IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0413483
(2012-03-06)
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등록번호 |
US-8431288
(2013-04-30)
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발명자
/ 주소 |
|
출원인 / 주소 |
- Crucible Intellectual Property, LLC
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대리인 / 주소 |
Pillsbury Winthrop Shaw Pittman LLP
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인용정보 |
피인용 횟수 :
0 인용 특허 :
59 |
초록
▼
Collector plates made of bulk-solidifying amorphous alloys, the bulk-solidifying amorphous alloys providing ruggedness, lightweight structure, excellent resistance to chemical and environmental effects, and low-cost manufacturing, and methods of making such collector plates from such bulk-solidifyin
Collector plates made of bulk-solidifying amorphous alloys, the bulk-solidifying amorphous alloys providing ruggedness, lightweight structure, excellent resistance to chemical and environmental effects, and low-cost manufacturing, and methods of making such collector plates from such bulk-solidifying amorphous alloys are provided.
대표청구항
▼
1. A conductive body comprising a surface feature on a net shape form on at least one portion formed of a bulk-solidifying amorphous alloy having an elastic strain limit of about 1.2% or more, a glass transition temperature of 500° C. or above, wherein the conductive body is configured to be incorpo
1. A conductive body comprising a surface feature on a net shape form on at least one portion formed of a bulk-solidifying amorphous alloy having an elastic strain limit of about 1.2% or more, a glass transition temperature of 500° C. or above, wherein the conductive body is configured to be incorporated in a device to generate electricity by chemical reaction, wherein the bulk solidifying amorphous alloy retains an amorphous atomic structure in a thickness of 1 mm or more when cooled from a molten state at a cooling rate of 500 K/sec or less. 2. The conductive body of claim 1, wherein the bulk-solidifying amorphous alloy comprises a nickel-base alloy. 3. The conductive body of claim 1, wherein the bulk-solidifying amorphous alloy comprises a ferrous alloy. 4. The conductive body of claim 1, wherein the bulk-solidifying amorphous alloy has the glass transition temperature of 550° C. or above. 5. The conductive body of claim 1, wherein the bulk-solidifying amorphous alloy comprises a composition being represented by the following general formula: Nia(Zr1-xTix)bSic where a, b and c are atomic percentages of nickel, zirconium plus titanium and silicon, respectively, and x is an atomic fraction of titanium to zirconium, wherein; 45 atomic %≦a≦63 atomic %, 32 atomic %≦b≦48 atomic %, 1 atomic %≦c≦11 atomic %, and 0.4≦x≦0.6. 6. The conductive body of claim 1, wherein the bulk-solidifying amorphous alloy comprises a composition being represented by the following general formula: Nid(Zr1-yTix)ePf where d, e and f are atomic percentages of nickel, zirconium plus titanium and phosphorus, respectively, and y is an atomic fraction of titanium to zirconium, wherein; 50 atomic %≦d≦62 atomic %, 33 atomic %≦e≦46 atomic %, 3 atomic %≦f≦8 atomic %, and 0.4≦y≦0.6. 7. The conductive body of claim 1, wherein the bulk-solidifying amorphous alloy further comprises V, Cr, Mn, Cu, Co, W, Sn, Mo, Y, C, B, P, Al, or combinations thereof. 8. The conductive body of claim 1, wherein the surface feature comprises at least one channel having an aspect ratio of from 0.1 to 5. 9. The conductive body of claim 1, wherein the surface feature has at least one size of about 1.0 mm or less. 10. The conductive body of claim 1, wherein the surface feature covers more than 50% of an overall conductive body area. 11. The conductive body of claim 1, wherein the surface feature comprises a plurality of channels having a width between 100 μm to 2000 μm. 12. The conductive body of claim 1, wherein the bulk-solidifying amorphous alloy has an elastic strain limit of about 1.8% or more. 13. The conductive body of claim 1, wherein the bulk solidifying amorphous alloy has a high fracture toughness of at least 20 ksi-in0.5. 14. The conductive body of claim 1, wherein the bulk solidifying amorphous alloy has a ΔT of 60° C. or greater. 15. The conductive body of claim 1, wherein the conductive body is a collector plate. 16. The conductive body of claim 1, wherein the conductive body is a current transferor, separator, cathode, anode, or end plate. 17. The conductive body of claim 1, wherein the conductive body has a high hardness value of at least about 7.5 GPa.
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