초록 ▼

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoe

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

대표청구항 ▼

1. A method for assembling a printable semiconductor element on a receiving surface of a substrate, said method comprising the steps of: providing said printable semiconductor element comprising a unitary inorganic semiconductor structure having at least one cross sectional dimension greater than or

1. A method for assembling a printable semiconductor element on a receiving surface of a substrate, said method comprising the steps of: providing said printable semiconductor element comprising a unitary inorganic semiconductor structure having at least one cross sectional dimension greater than or equal 500 nanometers operationally connected to at least one additional device component or structure selected from the group consisting of a conducting layer, a dielectric layer, an electrode, and an additional semiconductor structure;contacting said printable semiconductor element with a conformable transfer device having a contact surface, wherein contact between said contact surface and said printable semiconductor element binds said printable semiconductor element to said contact surface, thereby forming said contact surface having said printable semiconductor element disposed thereon;contacting said printable semiconductor element disposed on said contact surface with said receiving surface of said substrate; andseparating said contact surface of said conformable transfer device and said printable semiconductor element, wherein said printable semiconductor element is transferred onto said receiving surface, thereby assembling said printable semiconductor element on said receiving surface of said substrate. 2. The method of claim 1 wherein said printable semiconductor element comprises a semiconductor device. 3. The method of claim 1 wherein said printable semiconductor element comprises a transistor. 4. The method of claim 1 wherein said printable semiconductor element comprises a diode, a p-n junction or a photodiode. 5. The method of claim 1 wherein said printable semiconductor element comprises a solar cell. 6. The method of claim 1 wherein said printable semiconductor element comprises a fully formed circuit. 7. The method of claim 1 wherein said printable semiconductor element is assembled on a substrate comprising a preformed integrated circuit. 8. The method of claim 1 wherein conformal contact is established between the contact surface of said conformable transfer device and an external surface of said printable semiconductor element and wherein conformal contact is established between said contact surface having said printable semiconductor element disposed thereon and said receiving surface of said substrate. 9. The method of claim 1 wherein said conformable transfer device comprises an elastomeric stamp. 10. The method of claim 1 wherein said steps of: contacting said printable semiconductor element with a conformable transfer device, contacting said printable semiconductor element disposed on said contact surface with said receiving surface of said substrate; and separating said contact surface of said conformable transfer device and said printable semiconductor element comprise dry transfer printing said printable semiconductor element onto said receiving surface. 11. The method of claim 1 wherein said step of providing said printable semiconductor element comprises providing said semiconductor element in a selected orientation on a mother substrate, wherein said selected orientation of said semiconductor element is maintained during contact with said contact surface by an alignment maintaining element which couples said mother substrate and said printable semiconductor element, and wherein said step of contacting said printable semiconductor element disposed on said contact surface with said receiving surface of said substrate device disengages said alignment maintaining element, thereby releasing said printable semiconductor element from said mother substrate. 12. The method of claim 1 further comprising the steps of: providing additional printable semiconductor elements, wherein each of said additional printable semiconductor elements comprises a unitary inorganic semiconductor structure having at least one cross sectional dimension greater than or equal 500 nanometers operationally connected to at least one additional device component or structure selected from the group consisting of a conducting layer, a dielectric layer, an electrode, and an additional semiconductor structure;contacting at least a portion of said printable semiconductor elements with a conformable transfer device having a contact surface, wherein contact between said contact surface and said printable semiconductor element binds at least a portion of said additional printable semiconductor elements to said contact surface and generates said contact surface having at least a portion of said additional printable semiconductor elements disposed thereon in relative orientations comprising a selected pattern of a plurality of said printable semiconductor elements;contacting said printable semiconductor elements disposed on said contact surface with said receiving surface of said substrate; andseparating said contact surface of said conformable transfer device and said printable semiconductor elements, wherein said printable semiconductor elements are transferred onto said receiving surface in said relative orientations comprising said selected pattern. 13. The method of claim 12 wherein said printable semiconductors are provided on a mother substrate in said relative orientations comprising said selected pattern, and wherein said relative orientations are preserved during transfer to said receiving surface. 14. The method of claim 12 wherein said conformable transfer device establishes conformal contact between the contact surface and selected printable semiconductor elements but not all of said printable semiconductor elements, thereby generating said contact surface having said printable semiconductor element disposed thereon in said relative orientations comprising said selected pattern, and wherein said relative orientations are preserved during transfer to said receiving surface. 15. The method of claim 1 comprising a method for assembling an electrical device selected from the group consisting of: a transistor; a solar cell; a photodiode; a light emitting diode; a microelectromechanical device; a nanoelectromechanical device; a laser; a P-N junction; and a complementary logic circuit.