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Load lock having secondary isolation chamber 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23F-001/00
  • H01L-021/306
출원번호 US-0695072 (2010-01-27)
등록번호 US-8440048 (2013-05-14)
발명자 / 주소
  • Aggarwal, Ravinder
  • Stoutjesdijk, Jeroen
  • Hill, Eric
  • Davis, Loring G.
  • DiSanto, John T.
출원인 / 주소
  • ASM America, Inc.
대리인 / 주소
    Knobbe Martens Olson & Bear LLP
인용정보 피인용 횟수 : 2  인용 특허 : 45

초록

A load lock includes a chamber including an upper portion, a lower portion, and a partition between the upper portion and the lower portion, the partition including an opening therethrough. The load lock further includes a first port in communication with the upper portion of the chamber and a secon

대표청구항

1. A load lock comprising: a chamber including an upper portion, a lower portion, and a partition between the upper portion and the lower portion, the partition including an opening therethrough;a first port in communication with the upper portion of the chamber;a second port in communication with t

이 특허에 인용된 특허 (45)

  1. Nering Eric A., Apparatus and method for automated cassette handling.
  2. Tanaka Keiichi,JPX ; Sohma Masaki,JPX ; Asao Shinsuke,JPX ; Ozawa Masahito,JPX, Auxiliary vacuum chamber and vacuum processing unit using same.
  3. Yudovsky, Joseph; Cook, Robert C.; Merry, Nir, Batch deposition tool and compressed boat.
  4. Muka Richard S. (Topsfield MA) Pippins Michael W. (Hamilton MA) Drew Mitchell A. (Portsmouth NH), Batchloader for load lock.
  5. Stevens, Ronald R., Bellows isolation for index platforms.
  6. Muka Richard S. (Topsfield MA) Pippins Michael W. (Hamilton MA) Drew Mitchell A. (Portsmouth NH), Cluster tool batchloader of substrate carrier.
  7. Tepman Avi ; Yin Gerald Zheyao ; Olgado Donald, Compartmentalized substrate processing chamber.
  8. Tepman Avi ; Yin Gerald Zheyao ; Olgado Donald, Compartnetalized substrate processing chamber.
  9. Fishkin Boris (San Jose CA) Sato Seiji (Palo Alto CA) Lowrance Robert B. (Los Gatos CA), Controlled environment enclosure and mechanical interface.
  10. Kyogoku Mitsusuke,JPX, Device and method for load locking for semiconductor processing.
  11. Bonora Anthony C. (Menlo Park CA) Oen Joshua T. (Newark CA), Direct loadlock interface.
  12. Muka Richard S. (Topsfield MA), Door drive mechanisms for substrate carrier and load lock.
  13. Salzman Philip M. (San Jose CA), Enclosure for load lock interface.
  14. Salzman Philip M. (San Jose CA), Enclosure for load lock interface.
  15. Robinson McDonald (Paradise Valley AZ) Ozias Albert E. (Aumsville OR), Heating system for reaction chamber of chemical vapor deposition equipment.
  16. Wytman Joe, High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock.
  17. Kyogoku Mitsusuke (Tama JPX), Load lock chamber for vertical type heat treatment apparatus.
  18. Raaijmakers,Ivo; Aggarwal,Ravinder; Kusbel,James, Loadlock with integrated pre-clean chamber.
  19. Hashimoto Tsuyoshi,JPX ; Matsuse Kimihiro,JPX ; Okubo Kazuya,JPX ; Takahashi Tsuyoshi,JPX, Method and apparatus for forming laminated thin films or layers.
  20. Verhaverbeke,Steven; Truman,J Kelly; Lane,Christopher T; Somekh,Sasson R, Method and apparatus for processing a wafer.
