[특허]Optimization of desiccant usage in a MEMS package

Optimization of desiccant usage in a MEMS package 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-021/00
출원번호	US-0680503 (2007-09-28)
등록번호	US-8435838 (2013-05-07)
국제출원번호	PCT/US2007/020985 (2007-09-28)
§371/§102 date	20100930 (20100930)
국제공개번호	WO2009/041951 (2009-04-02)
발명자 / 주소	Lin, Yen Hua He, Rihui Wu, Lingling Palmateer, Lauren Heald, David
출원인 / 주소	QUALCOMM MEMS Technologies, Inc.
대리인 / 주소	Knobbe, Martens, Olson & Bear, LLP
인용정보	피인용 횟수 : 0 인용 특허 : 37

초록 ▼

A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.

대표청구항 ▼

1. A method of encapsulating a MEMS device, the method comprising: providing a substrate supporting a MEMS device;providing a backplate;providing a desiccant, said desiccant comprising calcium oxide and polytetrafluoroethylene;baking said desiccant under conditions sufficient to cause outgassing of organics retained therein, wherein baking said desiccant under conditions sufficient to cause outgassing of organics retained therein comprises heating said desiccant beyond what is necessary to cure said desiccant; andsealing said backplate to said substrate to form a MEMS package encapsulating the MEMS device and the desiccant. 2. The method of claim 1, wherein baking said desiccant comprises baking said desiccant at a temperature higher than about 105° C. 3. The method of claim 2, wherein baking said desiccant comprises baking said desiccant at a temperature higher than about 120° C. 4. A method of encapsulating a MEMS device, the method comprising: providing a substrate supporting a MEMS device; providing a backplate;providing a desiccant, said desiccant comprising calcium oxide and a polymer binding;baking said desiccant under conditions sufficient to cause outgassing of solvents retained therein, wherein baking said desiccant under conditions sufficient to cause outgassing of solvents retained therein comprises heating said desiccant beyond what is necessary to cure said desiccant; andsealing said backplate to said substrate to form a MEMS package encapsulating the MEMS device and the desiccant. 5. The method of claim 4, wherein providing a desiccant comprises providing a desiccant in paste form, and wherein baking said desiccant comprising baking said desiccant at a temperature higher than that required to solidify the desiccant. 6. The method of claim 4, wherein providing a desiccant comprises providing a desiccant in paste form, and wherein baking said desiccant comprising baking said desiccant for a duration longer than that required to solidify the desiccant. 7. The method of claim 4, wherein baking said desiccant comprises baking said desiccant at a temperature higher than about 220° C. 8. The method of claim 7 wherein baking said desiccant comprises baking said desiccant at a temperature higher than about 280° C. 9. The method of claim 1, wherein heating said desiccant beyond what is necessary to cure said desiccant includes heating said desiccant at a temperature above the temperature required to cure the desiccant. 10. The method of claim 1, wherein heating said desiccant beyond what is necessary to cure said desiccant includes heating said desiccant at a temperature at least twice the temperature required to cure the desiccant. 11. The method of claim 1, wherein heating said desiccant beyond what is necessary to cure said desiccant includes heating said desiccant for a period longer than required to cure the desiccant. 12. The method of claim 1, wherein heating said desiccant beyond what is necessary to cure said desiccant includes heating said desiccant for a period at least six times longer than required to cure the desiccant. 13. The method of claim 4, wherein heating said desiccant beyond what is necessary to cure said desiccant includes heating said desiccant at a temperature above the temperature required to cure the desiccant. 14. The method of claim 4, wherein heating said desiccant beyond what is necessary to cure said desiccant includes heating said desiccant at a temperature at least twice the temperature required to cure the desiccant. 15. The method of claim 4, wherein heating said desiccant beyond what is necessary to cure said desiccant includes heating said desiccant for a period longer than required to cure the desiccant. 16. The method of claim 4, wherein heating said desiccant beyond what is necessary to cure said desiccant includes heating said desiccant for a period at least six times longer than required to cure the desiccant.

이 특허에 인용된 특허 (37)

