IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0717282
(2010-03-04)
|
등록번호 |
US-8451600
(2013-05-28)
|
발명자
/ 주소 |
|
출원인 / 주소 |
- Amazon Technologies, Inc.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
20 인용 특허 :
8 |
초록
▼
A computer system includes a circuit board assembly and a chassis. The circuit board assembly includes a circuit board and one or more heat producing components coupled to the circuit board. At least one of the heat producing components includes an exposed surface. The chassis includes one or more m
A computer system includes a circuit board assembly and a chassis. The circuit board assembly includes a circuit board and one or more heat producing components coupled to the circuit board. At least one of the heat producing components includes an exposed surface. The chassis includes one or more mounting portions that are coupled to the circuit board and support the circuit board. The chassis also includes one or more heat spreading portions. The heat spreading portions couple to exposed surfaces of one or more heat producing components on the circuit board.
대표청구항
▼
1. A computer system, comprising: a circuit board assembly comprising: a horizontally oriented circuit board; andone or more heat producing components coupled to the horizontally oriented circuit board, at least one of the one or more heat producing components comprising one or more exposed horizont
1. A computer system, comprising: a circuit board assembly comprising: a horizontally oriented circuit board; andone or more heat producing components coupled to the horizontally oriented circuit board, at least one of the one or more heat producing components comprising one or more exposed horizontal surfaces; anda chassis comprising: a pair of opposed left and right rails configured to mount on a corresponding pair of opposed left and right rails in a rack;one or more mounting portions coupled to the horizontally oriented circuit board and configured to support the horizontally oriented circuit board in a horizontal orientation during operation of the horizontally oriented circuit board; andone or more heat spreading portions above the horizontally oriented circuit board, wherein at least one of the one or more heat spreading portions is coupled to at least one of the one or more exposed horizontal surfaces of at least one of the one or more heat producing components and configured to transfer heat away from the at least one of the one or more heat producing components,wherein the horizontally oriented circuit board is suspended from the one or more mounting portions such that the horizontally oriented circuit board is below a first heat spreading portion of the one or more heat spreading portions when the pair of opposing left and right rails of the chassis are installed on the corresponding left and right rails of the rack. 2. The computer system of claim 1, wherein a portion of the chassis is spaced from the circuit board assembly so as to form an air gap between the chassis and the circuit board assembly. 3. The computer system of claim 1, further comprising at least one air channel between a portion of the chassis and the horizontally oriented circuit board, wherein the at least one air channel is configured to allow cooling air to pass over the one or more heat producing components on the horizontally oriented circuit board. 4. The computer system of claim 3, further comprising: at least one air inlet configured to direct air from a side of the chassis opposite the horizontally oriented circuit board to pass into the at least one air channel; andat least one air exit configured to allow air to pass out of the at least one air channel. 5. The computer system of claim 1, wherein the at least one of the one or more heat spreading portions comprises a boss. 6. The computer system of claim 1, wherein the chassis further comprises one or more upper portions and one or more lower portions, wherein at least one of the one or more upper portions is spaced away from the horizontally oriented circuit board, wherein at least one of the one or more lower portions includes the at least one of the one or more heat spreading portions coupled to at least one of the one or more heat producing components. 7. The computer system of claim 6, wherein the at least one of the one or more lower portions is formed as a depression in the chassis. 8. The computer system of claim 6, wherein the at least one of the one or more heat spreading portions and at least part of at least one of the one or more upper portions that are spaced away from the horizontally oriented circuit board are produced from a single piece of material. 9. The computer system of claim 1, wherein at least one of the one or more heat spreading portions comprises a first part and a second part, wherein the first part is thicker than the second part. 10. The computer system of claim 1, wherein the chassis further comprises at least one aperture and one or more circuit boards mounted to the horizontally oriented circuit board in a vertical orientation, wherein at least a portion of at least one of the one or more circuit boards mounted to the horizontally oriented circuit board extends through the at least one aperture. 11. The computer system of claim 1, further comprising at least one resilient element configured to increase contact pressure between the at least one of the one or more heat producing components and the chassis. 12. The computer system of claim 1, wherein the one or more heat producing components coupled to the circuit board comprises a first heat producing component and a second heat producing component, wherein the one or more heat spreading portions of the chassis comprise a first heat spreading part coupled to the first heat producing component and a second heat spreading part coupled to the second heat producing component, wherein the computer system further comprises a resilient thermal interface element between the first heat producing component and the first heat spreading part. 13. The computer system of claim 12, wherein a height tolerances of the chassis at the second heat spreading portion relative to a circuit board mounting surface is tighter than a height tolerances of the chassis relative to a circuit board mounting surface at the first heat spreading portion. 14. The computer system of claim 1, wherein the at least one of the one or more exposed horizontal surfaces coupled to the at least one heat spreading portions is a top surface of one of the one or more heat producing components. 15. The computer system of claim 1, wherein the chassis comprises: a first chassis part formed from a first piece of material; anda second chassis part formed from a second piece of material, wherein the second chassis part is configured to transfer heat from at least one of the one or more heat producing components on the horizontally oriented circuit board to the first chassis part. 16. The computer system of claim 1, wherein at least a portion of a space below the first heat spreading portion and the horizontally oriented circuit board defines an air passage, wherein a height of the air passage in a first portion of the air passage is less than a height of the air passage in at least a second portion of the air passage, such that an air flow velocity in the first portion of the air passage is greater than the air flow in the at least the second portion of the air passage. 