IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0738943
(2008-10-22)
|
등록번호 |
US-8425806
(2013-04-23)
|
우선권정보 |
EP-07020735 (2007-10-23) |
국제출원번호 |
PCT/EP2008/008926
(2008-10-22)
|
§371/§102 date |
20100420
(20100420)
|
국제공개번호 |
WO2009/053042
(2009-04-30)
|
발명자
/ 주소 |
- Noyens, Koenraad
- De Vleesschauer, Marc
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
13 |
초록
▼
The present invention provides a semiconductive polymer composition having (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 60 wt % of carbon black and (c) from 0 to 8 wt % additives, based on the total semiconductive polymer composition, and wherein the composition comprises less than
The present invention provides a semiconductive polymer composition having (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 60 wt % of carbon black and (c) from 0 to 8 wt % additives, based on the total semiconductive polymer composition, and wherein the composition comprises less than 23 particles per m2 having a width of larger than 150 μm at the half height of a particle protruding from the surface of the tape sample, less than 10 particles per m2 having a width of larger than 200 μm at the half height of a particle protruding from the surface of the tape sample, and preferably, about 0 particles per m2 having a width of larger than 500 μm at the half height of a particle protruding from the surface of the tape sample.
대표청구항
▼
1. A semiconductive polymer composition, comprising: (a) from 30 to 90 wt % of a polymer component;(b) from 10 to 60 wt % of carbon black; and(c) from 0 to 8 wt % additives, based on the total semiconductive polymer composition, and wherein the composition comprises, when measured in accordance with
1. A semiconductive polymer composition, comprising: (a) from 30 to 90 wt % of a polymer component;(b) from 10 to 60 wt % of carbon black; and(c) from 0 to 8 wt % additives, based on the total semiconductive polymer composition, and wherein the composition comprises, when measured in accordance with the Surface Smoothness Analysis (SSA) method using a tape sample prepared by extrusion of said semiconductive polymer composition using a single screw extruder (20 mm), a screw speed of 50 rpm and extruder die opening of 30 mm×1 mm, the tape sample having a thickness of 500±20 μm and a width of 18 mm, in which method a measurement area of 1 m2 of the tape surface is scanned with a camera while the tape moves with a speed of 50 mm/s, less than 23 particles per m2 having a width of larger than 150 μm at the half height of said particle protruding from the surface of the tape sample, andless than 10 particles, per m2 having a width of larger than 200 μm at the half height of said particle protruding from the surface of the tape sample. 2. The polymer composition according to claim 1, wherein the carbon black (b) has an STSA value of more that 30 m2/g and less than 400 m2/g. 3. The polymer composition according to claim 1, wherein the carbon black (b) has one or more of the following characteristics: a tinting strength of from 30 to 100,an iodine adsorption number of up to 300 g/kg,an Oil Absorption number of up to 300 cm3/100 g. 4. The polymer composition as defined in claim 1, wherein said polymer component (a) is a polyolefin, preferably a polymer of an alpha-olefin which includes a homopolymer of ethylene or copolymer of ethylene with one or more comonomers, which polyethylene polymer is selected from: a branched (LDPE) polyethylene homo- or copolymer produced in high pressure by radical polymerization or a linear polyethylene homo- or copolymer produced by low pressure polymerization using a coordination catalyst;a LDPE homo- or copolymer which may optionally have an unsaturation that can preferably be provided by copolymerizing ethylene with at least one polyunsaturated comonomer as defined above and/or by using a chain transfer agent, such as propylene;a LDPE copolymer, wherein the comonomer is selected from one or more of polar comonomer(s) and may optionally comprise an unsaturation provided preferably by copolymerizing ethylene with at least one polyunsaturated comonomer(s) and/or by using a chain transfer agent, such as propylene; and/ora LDPE copolymer of ethylene with at least polar comonomer(s) which polar comonomer(s) is/are selected from: vinyl carboxylate esters, such as vinyl acetate and vinyl pivalate, (meth)acrylates, such as methyl(meth)acrylate, ethyl(meth)acrylate, butyl(meth)acrylate and hydroxyethyl(meth)acrylate,olefinically unsaturated carboxylic acids, such as (meth)acrylic acid, maleic acid and fumaric acid,(meth)acrylic acid derivatives, such as (meth)acrylonitrile and (meth)acrylic amide, and/orvinyl ethers, such as vinyl methyl ether and vinyl phenyl ether. 5. The polymer composition according to claim 1, wherein the MFR2, is at least 0.01 g/10 min. 6. The polymer composition as defined in claim 1, which is in the form of polymer pellets. 7. The polymer composition as defined in claim 1, which is cross-linkable via radical reaction or via silane groups. 