Wallace Robert M. (Richardson TX) Gnade Bruce E. (Dallas TX) Kirk Wiley P. (Richardson TX), Anode plate for flat panel display having silicon getter.
상세보기
Floyd, Philip D.; Arbuckle, Brian W., Device having patterned spacers for backplates and method of making the same.
상세보기
Shores A. Andrew (212 Carroll Canal Venice CA 90291), Enclosure for electronic devices.
상세보기
Kothari, Manish; Chui, Clarence, Hermetic seal and method to create the same.
상세보기
Henderson Jeff R. (Madison WI) Jablonski Michael (Madison WI) Adams Gregory E. (Madison WI), Interchangeable beam splitting holder and compartment therefor.
상세보기
Miles Mark W., Interferometric modulation.
상세보기
Miles, Mark W., Interferometric modulation of radiation.
상세보기
Miles, Mark W., Interferometric modulation of radiation.
상세보기
Miles,Mark W., Interferometric modulation of radiation.
상세보기
Burton ; Henry W. G., Kit for converting single-glazed window to double-glazed window.
상세보기
Curtin,Christopher J.; Haven,Duane A.; Hopple,George B.; Pan,Lawrence S.; Maslennikov,Igor L.; Nystrom,Michael J.; Liu,Jun Gordon; Gluck,Randolph S.; Kosugi,Tomoo; Dunphy,James C.; Morris,David L., Light-emitting and electron-emitting devices having getter regions.
상세보기
Natarajan, Bangalore R.; Ganti, Surya, MEMS devices and processes for packaging such devices.
상세보기
Robinson William P. ; Little Michael J. ; Gifford Eric A., Membrane-actuated charge controlled mirror (CCM) projection display.
상세보기
Howell Michial Duff ; Bowman Barry Roy, Method and apparatus for preparing semiconductor wafers for measurement.
상세보기
Sadones Henri (Paris FRX), Method and device for analyzing a very high frequency radiation beam of electromagnetic waves.
상세보기
Hayashi, Kenji; Tanaka, Shigeki; Kobayashi, Hidekazu; Nakadate, Makoto, Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances.
상세보기
Wallace Robert M. (Dallas TX) Webb Douglas A. (Phoenix AZ), Micro-mechanical device with non-evaporable getter.
상세보기
Klonis Homer B. ; Yeh Arlene Y. ; Reed Mark, Micromechanical device including time-release passivant.
상세보기
Kothari,Manish; Chui,Clarence; Palmateer,Lauren, Modifying the electro-mechanical behavior of devices.
상세보기
Shores A. Andrew (212 Carroll Canal Venice CA 90291), Moisture and particle getter for enclosures.
상세보기
Shores A. Andrew (Venice CA), Moisture getting composition for hermetic microelectronic devices.
상세보기
Przybyla,James R.; Piehl,Arthur R., Optical electronic device with partial reflector layer.
상세보기
Saaski Elric W. (Bothell WA) Lawrence Dale M. (Lynnwood WA), Optically resonant sensor with increased monotonic range.
상세보기
Kawami Shin,JPX ; Nakada Hitoshi,JPX ; Naito Takemi,JPX, Organic EL element.
상세보기
Deffeyes Robert J. (Arlington TX), Package having dessicant composition.
상세보기
Palmateer,Lauren Fay; Gally,Brian James; Cummings,William J.; Kothari,Manish; Chui,Clarence, Packaging for an interferometric modulator.
상세보기
Palmateer,Lauren; Gally,Brian J.; Cummings,William J.; Kothari,Manish; Chui,Clarence, Packaging for an interferometric modulator.
상세보기
Miles,Mark W., Photonic MEMS and structures.
상세보기
Miles, Mark W., Photonic mems and structures.
상세보기
Cummings,William J.; Gally,Brian J., Process for modifying offset voltage characteristics of an interferometric modulator.
상세보기
Hirokazu Honda JP, Semiconductor device having a flip chip cavity with lower stress and method for forming same.
상세보기
Palmateer, Lauren, System and method for display device with integrated desiccant.
상세보기
Palmateer, Lauren, System and method for display device with reinforcing substance.
상세보기
Palmateer, Lauren; Cummings, William J.; Gally, Brian; Chui, Clarence, System and method for protecting micro-structure of display array using spacers in gap within display device.
상세보기
Gally,Brian; Palmateer,Lauren; Cummings,William J., System and method for protecting microelectromechanical systems array using back-plate with non-flat portion.
상세보기
Gally,Brian; Palmateer,Lauren; Cummings,William J., System and method for protecting microelectromechanical systems array using structurally reinforced back-plate.
상세보기
Palmateer, Lauren; Cummings, William J.; Gally, Brian J., System and method of providing MEMS device with anti-stiction coating.
상세보기

내보내기 메뉴

내보내기 구분

파일저장
인쇄
메일전송

구성항목

기본정보
상세정보

관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC

저장형식

Text(ASCII format)
Excel format
PIAS분석(.xls)

메일정보

받는사람 (필수): @
보내는사람 (선택): @
제목
내용: KISTI 검색결과 이메일 서비스

안내

총 건의 자료가 검색되었습니다.

다운받으실 자료의 인덱스를 입력하세요. (1-10,000)

검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다.

데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요)

다운로드 파일은 UTF-8 형태로 저장됩니다.
파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오.

Text(ASCII format)
Excel format

AI-Helper ※ AI-Helper는 을 사용합니다.

AI-Helper

안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

연합인증

Optimization of desiccant usage in a MEMS package 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

이 특허에 인용된 특허 (37)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Optimization of desiccant usage in a MEMS package 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

전체(0) 논문(0) 특허(0) 보고서(0)

전체(0) 논문(0) 특허(0) 보고서(0)

이 특허에 인용된 특허 (37)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트