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Parasitic deposits are controlled in a deposition system for depositing a film on a substrate, the deposition system of the type defining a reaction chamber for receiving the substrate and including a process gas in the reaction chamber and an interior surface contiguous with the reaction chamber. S

Parasitic deposits are controlled in a deposition system for depositing a film on a substrate, the deposition system of the type defining a reaction chamber for receiving the substrate and including a process gas in the reaction chamber and an interior surface contiguous with the reaction chamber. Such control is provided by flowing a buffer gas between the interior surface and at least a portion of the process gas to form a gas barrier layer such that the gas barrier layer inhibits contact between the interior surface and components of the process gas. A deposition system for depositing a film on a substrate using a process gas includes a reaction chamber adapted to receive the substrate and the process gas. The system further includes an interior surface contiguous with the reaction chamber. A buffer gas supply system is adapted to supply a flow of a buffer gas between the interior surface and at least a portion of the process gas such that the flow of the buffer gas forms a gas barrier layer to inhibit contact between the interior surface and components of the process gas when the process gas is disposed in the reaction chamber.

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1. A deposition system for depositing a film on a substrate, the deposition system comprising: a) a reaction chamber arranged and configured to receive the substrate and the process gas;b) an interior surface contiguous with the reaction chamber;c) a process gas supply system to supply a flow of the