17. The computer system of claim 1, wherein at least a portion of a space below the first heat spreading portion and the horizontally oriented circuit board defines an air passage, wherein the chassis further comprises an air-directing portion configured to direct air from above the first heat spreading portion into the air passage. 18. The computer system of claim 1, further comprising at least one heat pipe coupled to the chassis, wherein the at least one heat pipe is configured to transfer heat from at least one of the one or more heat producing components on the horizontally oriented circuit board to the chassis. 19. A system, comprising: a rack;one or more computer systems mounted in the rack, wherein at least one of the one or more computer systems comprises: a circuit board assembly comprising: a horizontally oriented circuit board; andone or more heat producing components coupled to the horizontally oriented circuit board, at least one of the one or more heat producing components comprising one or more exposed horizontal surfaces; anda chassis comprising: a pair of opposed left and right rails, wherein the pair of opposing left and right rails of the chassis is coupled to a corresponding pair of opposed left and right rails in the rack;one or more mounting portions coupled to the horizontally oriented circuit board and configured to support the horizontally oriented circuit board in a horizontal orientation during operation of the horizontally oriented circuit board; andone or more heat spreading portions, wherein at least one of the one or more heat spreading portions is coupled to at least one of the one or more exposed horizontal surfaces of at least one of the one or more heat producing components and configured to transfer heat away from the at least one of the one or more heat producing components,wherein the horizontally oriented circuit board is suspended from the one or more mounting portions of the chassis, and wherein the horizontally oriented circuit board is suspended from the one or more mounting portions such that the horizontally oriented circuit board is below a first heat spreading portions of the one or more heat spreading portions the chassis. 20. The system of claim 19, further comprising at least one cooling system configured to pass air over at least one of the one or more heat producing components in at least one of the computer systems. 21. The system of claim 19, further comprising at least one power supply coupled to the rack, wherein the at least one power supply is configured to supply power to the at least one of the one or more heat producing components. 22. The system of claim 19, wherein the at least one of the one or more computer systems comprises a first computer system and a second computer system: wherein the first computer system comprises a first circuit board assembly and a first chassis coupled to the first circuit board assembly;wherein the second computer system is mounted below the first computer system, and wherein the second computer system comprises a second circuit board assembly and a second chassis coupled to the second circuit board assembly. 23. The system of claim 22, wherein the first chassis of the first computer system and the second chassis of the second computer system combine to form at least a partial EMI enclosure for the at least one of the one or more heat producing components of the second circuit board assembly. 24. The system of claim 22, wherein the first chassis of the first computer system, the second chassis of the second computer system, and at least a portion of the rack combine to form at least a partial EMI enclosure for at least one heat producing components on the second circuit board assembly. 25. A chassis for supporting, and transferring heat from, a circuit board assembly of a rack-mounted computer system, comprising: a pair of opposed left and right rails configured to mount on a corresponding pair of opposed left and right rails in a rack;one or more mounting portions configured to support a horizontally oriented circuit board of the circuit board assembly in a horizontal orientation during operation of the horizontally oriented circuit board;one or more heat spreading portions, wherein at least one of the one or more heat spreading portions is configured to couple at least one exposed horizontal surface of one or more heat producing components on the horizontally oriented circuit board of the circuit board assembly and configured to transfer heat away from at least one or more heat producing components,wherein the one or more mounting portions are configured to suspend the horizontally mounted circuit board such that the horizontally oriented circuit board is below a first heat spreading portion of the one or more heat spreading portions when the pair of opposing left and right rails of the chassis are installed on the corresponding left and right rails of a rack. 26. The chassis of claim 25, wherein the at least one of the one or more heat spreading portions comprises a boss. 27. The chassis of claim 25, wherein the chassis further comprises one or more upper portions and one or more lower portions, wherein at least one of the one or more upper portions is spaced away from a contact surface for the circuit board assembly, wherein at least one of the one or more lower portions comprises a lower heat spreading portion coupled to at least one of the one or more heat producing components. 28. The chassis of claim 27, wherein the at least one of the one or more lower portions is formed as a depression in the chassis. 29. The chassis of claim 27, wherein the at least one of the one or more upper portions is configured to transfer heat from at least one of the one or more lower portions. 30. The chassis of claim 27, wherein the at least one of the one or more heat spreading portions and at least part of at least one of the one or more upper portions that are spaced away from the horizontally oriented circuit board are produced from a single piece of material. 31. The chassis of claim 27, wherein the at least one of the one or more heat spreading portions and at least part of at least one of the one or more upper portions that are spaced away from the horizontally oriented circuit board are stamped from a single piece of metal. 32. The chassis of claim 25, wherein the at least one of the one or more heat spreading portions comprises a first portion and a second portion, wherein the first portion is thicker than the second portion.
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