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특허 상세정보

Method for the manufacture of an optoelectronic component and an optoelectronic component

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01L-021/00   
미국특허분류(USC) 438/026; 438/027; 438/028; 257/098; 257/099; 257/100; 257/E33.058
출원번호 US-0595887 (2008-04-14)
등록번호 US-8435806 (2013-05-07)
우선권정보 DE-10 2007 017 855 (2007-04-16)
국제출원번호 PCT/DE2008/000626 (2008-04-14)
§371/§102 date 20100330 (20100330)
국제공개번호 WO2008/125096 (2008-10-23)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Slater & Matsil, L.L.P.
인용정보 피인용 횟수 : 0  인용 특허 : 13
초록

A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavi...

대표
청구항

1. A method for the manufacture of an optoelectronic component, the method comprising: providing a substrate having a first primary face and a second primary face that lies opposite the first primary face,attaching a semiconductor body to the first primary face of the substrate the semiconductor body capable of emitting electromagnetic radiation from a front side, andforming a covering that is permeable to radiation from the semiconductor body to at least the front side of the semiconductor body, wherein the covering is given the form of an optical eleme...

이 특허에 인용된 특허 (13)

  1. Bast,Ulrich; Ernst,Georg; Zeiler,Thomas; Oechsner,Matthias. Device for packing electronic components using injection molding technology. USP2007057215010.
  2. Nishimoto, Keiji; Nagai, Hideo. LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module. USP2009117621654.
  3. Mueller, Gerd O.; Mueller-Mach, Regina; Basin, Grigoriy; West, Robert Scott; Martin, Paul S.; Lim, Tze-Sen; Eberle, Stefan. LED with phosphor tile and overmolded phosphor in lens. USP2010127858408.
  4. Park, Jun Seok; Kang, Seok Hoon. Light emitting device package and manufacture method of light emitting device package. USP2011077977699.
  5. Reeh,Ulrike; H철hn,Klaus; Stath,Norbert; Waitl,G체nter; Schlotter,Peter; Schneider,J체rgen; Schmidt,Ralf. Light-radiating semiconductor component with a luminescence conversion element. USP2006077078732.
  6. Loh, Ban P.; Medendorp, Jr., Nicholas W.. Methods of forming semiconductor light emitting device packages by liquid injection molding. USP2010077763478.
  7. Basin,Grigoriy; West,Robert Scott; Martin,Paul S.. Molded lens over LED die. USP2008117452737.
  8. Horio, Tomoharu; Tanuma, Yuki; Nakamura, Satoshi; Morimoto, Kazumi. Optical communication module. USP2012048148735.
  9. Basin,Grigoriy; West,Robert Scott; Martin,Paul S.; Harbers,Gerard; Smits,Willem H.; Hendriks,Robert F. M.; Konijn,Frans H.. Overmolded lens over LED die. USP2008037344902.
  10. Medendorp, Jr., Nicholas W.. Packaged semiconductor light emitting devices having multiple optical elements. USP2010057709853.
  11. Junker, Christian; Anderson, Michael J.. Process for molding on a substrate. USP2005066905643.
  12. Kamada, Kazuhiro. Semiconductor device and manufacturing method for same. USP2005096943433.
  13. Kenji Miyajima JP. Semiconductor device and manufacturing method thereof. USP2002046365979.