit with cutting insert.
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  38. Vogtmann, Michael; Vepa, Krishna; Wisnieski, Michael, Eccentric abrasive wheel for wafer processing.
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  41. Breivogel Joseph R. (Aloha OR) Price Matthew J. (Portland OR) Barns Christopher E. (Portland OR), Method and apparatus for conditioning a semiconductor polishing pad.
  42. Gardner Edward R. (Howell MI), Method for fabricating cutting pieces.
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  44. Green ; Thomas R., Method for making an abrading tool with discontinuous diamond abrading surfaces.
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  49. Fries,Robert; Harden,Peter Michael, Method of producing an abrasive product containing diamond.
  50. Sung, Chien-Min, Methods of bonding superabrasive particles in an organic matrix.
  51. Sung, Chien-Min, Methods of bonding superabrasive particles in an organic matrix.
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  59. Doan, Trung; Balagani, Venkata R.; Ngan, Kenny King-Tai, Polishing pad conditioner and methods of manufacture and recycling.
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  65. Takashita Junji (Yokohama JPX) Yamamoto Hironori (Chigasaki JPX) Nakamura Nobuo (Yokohama JPX) Imanari Toru (Kawasaki JPX) Kozakai Takashi (Setagaya JPX), Polishing/grinding tool and process for producing the same.
  66. Mullins James M. (Austin TX), Preconditioner for a polishing pad and method for using the same.
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  68. Appel Andrew T. (Dallas TX) Chisholm Michael F. (Plano TX), Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad condition.
  69. Sung, Chien-Min, Superhard cutters and associated methods.
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이 특허를 인용한 특허 (2)

  1. Schwappach, Karl G.; Boutaghou, Zine-Eddine, Abrasive slurry and dressing bar for embedding abrasive particles into substrates.
  2. Lee, Bo-I; Kang, Huang Soon; Yang, Chi-Ming; Lin, Chin-Hsiang, Manufacture and method of making the same.
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