  21. Guo Xin Sheng ; Li Shin-Hung ; Lei Lawrence, Method and apparatus for reducing contamination of a substrate in a substrate processing system.
  22. Krueger Gordon P. (San Jose CA), Micro-enviroment load lock.
  23. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multi-chamber integrated process system.
  24. Raaijmakers Ivo J., Multi-position load lock chamber.
  25. Doering Kenneth ; Galewski Carl J., Multipurpose processing chamber for chemical vapor deposition processes.
  26. Yano Kensaku (Kanagawa JPX) Furukawa Akihiko (Tokyo JPX) Miyagawa Ryohei (Kanagawa JPX) Iida Yoshinori (Tokyo JPX), Photo chemical reaction apparatus.
  27. Yamazaki Shunpei,JPX ; Takayama Toru,JPX ; Sakama Mitsunori,JPX ; Abe Hisashi,JPX ; Uehara Hiroshi,JPX ; Ishiwata Mika,JPX, Plasma CVD apparatus.
  28. Fujiura Kazuo (Mito JPX) Ohishi Yasutake (Mito JPX) Fujiki Michiya (Mito JPX) Kanamori Terutoshi (Mito JPX) Takahashi Shiro (Mito JPX), Process for the preparation of fluoride glass and process for the preparation of optical fiber preform using the fluorid.
  29. Takahashi Nobuaki (Hachioji JPX), Processing apparatus with means for rotating an object mounting means and a disk body located in the mounting means diff.
  30. Kyogoku, Mitsusuke; Yamagishi, Takayuki, Sealing mechanism of multi-chamber load-locking device.
  31. Ozawa Makoto,JPX ; Hirano Mitsuhiro,JPX, Semiconductor manufacturing equipment and method for carrying wafers in said equipment.
  32. Yamagishi,Takayuki; Suwada,Masaei; Watanabe,Takeshi, Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections.
  33. Yamagishi,Takayuki; Watanabe,Takeshi, Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same.
  34. Stevens Ronald R. ; Aggarwal Ravinder, Stackable cassette for use with wafer cassettes.
  35. Hiroyuki Shinozaki JP, Substrate processing apparatus including a magnetically levitated and rotated substrate holder.
  36. Adams Douglas R., Substrate processing apparatus with small batch load lock.
  37. Lee Ke Ling ; Mazur Mikhail ; Lee Ken ; Martinson Robert M., System and method for handling and masking a substrate in a sputter deposition system.
  38. Ohkase Wataru (Sagamihara JPX), Thermal processing apparatus with heat shielding member.
  39. Ohmi Tadahiro (1-17-301 ; Komegabukuro 2-chome ; Aoba-ku Sendai-shi ; Miyagi-ken 980 JPX) Shibata Tadashi (Sendai JPX) Umeda Masaru (Tokyo JPX), Thin film forming equipment.
  40. Ohmi Tadahiro,JPX ; Shibata Tadashi,JPX ; Umeda Masaru,JPX, Thin film forming equipment.
  41. Takahashi Kiichi,JPX ; Kikuchi Hiroshi,JPX, Transfer apparatus and vertical heat-processing system using the same.
  42. Aggarwal, Ravinder; Kusbel, James F., Transfer chamber with integral loadlock and staging station.
  43. Muka Richard S., Vacuum integrated SMIF system.
  44. Saeki Hiroaki (Yamanashi JPX), Vacuum processing apparatus.
  45. Goodwin Dennis L. (Tempe AZ) Crabb Richard (Mesa AZ) Robinson McDonald (Paradise Valley AZ) Ferro Armand P. (Scottsdale AZ), Wafer handling system with Bernoulli pick-up.

이 특허를 인용한 특허 (2)

  1. Aggarwal, Ravinder K.; Stoutjesdijk, Jeroen; Hill, Eric R.; Davis, Loring G.; DiSanto, John T., Load lock having secondary isolation chamber.
  2. Tsumori, Toshiro; Mitani, Shinichi; Suzuki, Kunihiko, Semiconductor substrate manufacturing apparatus.
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