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Within a dynamic array architecture, an irregular wire layout region within a portion of a chip level layout is bracketed by placing first and second regular wire layout shapes on a first and second sides, respectively, of the irregular wire layout region. One or more irregular wire layout shapes ar

Within a dynamic array architecture, an irregular wire layout region within a portion of a chip level layout is bracketed by placing first and second regular wire layout shapes on a first and second sides, respectively, of the irregular wire layout region. One or more irregular wire layout shapes are placed within the irregular wire layout region. A first edge spacing is maintained between the first regular wire layout shape and a first outer irregular wire layout shape within the irregular wire layout region nearest to the first regular wire layout shape. A second edge spacing is maintained between the second regular wire layout shape and a second outer irregular wire layout shape within the irregular wire layout region nearest to the second regular wire layout shape. The first and second edge spacings are defined to optimize lithography of the regular and irregular wire layout shapes.

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1. A method for placing irregular layout shapes in a dynamic array architecture, comprising: bracketing, by operating a computer, an irregular wire layout region within a portion of a chip level layout by placing a first regular wire layout shape on a first side of the irregular wire layout region a

1. A method for placing irregular layout shapes in a dynamic array architecture, comprising: bracketing, by operating a computer, an irregular wire layout region within a portion of a chip level layout by placing a first regular wire layout shape on a first side of the irregular wire layout region and by placing a second regular wire layout shape on a second side of the irregular wire layout region;placing, by operating the computer, one or more irregular wire layout shapes within the irregular wire layout region, such that a first edge spacing is maintained between the first regular wire layout shape and an irregular wire layout shape within the irregular wire layout region nearest to the first regular wire layout shape, and such that a second edge spacing is maintained between the second regular wire layout shape and an irregular wire layout shape within the irregular wire layout region nearest to the second regular wire layout shape,wherein each of the first and second regular wire layout shapes and each of the one or more irregular wire layout shapes correspond to a respective conductive structure in a chip level corresponding to the portion of the chip level layout,wherein the first and second edge spacings are defined to optimize lithography of the first and second regular wire layout shapes and of the one or more irregular wire layout shapes within the irregular wire layout region; andrecording the chip level layout including the irregular wire layout region on a data storage device for storing data to be read by a computer system. 2. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 1, wherein the second side is opposite the first side relative to the irregular wire layout region. 3. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 1, wherein the first and second regular wire layout shapes are placed in accordance with respective virtual lines of a virtual grate defined over the portion of the chip level layout. 4. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 3, wherein the virtual grate is defined by a set of parallel equally spaced virtual lines extending across the portion of the chip level, and wherein a constant perpendicular spacing separates adjacent virtual lines of the virtual grate. 5. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 3, wherein each of the first and second edge spacings is measured in a direction perpendicular to the virtual lines of the virtual grate. 6. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 1, wherein each of the first and second regular wire layout shapes is defined by a fixed regular wire layout shape width dimension specified for the portion of the chip level layout. 7. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 6, wherein each of the one or more irregular wire layout shapes is defined by any width dimension different than the fixed regular wire layout shape width dimension specified for the portion of the chip level layout. 8. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 1, wherein each of the first and second regular wire layout shapes is substantially rectangular shaped, and wherein each of the one or more irregular wire layout shapes is substantially rectangular shaped. 9. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 1, wherein regular wire layout shapes outside of the irregular wire layout region are separated by a standard spacing, wherein the standard spacing is a distance measured perpendicularly between facing long edges of adjacent and parallel regular wire layout shapes. 10. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 9, wherein the first edge spacing is equal to the standard spacing and the second specified edge spacing is not equal to the standard spacing. 11. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 9, wherein both the first and second specified edge spacings are equal to the standard spacing. 12. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 9, wherein a uniform perpendicular spacing exists between facing long edges of adjacent irregular wire layout shapes within the irregular wire layout region. 13. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 12, wherein the uniform perpendicular spacing is equal to the standard spacing. 14. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 12, wherein the uniform perpendicular spacing is not equal to the standard spacing. 15. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 12, wherein both the first and second edge spacings are equal to the uniform perpendicular spacing. 16. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 1, wherein multiple perpendicular spacings exist between facing long edges of adjacent irregular wire layout shapes within the irregular wire layout region. 17. The method for placing irregular layout shapes in a dynamic array architecture as recited in claim 1, wherein one or more subresolution layout shapes are placed within the irregular wire layout region to lithographically reinforce either the first regular wire layout shape, or the second regular wire layout shape, or one or more irregular wire layout shapes, or a combination thereof. 18. A data storage device for storing data to be read by a computer system, comprising: a semiconductor chip layout recorded in a digital format, wherein the semiconductor chip layout includes irregular layout shapes placed in a dynamic array architecture,wherein an irregular wire layout region within a portion of a chip level layout of the semiconductor chip layout is bracketed by a first regular wire layout shape on a first side of the irregular wire layout region and by a second regular wire layout shape on a second side of the irregular wire layout region,wherein one or more irregular wire layout shapes are placed within the irregular wire layout region, such that a first edge spacing is maintained between the first regular wire layout shape and an irregular wire layout shape within the irregular wire layout region nearest to the first regular wire layout shape, and such that a second edge spacing is maintained between the second regular wire layout shape and an irregular wire layout shape within the irregular wire layout region nearest to the second regular wire layout shape, andwherein each of the first and second regular wire layout shapes and each of the one or more irregular wire layout shapes correspond to a respective conductive structure in a semiconductor chip level corresponding to the portion of the chip level layout, andwherein the first and second edge spacings are defined to optimize lithography of the first and second regular wire layout shapes and of the irregular wire layout shapes within the irregular wire layout region. 19. The data storage device for storing data to be read by a computer system as recited in claim 18, wherein the digital format is a data file format for storing and communicating one or more semiconductor device layouts. 20. The data storage device for storing data to be read by a computer system as recited in claim 18 further comprising: program instructions for accessing and retrieving the semiconductor chip layout or a portion thereof in the digital format. 21. The data storage device for storing data to be read by a computer system as recited in claim 20, wherein the program instructions for accessing and retrieving include program instructions for selecting a library, a cell, or both library and cell including a selectable portion of the semiconductor chip layout in the digital format. 22. A method for defining a virtual grate for a layout of a portion of a semiconductor chip level, comprising: performing an operation (a) to identify a preferred routing direction for a portion of a given chip level;performing an operation (b) to identify each contact level layout related to the portion of the given chip level layout, wherein each identified contact level is defined by a respective related virtual grate defined by a respective set of parallel virtual lines extending in the preferred routing direction, wherein layout shapes within a given contact level are placed in accordance with the respective related virtual grate of the given contact level;performing an operation (c) to define, by operating a computer, a trial virtual grate for the portion of the given chip level layout as a set of parallel virtual lines extending in the preferred routing direction, wherein the set of parallel virtual lines of the trial virtual grate is defined to enable required connections between layout shapes placed in accordance with the trial virtual grate within the portion of the given chip level layout and layout shapes within each identified contact level; andperforming an operation (d) to determine whether a perpendicular spacing between adjacent virtual lines of the trial virtual grate provides for adequate lithographic reinforcement of layout shapes to be placed in accordance with the trial virtual grate; whereinif the perpendicular spacing between adjacent virtual lines of the trial virtual grate is determined adequate, recording the trial virtual grate as a final virtual grate of the portion of the given chip level layout on a data storage device for storing data to be read by a computer system; andif the perpendicular spacing between adjacent virtual lines of the trial virtual grate is determined inadequate, adjusting, by operating a computer, at least one related virtual grate of any identified contact level and repeat operations (c) and (d). 23. The method for defining a virtual grate for a layout of a portion of a semiconductor chip level as recited in claim 22, wherein a given contact level is related to the portion of the given chip level layout when the given contact level includes at least one layout shape that is to physically contact any layout shape within the portion of the given chip level layout. 24. The method for defining a virtual grate for a layout of a portion of a semiconductor chip level as recited in claim 22, wherein a uniform perpendicular spacing separates adjacent virtual lines of the trial virtual grate. 25. The method for defining a virtual grate for a layout of a portion of a semiconductor chip level as recited in claim 22, wherein adjusting at least one related virtual grate includes repositioning of one or more contacts within the identified contact level corresponding to the at least one related virtual grate. 26. The method for defining a virtual grate for a layout of a portion of a semiconductor chip level as recited in claim 22, wherein performing the operations (a) through (d) comprise executing computer program instructions stored on a computer readable storage medium.