A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with one of a plurality of h
A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with one of a plurality of heat-generating electronic components on the circuit board. The cooling system also includes a plurality of heat exchangers that are configured to dissipate heat from the liquid coolant to air. Each heat exchanger of the plurality of heat exchangers is fluidly coupled between two cooling modules of the plurality of cooling modules in a flow path of the liquid. The cooling system also includes a plurality of conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchangers.
대표청구항▼
1. A liquid cooling system for an electronic system, comprising: a plurality of cooling modules, wherein at least one cooling module of the plurality of cooling modules is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with at least one heat-genera
1. A liquid cooling system for an electronic system, comprising: a plurality of cooling modules, wherein at least one cooling module of the plurality of cooling modules is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with at least one heat-generating electronic component on the circuit board, wherein each cooling module is adapted to pass a liquid coolant therethrough;a plurality of heat exchangers that are configured to dissipate heat from the liquid coolant to air; anda plurality of conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchanger, such that the liquid coolant discharged from each cooling module passes through a heat exchanger before entering another cooling module. 2. The liquid cooling system of claim 1, wherein each conduit of the plurality of conduits is made of a rigid material. 3. The liquid coolant system of claim 2, wherein the at least one conduit is made of a metallic material. 4. The liquid coolant system of claim 1, wherein each heat exchanger of the plurality of heat exchangers includes a first surface having parallel plates that are configured to be at least partially submerged in the liquid coolant and a second surface having separate parallel plates that are exposed to air. 5. The liquid cooling system of claim 4, wherein the first surface is opposite the second surface. 6. The liquid cooling system of claim 4, wherein the parallel plates on the first surface are oriented perpendicular to the parallel plates of the second surface. 7. The liquid cooling system of claim 1, further including a pump that is configured to circulate the liquid coolant through the plurality of cooling modules and the plurality of heat exchangers. 8. The liquid coolant system of claim 1, wherein each heat exchanger of the plurality of heat exchangers is coupled to the circuit board. 9. The liquid coolant system of claim 1, wherein at least one conduit of the plurality of conduits has a substantially rectangular cross-sectional shape and the at least one conduit is oriented such that a wider side of the substantially rectangular cross-section is positioned facing the circuit board. 10. A portable electronic device, comprising: a console;a circuit board positioned within the console of the portable electronic device, the circuit board including a plurality of heat-generating electronic components thereon;a plurality of cooling modules coupled to the circuit board and in thermal contact with a plurality of heat generating components on the circuit board, wherein each cooling module of the plurality of cooling modules is configured to pass a liquid coolant therethrough; anda plurality of heat exchangers fluidly coupled to the plurality of cooling modules such that the liquid coolant discharged from each cooling module passes through a heat exchanger before entering another cooling module, the plurality of heat exchangers adapted to dissipate heat from the liquid coolant to air. 11. The portable electronic device of claim 10, further including a plurality of conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchangers. 12. The portable electronic device of claim 11, wherein the plurality of conduits are made of a rigid material such that the plurality of cooling modules and the plurality of heat exchangers can be placed on and attached to the circuit board as one single unit. 13. The portable electronic device of claim 10, wherein each heat exchanger of the plurality of heat exchangers is positioned at an edge of the circuit board. 14. The portable electronic device of claim 10, further including a pump that is configured to circulate the coolant between the plurality of cooling modules and the plurality of heat exchangers, the pump being positioned within the console. 15. The portable electronic device of claim 10, wherein the plurality of cooling modules include three cooling modules and the plurality of heat exchangers include three heat exchangers. 16. The portable electronic device of claim 10, wherein a cross-section of at least one conduit of the plurality of conduits is substantially rectangular and the at least one conduit is oriented such that a wider side of the substantially rectangular cross-section is positioned facing the circuit board. 17. A liquid cooling system for an electronic system, comprising: a plurality of cooling modules that are configured to be coupled to a circuit board of the electronic system and placed in thermal contact with a plurality of heat-generating electronic components on the circuit board, wherein each cooling module of the plurality of cooling modules is adapted to pass a liquid coolant therethrough; anda plurality of heat exchangers that are fluidly coupled to the plurality of cooling modules such that the liquid coolant discharged from each cooling module passes through a heat exchanger before entering another cooling module, the plurality of heat exchangers being configured to dissipate heat from the plurality of heat generating components to air, wherein each heat exchanger of the plurality of heat exchangers includes a first surface having parallel plates that are configured to be at least partially submerged in the liquid coolant and a second surface opposite the first surface having separate parallel plates that are exposed to air. 18. The liquid cooling system of claim 17, further including a plurality of metallic conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchangers. 19. The liquid cooling system of claim 17, wherein each conduit of the plurality of conduits has a substantially rectangular cross-sectional shape. 20. The liquid cooling system of claim 17, further including a pump that is configured to circulate the coolant between the plurality of cooling modules and the plurality of heat exchangers.
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이 특허에 인용된 특허 (15)
Lopez Roger (Louisville CO), Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor.
Lamb Charles Robert ; Li Kang-Wah ; Papanicolaou Elias,DEX ; Tai Charles Chaolee, Flexible cold plate having a one-piece coolant conduit and method employing same.
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