초록 ▼

A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first pr

A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavity that is shaped with the contour of the optical element.

대표청구항 ▼

1. A method for the manufacture of an optoelectronic component, the method comprising: providing a substrate having a first primary face and a second primary face that lies opposite the first primary face,attaching a semiconductor body to the first primary face of the substrate the semiconductor bod

1. A method for the manufacture of an optoelectronic component, the method comprising: providing a substrate having a first primary face and a second primary face that lies opposite the first primary face,attaching a semiconductor body to the first primary face of the substrate the semiconductor body capable of emitting electromagnetic radiation from a front side, andforming a covering that is permeable to radiation from the semiconductor body to at least the front side of the semiconductor body, wherein the covering is given the form of an optical element by using a tool having a closed cavity shaped with a contour of the optical elementwherein the substrate has at least one sealing element on its first primary face, the sealing element surrounding an area of the first primary face onto which the optical element is applied and laterally adjoining to a side of the optical element. 2. The method according to claim 1, wherein the covering is formed by means of a plastic processing method. 3. The method according to claim 2, wherein a foil is placed into the tool. 4. The method according to claim 2, wherein the plastic processing method comprises liquid injection molding (LIM). 5. The method according to claim 2, wherein the plastic processing method comprises liquid transfer molding. 6. The method according to claim 2, wherein the plastic processing method comprises compression molding. 7. The method according to claim 1, wherein the covering comprises a plastic material. 8. The method according to claim 7, wherein the covering comprises silicone. 9. The method according to claim 7, wherein the covering comprises a hybrid material. 10. The method according to claim 1, wherein the substrate comprises a preformed housing, a preformed lead frame without a heat sink, a preformed lead frame with a heat sink or a printed circuit board. 11. The method according to claim 1, further comprising applying a sealing layer to the first primary face of the substrate. 12. The method according to claim 11, wherein a mold core of the tool incorporates a venting duct and/or a surface of the mold core of the tool is recessed in such a way that this, together with a surface of the sealing layer forms the venting duct. 13. The method according to claim 1, wherein a mold core of the tool incorporates a venting duct and/or a surface of the mold core of the tool is recessed in such a way that said surface, together with a surface of the substrate forms the venting duct. 14. The method according to claim 1, further comprising evacuating the closed cavity prior to an injection process. 15. The method according to claim 1, wherein a plurality of semiconductor bodies each of which is capable of generating electromagnetic radiation are attached from a front side to the first primary face of the substrate, the method further comprising: forming the covering comprises forming the covering over the front sides of the plurality of semiconductor bodies,the method further comprising separating the substrate into individual components after the covering has been applied. 16. The method according to claim 1, wherein the substrate has at least one raised region on its first primary face. 17. The method according to claim 16, wherein the at least one raised region has a shape of a dome. 18. The method according to claim 1, wherein the substrate has a structure on its first primary face that acts as a centering aid for a mold core. 19. The method according to claim 1, wherein the at least one sealing element has a cross-section that is, at least in part, triangular, trapezoidal or elliptical. 20. The method according to claim 1, wherein the at least one sealing element incorporates an elastic material.