[특허]Semiconductor application installation adapted with a temperature equalization system

Yang, Tai-Her

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특허 상세정보

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Semiconductor application installation adapted with a temperature equalization system

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G05D-023/00 F24J-003/08
미국특허분류(USC)	236/001C; 062/260; 165/045; 165/097; 165/244; 165/247
출원번호	US-0457505 (2009-06-12)
등록번호	US-8448876 (2013-05-28)
발명자 / 주소	Yang, Tai-Her
출원인 / 주소	Yang, Tai-Her
대리인 / 주소	Bacon & Thomas, PLLC
인용정보	피인용 횟수 : 10 인용 특허 : 5

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The primary purpose of the present invention is to provide an fluid circulating installation adapted with a temperature equalization system and fluid transmission duct disposed in a heat carrier existing in solid or liquid state in the nature where presents comparatively larger and more reliable heat carrying capacity. The fluid passes through the solid or gas state semiconductor application installation to regulate the semiconductor application installation for temperature equalization, and flows back to the heat equalization installation disposed in th...

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1. A temperature equalization system for a semiconductor application installation (103), wherein the semiconductor application installation (103) is one of a light emitting diode (LED) with a heat dissipation structure, a gas state lamp structure (1031), and a photovoltaic device (1032) with a heat dissipation structure, said temperature equalization system comprising: a first heat equalizer (102) made of a thermally conductive material in thermal contact with a natural heat carrier (101), the first heat equalizer (102) having a fluid inlet, a fluid outlet, and at least one of an internal fluid passage and a space in the natural heat carrier for carrying a first fluid (204);a first fluid transmission duct (205) for carrying the first fluid (204) from the heat equalizer (102) to a location near the semiconductor application installation (103);a first pump (206) for pumping the first fluid (204) through the first fluid transmission duct (205);a second fluid transmission duct (105) for carrying a second fluid (104) past the heat dissipation structure of the LED or photovoltaic device (1032), or past the gas state lamp structure (1031), to provide temperature equalization;a second pump (106) for pumping the second fluid (104) through the second fluid transmission duct (105);a control unit (110) for controlling operation of the second pump (106) to cause a temperature of the semiconductor application installation (103) to be within a programmed temperature range in response to feedback from a temperature detector device (107) that monitors a temperature of the semiconductor application installation (103); anda relay heat equalizer (202) extending between the first fluid transmission duct (205) and the second fluid transmission duct (105) for transferring heat between the first fluid (204) and the second fluid (104). 2. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, wherein the semiconductor application installation (103) further includes a bypass duct (119), a bypass control valve (120), and bypass auxiliary pump (121) for selectively causing the second fluid (104) to flow through an individual part of the semiconductor application installation (103) and then back to the relay heat equalizer (202). 3. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, wherein the fluid (104) is one of a gas and a liquid. 4. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, wherein the first fluid transmission duct (205) is thermally insulated. 5. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, further comprising an auxiliary temperature regulating device (109) for heating or cooling the second fluid (104) in response to feedback from the temperature detector device (107) for providing auxiliary temperature equalization after activation of said second pump (106) and before the temperature of said semiconductor application installation (103) is within said programmed temperature range. 6. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, further comprising a filter (108) provided at the fluid inlet or fluid outlet for preventing the second fluid transmission duct (105) from being plugged by foreign material. 7. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, wherein the relay heat equalizer (202) includes a first fluid passage having an inlet, flowing passage, and outlet for the second fluid (104), and a second fluid passage having an inlet, flowing passage, and outlet for the first fluid (204). 8. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, wherein the control unit (110) further controls the first pump (206) to pump said first fluid (204) between the first heat equalizer (102) and the relay heat equalizer (202). 9. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, wherein the natural heat carrier (101) consists of a solid or liquid heat carrier including at least one of an earth stratum, surface of the earth, pond, lake, river, desert, iceberg, and ocean. 10. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, wherein pumping by said first pump (206) or second pump (106) is assisted by convection effects. 11. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, wherein at least one of said first pump (206) and said second pump (106) has a reversible direction, and said control unit (110) controls a flow direction at which the fluids (204) and 104) are respectively pumped by the first pump (206) and second pump (106). 12. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, wherein at least one of said first pump (206) and said second pump (106) is controlled to execute at least one of the following modes: a. only one of said first and second pumps executes one-way continuous pumping,b. only one of said first and second pumps executes one-way intermittent pumping,c. only one of said first and second pumps executes one-way pumping to periodically change a flow direction of the respective one of said first and second fluids that is pumped through the respective first pump or second pump, by controlling a value allowing variable flow direction,d. at least both of said first and second pumps having different power sources execute pumping in different directions at a same time, or separately execute pumping in periodically changed flow directions,e. at least both of said first and second pumps having different flow directions are driven at the same time to execute continuous pumping in the different flow directions, or to further execute periodical change in flow direction of the respective one of the first and second fluids that is being pumped; andf. at least one of the first and second pumps in a two-way pump arranged to alternatively execute pumping in different directions to periodically change the flow directions by changing a revolving direction of a power source. 13. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, wherein the first fluid transmission duct (205) has a curved, labyrinth, or vortex form and is buried in the natural heat carrier (101) to form said first heat equalizer (102). 14. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, further comprising a bypass control value (120) for controlling a flow rate of at least one of said first and second fluids. 15. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, further comprising a driving control circuit (310) for controlling a supply of electrical energy to said LED, gas state lamp structure (1031), or photovoltaic device (1032). 16. A temperature equalization system for a semiconductor application installation (103) as claimed in claim 1, further comprising a support (600) having a lower end at which said first heat equalizer (102) is disposed and from which extends a thermal conduction wing (601) for providing increase heat conduction.

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이 특허를 인용한 특허 피인용횟수: 10

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Semiconductor application installation adapted with a temperature equalization system

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Semiconductor application installation adapted with a temperature equalization system

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