Coated article and method for making the same
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B32B-007/02
B32B-015/04
B32B-015/18
B32B-015/20
C23C-014/18
C23C-014/35
출원번호
US-0189993
(2011-07-25)
등록번호
US-8415023
(2013-04-09)
우선권정보
CN-2010 1 0511734 (2010-10-19)
발명자
/ 주소
Chang, Hsin-Pei
Chen, Wen-Rong
Chiang, Huann-Wu
Chen, Cheng-Shi
Li, Cong
출원인 / 주소
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.
대리인 / 주소
Altis Law Group, Inc.
인용정보
피인용 횟수 :
2인용 특허 :
1
초록▼
A coated article is described. The coated article includes a substrate, a combining layer formed on the substrate, a plurality of chromium nitride layers and a plurality of copper-titanium alloy layers formed on the combining layer. The combining layer is a chromium layer. Each chromium nitride laye
A coated article is described. The coated article includes a substrate, a combining layer formed on the substrate, a plurality of chromium nitride layers and a plurality of copper-titanium alloy layers formed on the combining layer. The combining layer is a chromium layer. Each chromium nitride layer interleaves with one copper-titanium alloy layer. A method for making the coated article is also described.
대표청구항▼
1. A coated article, comprising: a substrate;a combining layer formed on the substrate, the combining layer being a chromium layer; anda plurality of alternating chromium nitride and copper-titanium alloy layers formed on the combining layer. 2. The coated article as claimed in claim 1, wherein one
1. A coated article, comprising: a substrate;a combining layer formed on the substrate, the combining layer being a chromium layer; anda plurality of alternating chromium nitride and copper-titanium alloy layers formed on the combining layer. 2. The coated article as claimed in claim 1, wherein one of the chromium nitride layers is directly formed on the combining layer; one of the chromium nitride layers forms an outermost layer of the coated article. 3. The coated article as claimed in claim 1, wherein the substrate is made of stainless steel or chromium contained alloys. 4. The coated article as claimed in claim 1, wherein each chromium nitride layer is formed by vacuum sputtering and has a thickness of about 50 nm to about 100 nm. 5. The coated article as claimed in claim 1, wherein each copper-titanium alloy layer is formed by vacuum sputtering and has a thickness of about 200 nm to about 300 nm. 6. The coated article as claimed in claim 1, wherein the chromium nitride layers and the copper-titanium alloy layers have a total thickness of about 1 μm to about 8 μm. 7. The coated article as claimed in claim 1, wherein the combining layer is formed by vacuum sputtering and has a thickness of about 100 nm to about 200 nm. 8. The coated article as claimed in claim 2, wherein the chromium nitride layers have porous structure. 9. The coated article as claimed in claim 8, wherein each copper-titanium alloy layer is sandwiched by each two chromium nitride layers adjacent to the copper-titanium alloy laver, the each copper-titanium alloy layer has a portion that imbeds in the porous structure of the each two adjacent chromium nitride layers. 10. The coated article as claimed in claim 1, wherein total number of the chromium nitride layers are 5 layers to 21 layers, and total number of the copper-titanium alloy layers are 4 layers to 20 layers. 11. A method for making a coated article, comprising: providing a substrate;forming a combining layer on the substrate, the combining layer being a chromium layer;forming a chromium nitride layer on the combining layer by vacuum sputtering, using nitrogen as a reaction gas and using chromium target;forming a copper-titanium alloy layer on the chromium nitride layer by vacuum sputtering, using copper-titanium alloy target; andrepeating the steps of alternatingly forming the chromium nitride layer and the copper-titanium alloy layer to form the coated article. 12. The method as claimed in claim 11, wherein forming the chromium nitride layer is by using a magnetron sputtering method; the nitrogen has a flow rate of about 10 sccm to about 20 sccm; magnetron sputtering of the chromium nitride layer uses argon as a working gas, the argon has a flow rate of about 20 sccm to about 50 sccm; and magnetron sputtering of the chromium nitride layer is conducted at a temperature of about 70° C. to about 130° C. and takes about 2 min to about 3 min. 13. The method as claimed in claim 12, wherein the substrate has a direct current bias voltage of about −50 V to about −150 V during magnetron sputtering of the chromium nitride layer. 14. The method as claimed in claim 11, wherein forming the copper-titanium alloy layer is by using a magnetron sputtering method; the copper-titanium alloy target contains copper having a mass percentage of about 80% to about 90%; magnetron sputtering of the copper-titanium alloy layer uses argon as a working gas, the argon has a flow rate of about 20 sccm to about 50 sccm; and magnetron sputtering of the copper-titanium alloy layer is conducted at a temperature of about 70° C. to about 130° C. and takes about 2 min to about 3 min. 15. The method as claimed in claim 14, wherein the substrate has a coupled pulse bias voltage of about −180 V to about −350 V during magnetron sputtering of the copper-titanium alloy layer, and the coupled pulse bias voltage has a pulse frequency of about 10 KHz and a pulse width of about 20 μs. 16. The method as claimed in claim 11, wherein forming the combining layer is by using a magnetron sputtering method, that uses chromium target and uses argon as a working gas, the argon having a flow rate of about 100 sccm to about 300 sccm; magnetron sputtering of the combining layer is conducted at a temperature of about 80° C. to about 150° C. and takes about 5 min to about 10 min. 17. The method as claimed in claim 16, wherein the substrate has a bias voltage of about −50 V to about −150 V during magnetron sputtering of the combining layer. 18. The method as claimed in claim 11, wherein the step of repeating the forming of the chromium nitride layer and the copper-titanium alloy layer is carried out for three times to nineteen times. 19. The method as claimed in claim 18, further comprising a step of forming a chromium nitride layer on a copper-titanium alloy layer by vacuum sputtering after the step of repeating the forming of the chromium nitride layer and the copper-titanium alloy layer. 20. The method as claimed in claim 11, further comprising a step of pre-treating the substrate before forming the combining layer, wherein the pre-treating process comprises ultrasonic cleaning the substrate and plasma cleaning the substrate.
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