8. A process for preparing a semiconductive polymer composition, comprising the steps of: i) introducing 30-90 wt % of a polymer component and 0-8 wt % additives in a mixer device and mixing the polymer component and additives at elevated temperature such that a polymer melt is obtained;ii) adding 10-60 wt % of carbon black, preferably furnace carbon black, to the polymer melt and further mixing of the polymer melt such that the polymer composition comprises, when measured in accordance with the Surface Smoothness Analysis (SSA) method using a tape sample prepared by extrusion of said semiconductive polymer composition using a single screw extruder (20 mm), a screw speed of 50 rpm and extruder die opening of 30 mm×1 mm, the tape sample having a thickness of 500±20 μm and a width of 18 mm, in which method a measurement area of 1 m2 of the tape surface is scanned with a camera while the tape moves with a speed of 50 mm/s,less than 23 particles per m2 having a width of larger than 150 μm at the half height of said particle protruding from the surface of the tape sample,less than 10 particles per m2 having a width of larger than 200 μm at the half height of said particle protruding from the surface of the tape sample, and preferablyabout 0 particles per m2 having a width of larger than 500 μm at the half height of said particle protruding from the surface of the tape sample. 9. The process according to claim 8, wherein the carbon black is added to the polymer melt in at least two subsequent addition steps, preferably in the first addition step at least ⅔ of the total amount of carbon black is added to the melt, and in the second addition step the remainder of the total amount of carbon black. 10. The process as defined in claim 8, which further comprises a step of pelletising the obtained polymer mixture. 11. The process as defined in claim 8, wherein in step (i), as said polymer component, the polymer component (a) is a polyolefin, preferably a polymer of an alpha-olefin which includes a homopolymer of ethylene or copolymer of ethylene with one or more comonomers, which polyethylene polymer is selected from: a branched (LDPE) polyethylene homo- or copolymer produced in high pressure by radical polymerization or a linear polyethylene homo- or copolymer produced by low pressure polymerization using a coordination catalyst;a LDPE homo- or copolymer which may optionally have an unsaturation that can preferably be provided by copolymerizing ethylene with at least one polyunsaturated comonomer as defined above and/or by using a chain transfer agent, such as propylene;a LDPE copolymer, wherein the comonomer is selected from one or more of polar comonomer(s) and may optionally comprise an unsaturation provided preferably by copolymerizing ethylene with at least one polyunsaturated comonomer(s) and/or by using a chain transfer agent, such as propylene; and/ora LDPE copolymer of ethylene with at least polar comonomer(s) which polar comonomer(s) is/are selected from: vinyl carboxylate esters, such as vinyl acetate and vinyl pivalate, (meth)acrylates, such as methyl(meth)acrylate, ethyl(meth)acrylate, butyl(meth)acrylate and hydroxyethyl(meth)acrylate,olefinically unsaturated carboxylic acids, such as (meth)acrylic acid, maleic acid and fumaric acid,(meth)acrylic acid derivatives, such as (meth)acrylonitrile and (meth)acrylic amid, and/orvinyl ethers, such as vinyl methyl ether and vinyl phenyl ether. 12. A semiconductive polymer composition or pellets thereof obtainable by the method according to claim 8. 13. A power cable comprising a conductor surrounded by one or more layers, wherein at least one of said one or more layers is a semiconductive layer, which comprises a semiconductive polymer composition according to claim 1. 14. A process for producing a power cable as defined in claim 13, wherein said process comprises blending the semiconductive polyolefin composition, above the melting point of at least the major polymer component(s) of the obtained mixture, and extruding the obtained melt mixture on a conductor for forming at least one semiconductive polymer layer on a conductor for a power cable. 15. A crosslinked power cable obtainable by the process according to claim 14. 16. The polymer composition according to claim 1, wherein the composition comprises about 0 particles per m2 having a width of larger than 500 μm at the half height of said particle protruding from the surface of the tape sample. 17. The polymer composition according to claim 1, wherein the composition comprises less than 20 particles per m2 having a width larger than 150 μm at the half height of said particle protruding from the surface of the tape sample, and/or less than 8 particles per m2 having a width larger than 200 μm at the half height of said particle protruding from the surface of the tape sample. 18. The process according to claim 8, wherein the furnace carbon black (b) is supplied in the form of agglomerates, wherein at least 50 wt % of said agglomerates have an average pellet size of 0.250-0.500 μm. 19. The power cable according to claim 13, wherein the power cable comprises a conductor, an inner semiconductive layer (a), an insulation layer (b) and an outer semiconductive layer (c), each coated on the conductor in this order, wherein at least one of the inner and outer semiconductive layer(s) (a;c) comprises a semiconductive polymer composition according to claim 1. 20. The process according to claim 14, further comprising a step of crosslinking the cable by contacting said at least one semiconductive layer with a silane or peroxide crosslinking agent.
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