1. A deposition system for depositing a film on a substrate, the deposition system comprising: a) a reaction chamber arranged and configured to receive the substrate and the process gas;b) an interior surface contiguous with the reaction chamber;c) a process gas supply system to supply a flow of the process gas to the reaction chamber;d) a buffer gas supply system arranged and configured to supply a flow of a buffer gas between the interior surface and at least a portion of the process gas and flowing in contact with the process gas such that the flow of the buffer gas forms a gas barrier layer to inhibit contact between the interior surface and components of the process gas when the process gas is disposed in the reaction chamber; ande) at least one susceptor member to heat the reaction chamber;wherein the system is arranged and configured to provide the buffer gas to the reaction chamber at a temperature greater than a temperature of the process gas in the reaction chamber. 2. The system of claim 1 wherein the buffer gas supply system is arranged and configured to flow the buffer gas along the interior surface. 3. The system of claim 1 including a process gas inlet to supply the process gas to the reaction chamber, wherein: the process gas inlet has a smaller cross-sectional area than a cross-sectional area of the reaction chamber so as to define a buffer gas region in the reaction chamber; andthe buffer gas supply system is arranged and configured to flow the buffer gas into the buffer gas region. 4. The system of claim 1 wherein the interior surface is a ceiling surface of the reaction chamber. 5. The system of claim 1 wherein the buffer gas supply system is arranged and configured to heat the buffer gas before introducing the buffer gas into the reaction chamber. 6. The system of claim 1 wherein the system is arranged and configured to provide the buffer gas to the reaction chamber at an average temperature that is at least 10 degrees Celsius greater than an average temperature of the process gas in the reaction chamber. 7. The system of claim 1 arranged and configured to heat the buffer gas as the buffer gas flows along the interior surface. 8. The system of claim 1 including an electromagnetic frequency (EMF) generator operative to inductively heat the reaction chamber by generating electrical eddy currents in the at least one susceptor member, responsive to which the at least one susceptor member generates heat. 9. The system of claim 1 arranged and configured to heat the interior surface to a temperature sufficient to promote sublimation of parasitic deposits from the process gas that deposit on the interior surface. 10. The system of claim 1 wherein the buffer gas supply system is arranged and configured to flow the buffer gas through the reaction chamber at a velocity of at least about 1 m/s. 11. The system of claim 10 wherein the buffer gas supply system is arranged and configured to flow the buffer gas through the reaction chamber at a velocity of between about 5 and 100 m/s. 12. The system of claim 1 wherein the buffer gas supply system includes a supply of buffer gas. 13. The system of claim 12 wherein the buffer gas comprises a noble gas. 14. The system of claim 13 wherein the noble gas is selected from the group consisting of argon, helium, neon, krypton, radon, and xenon. 15. The system of claim 12 wherein the buffer gas comprises H2, N2, NH3 and/or air. 16. The system of claim 12 wherein the buffer gas includes an active material capable of chemically inhibiting the deposition of parasitic deposits on the interior surface and/or removing parasitic deposits from the interior surface. 17. The system of claim 16 wherein the active material includes an etchant. 18. The system of claim 17 wherein the etchant includes at least one of HCl, Cl2 and a carbon-containing gas. 19. The system of claim 1 wherein the system is a chemical vapor deposition (CVD) system. 20. The system of claim 19 wherein the system is a hotwall CVD system. 21. The system of claim 1 arranged and configured to heat the interior surface to a higher temperature than a second surface that is adapted to contact the process gas when the process gas is disposed in the reaction chamber. 22. The system of claim 21 wherein the second surface comprises a first material and the interior surface comprises a second material, the second material having a lower emissivity than the first material. 23. The system of claim 22 wherein the second surface is formed of SiC and the interior surface is formed of a metal carbide. 24. The system of claim 23 wherein the second surface is formed of at least one of TaC and NbC. 25. The system of claim 22 including an electromagnetic frequency (EMF) generator operative to inductively heat the reaction chamber by generating electrical eddy currents in the at least one susceptor member, responsive to which the at least one susceptor member generates heat, wherein the at least one susceptor member is responsive to the electrical eddy currents generated by the EMF generator to heat each of the interior surface and the second surface. 26. A deposition system for depositing a film on a substrate, the deposition system comprising: a) a reaction chamber arranged and configured to receive the substrate and the process gas;b) an interior surface contiguous with the reaction chamber;c) a process gas supply system to supply a flow of the process gas to the reaction chamber;d) a buffer gas supply system arranged and configured to supply a flow of a buffer gas between the interior surface and at least a portion of the process gas and flowing in contact with the process gas such that the flow of the buffer gas forms a gas barrier layer to inhibit contact between the interior surface and components of the process gas when the process gas is disposed in the reaction chamber;e) at least one susceptor member; andf) an electromagnetic frequency (EMF) generator operative to inductively heat the reaction chamber by generating electrical eddy currents in the at least one susceptor member, responsive to which the at least one susceptor member generates heat;wherein the process gas supply system is arranged and configured to supply the flow of the process gas through the reaction chamber in a flow direction;wherein the buffer gas supply system is arranged and configured to flow the buffer gas through the reaction chamber in the flow direction; andwherein the buffer gas supply system and the process gas supply system are arranged and configured to flow the buffer gas and the process gas through the reaction chamber at substantially the same velocity. 27. The system of claim 26 wherein: the process gas supply system supplies the flow of the process gas through the reaction chamber in a flow direction that is substantially horizontal. 28. The system of claim 27 wherein the buffer gas supply system is arranged and configured to provide a substantially laminar flow of the buffer gas along the interior surface to at least a location downstream of the substrate. 29. A deposition system for depositing a film on a substrate, the deposition system comprising: a) a reaction chamber arranged and configured to receive the substrate and the process gas;b) an interior surface contiguous with the reaction chamber;c) a process gas supply system to supply a flow of the process gas to the reaction chamber;d) a buffer gas supply system arranged and configured to supply a flow of a buffer gas between the interior surface and at least a portion of the process gas and flowing in contact with the process gas such that the flow of the buffer gas forms a gas barrier layer to inhibit contact between the interior surface and components of the process gas when the process gas is disposed in the reaction chamber;e) at least one susceptor member; andf) an electromagnetic frequency (EMF) generator operative to inductively heat the reaction chamber by generating electrical eddy currents in the at least one susceptor member, responsive to which the at least one susceptor member generates heat;wherein the buffer gas supply system is arranged and configured to provide a substantially laminar flow of the buffer gas along the interior surface to at least a location downstream of the substrate. 30. The system of claim 29 wherein the buffer gas supply system and the process gas supply system are arranged and configured to introduce both the buffer gas and the process gas into the reaction chamber at substantially the same location along the flow direction so as to inhibit turbulence in and between the buffer gas flow and the process gas flow. 31. A deposition system for depositing a film on a substrate using a process gas and a buffer gas each flowed in a flow direction, the deposition system comprising: a) a susceptor assembly comprising at least one susceptor member defining:a reaction chamber arranged and configured to receive the substrate and having a buffer gas region to receive the buffer gas, the reaction chamber having a first cross-sectional area perpendicular to the flow direction; anda process gas inlet having a second cross-sectional area perpendicular to the flow direction, the second cross-sectional area being less than the first cross-sectional area; anda buffer gas inlet adjacent the process gas inlet and arranged and configured to direct the buffer gas into the buffer gas region of the reaction chamber; andb) an electromagnetic frequency (EMF) generator operative to inductively heat the reaction chamber by generating electrical eddy currents in the at least one susceptor member, responsive to which the at least one susceptor member generates heat. 32. The deposition system of claim 31 wherein: the buffer gas region has a third cross-sectional area perpendicular to the flow direction; andthe third cross-sectional area and the second cross-sectional area have a combined cross-sectional area that is substantially the same as the first cross-sectional area. 33. The deposition system of claim 31 wherein the at least one susceptor member includes a step portion and the buffer gas inlet is formed in the step portion. 34. The deposition system of claim 31 wherein the reaction chamber has a length extending along the flow direction and the cross-sectional area of the reaction chamber is substantially uniform along substantially the entirety of the length of the reaction chamber. 35. The deposition system of claim 31 wherein the reaction chamber has a length extending along the flow direction and the cross-sectional area of the reaction chamber is non-uniform along the length of the reaction chamber. 36. The deposition system of claim 31 wherein the system is arranged and configured to heat the interior surface to a temperature sufficient to promote sublimation of parasitic deposits from the process gas that deposit on the interior surface. 37. A deposition system for depositing a film on a substrate, the deposition system comprising: a) a reaction chamber arranged and configured to receive the substrate and the process gas;b) an interior surface contiguous with the reaction chamber;c) a process gas supply system to supply a flow of the process gas to the reaction chamber;d) a buffer gas supply system arranged and configured to supply a flow of a buffer gas between the interior surface and at least a portion of the process gas and flowing in contact with the process gas such that the flow of the buffer gas forms a gas barrier layer to inhibit contact between the interior surface and components of the process gas when the process gas is disposed in the reaction chamber; ande) at least one susceptor member to heat the reaction chamber;wherein the buffer gas supply system includes a supply of the buffer gas and the buffer gas includes an active material capable of chemically inhibiting the deposition of parasitic deposits on the interior surface and/or removing parasitic deposits from the interior surface. 38. The system of claim 37 wherein the active material includes an etchant. 39. The system of claim 38 wherein the etchant includes at least one of HCl, Cl2 and a carbon-containing gas. 40. The system of claim 37 including an electromagnetic frequency (EMF) generator operative to inductively heat the reaction chamber by generating electrical eddy currents in the at least one susceptor member, responsive to which the at least one susceptor member generates heat.