초록 ▼

A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavit

A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier may be configured to stack with other carriers without risk of damage to the tacky product.

대표청구항 ▼

1. A package system, comprising: (a) a carrier having an upper surface and a plurality of cavities separately disposed in said upper surface along a length and width thereof, each of said cavities including a base having a base surface area and a surface profile defining a first contact surface area

1. A package system, comprising: (a) a carrier having an upper surface and a plurality of cavities separately disposed in said upper surface along a length and width thereof, each of said cavities including a base having a base surface area and a surface profile defining a first contact surface area that is less than about 50% of said base surface area and is elevated from a base surface; and(b) a product having a base contact portion with a modulus of less than about 70 Shore 00, said product being disposed in a respective cavity such that said base contact portion is in contact only with said first contact surface area. 2. A package system as in claim 1 wherein said first contact surface area is less than about 10% of said base surface area. 3. A package system as in claim 1 wherein said product is a thermal interface material. 4. A method for packaging a product having a base contact portion with a modulus of less than about 70 Shore 00, said method comprising: (a) providing a first carrier having an upper surface and a plurality of cavities separately disposed in said upper surface along a length and a width thereof, each of said cavities including a base that is sized to operably receive and support said product within said cavity, said base having a base surface area and a surface profile defining a first contact surface area that is less than about 50% of said base surface area and is elevated from a base surface; and(b) positioning said product in said cavity such that said base contact portion of said product is supported by said first contact surface area of said base and spaced from said base surface. 5. A method as in claim 4, including: (a) providing a second carrier having an upper surface and a plurality of cavities separately disposed in said upper surface along a length and a width thereof, each of said cavities including a base that is sized to operably receive and support the product within said cavity, said second carrier including a lower surface that is generally opposed to said upper surface, and includes a contact portion defining a second contact surface area elevated from said lower surface, said second contact surface area being less than about 10% of a lower surface area of said lower surface; and(b) positioning said second carrier in a stacked arrangement on said upper surface of said first carrier, such that said second contact surface area is in operable contact with said product operably disposed in said cavity of said first carrier.