$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Mask and method for sealing a glass envelope

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C03B-023/203
출원번호 US-0157515 (2008-06-11)
등록번호 US-8448468 (2013-05-28)
발명자 / 주소
  • Pastel, Michelle Nicole Haase
  • Strines, Brian Paul
출원인 / 주소
  • Corning Incorporated
대리인 / 주소
    Hardee, Ryan T.
인용정보 피인용 횟수 : 14  인용 특허 : 24

초록

A mask for laser sealing a temperature and environmentally sensitive element, such as an OLED device, surrounded by a frit wall between first and second substrates. The mask is opaque and has a transparent elongate transmission region. The width of the transmission region may be substantially equal

대표청구항

1. A method of encapsulating a temperature and environmentally sensitive element comprising: providing a first substrate and a second substrate separated by at least one frit wall having, the frit wall having a height extending between the first and second substrates and a width including a central

이 특허에 인용된 특허 (24)

  1. Shi Song Q. ; So Franky ; Lee Hsing-Chung, Active matrix OED array with improved OED cathode.
  2. Boroson Michael L. ; Serbicki Jeffrey P. ; Bessey Peter G., Desiccation of moisture-sensitive electronic devices.
  3. William L. Tonar ; Jeffrey A. Forgette ; John S. Anderson ; Jon H. Bechtel ; John W. Carter ; Joseph S. Stam, Electrochromic rearview mirror incorporating a third surface metal reflector and a display/signal light.
  4. Hueschen Mark R., Electroluminescent device and fabrication method for a light detection system.
  5. Affinito John D., Environmental barrier material for organic light emitting device and method of making.
  6. Aitken,Bruce G.; Carberry,Joel P.; DeMartino,Steven E.; Hagy,Henry E.; Lamberson,Lisa A.; Miller, II,Richard J.; Morena,Robert; Schroeder, III,Joseph F.; Streltsov,Alexander; Widjaja,Sujanto, Glass package that is hermetically sealed with a frit and method of fabrication.
  7. Domi, Shinjiro; Sakaguchi, Koichi; Misonou, Masao, Glass panel and production method therefor.
  8. Michael L. Boroson ; John Schmittendorf ; Peter G. Bessey ; Jeffrey P. Serbicki, Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps.
  9. Nagahara Shigehiro (Yokohama JA) Ichimura Nobuyoshi (Chigasaki JA) Suzuki Yoshiro (Tokyo JA), Liquid crystal cells.
  10. Sun Jennifer Y. ; Ma Yutao, Low temperature glass frit sealing for thin computer displays.
  11. Kadowaki Akira (Mobara JPX) Itoh Shigeo (Mobara JPX) Kogure Youich (Mobara JPX) Tonegawa Takeshi (Mobara JPX), Method for sealedly forming envelope.
  12. Matthias Klockhaus DE; Dieter Jestel DE, Method for welding the surfaces of materials.
  13. Becken, Keith James; Logunov, Stephan Lvovich, Method of encapsulating a display element with frit wall and laser beam.
  14. Islam Safidul (Richardson TX), Method of hermetically encapsulating a semiconductor device by laser irradiation.
  15. Daniel Hani S. (Rockville MD) Moore Douglas R. (Severna Park MD), Method of securing optical fiber components, devices and fibers to the same or to mounting fixtures.
  16. Rogers Stephen P. ; So Franky ; Shi Song Q. ; Webb Brian A., Organic electroluminescent device hermetic encapsulation package.
  17. Rogers Stephen P., Organic electroluminescent device hermetic encapsulation package and method of fabrication.
  18. Roitman Daniel B. ; Sheats James R., Organic electroluminescent device with full color characteristics.
  19. Jones Gary W. ; Ghosh Amalkumar P., Passive matrix OLED display.
  20. Anil Raj Duggal, Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen, such as organic electroluminescent devices.
  21. Pichler,Karl; Frischknecht,Kyle D., Sealing of electronic device using absorbing layer for glue line.
  22. Dennis Lee Matthies ; Zilan Shen ; Roger Green Stewart ; James Harold Atherton, Sealing of large area display structures.
  23. Sheats James R. ; Hueschen Mark R. ; Seaward Karen L. ; Roitman Daniel B. ; Briggs George Andrew Davidson,GBX, Transparent, flexible permeability barrier for organic electroluminescent devices.
  24. Tracy C. Edwin (Golden CO) Benson David K. (Golden CO), Welding/sealing glass-enclosed space in a vacuum.

이 특허를 인용한 특허 (14)

  1. Ruben, David A; Sandlin, Michael S, Devices formed with techniques for bonding substrates using an intermediate layer.
  2. Chang, Wei-Chih; Hsiao, Chih-Hung; Chen, Hsien-Hung, Display panel and sealing process thereof.
  3. Ruben, David A; Sandlin, Michael S, Feedthrough assemblies.
  4. Ruben, David A, Hermetically-sealed packages including feedthrough assemblies.
  5. Ruben, David A; Sandlin, Michael S, Implantable medical device system including feedthrough assembly and method of forming same.
  6. Sandlin, Michael S.; Ruben, David A.; Karam, Raymond M.; Roussos, Georges; Wynne, Thomas M., Kinetically limited nano-scale diffusion bond structures and methods.
  7. Danzl, Ralph B.; Ruben, David A.; Sandlin, Michael S., Laser assisted direct bonding.
  8. Nakamura, Daiki; Kubota, Yusuke; Nishido, Yusuke, Sealed body and method for manufacturing the same.
  9. Ruben, David A; Schmidt, Craig L, Sealed package and method of forming same.
  10. Ruben, David A.; Sandlin, Michael S., Techniques for bonding substrates using an intermediate layer.
  11. Ruben, David A; Sandlin, Michael S, Techniques for bonding substrates using an intermediate layer.
  12. O'Brien, Richard J.; Day, John K.; Gerrish, Paul F.; Mattes, Michael F.; Ruben, David A.; Grief, Malcolm K., Wafer-scale package including power source.
  13. O'Brien, Richard J.; Day, John K.; Gerrish, Paul F.; Mattes, Michael F.; Ruben, David A.; Grief, Malcolm K., Wafer-scale package including power source.
  14. O'Brien, Richard J; Day, John K; Gerrish, Paul F; Mattes, Michael F; Ruben, David A; Grief, Malcolm K, Wafer-scale package including power source.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트